KR870011273A - 비전도성 재료의 표면에 전도성 금속층을 무전해 도금하는 방법 - Google Patents

비전도성 재료의 표면에 전도성 금속층을 무전해 도금하는 방법 Download PDF

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KR870011273A
KR870011273A KR860010362A KR860010362A KR870011273A KR 870011273 A KR870011273 A KR 870011273A KR 860010362 A KR860010362 A KR 860010362A KR 860010362 A KR860010362 A KR 860010362A KR 870011273 A KR870011273 A KR 870011273A
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liquid dispersion
carbon black
conductive metal
conductive
particles
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KR860010362A
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KR910004969B1 (ko
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레니드 민튼 카알
제이 바아티이스리 앤절로
피스 메나이아 갤리니
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토마스 피이 오스
오린 헌트 스페셜티 프로덕츠 인코포레이팃드
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/422—Plated through-holes or plated via connections characterised by electroless plating method; pretreatment therefor
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/032—Materials
    • H05K2201/0323—Carbon

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemically Coating (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)

Abstract

내용 없음

Description

비전도성 재료의 표면에 전도성 금속층을 무전해 도금하는 방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (22)

  1. (a)(1) 분산액내에서 평균입자 직경이 약 3.0미크론 이하인 카아본블랙입자들;
    (2) 상기 카아본블랙과 양립될 수 있는 유효 분산량의 계면활성제; 및
    (3) 액체 분산매
    로 구성되고, 카아본블랙의 양이 실질적으로 모든 비전도성 표면을 피복시키기에 충분하고 상기 액체분산액의 약 4중량%이하인, 카아본블랙의 액체분산액을 제조하고:
    (b) 상기 액체 분산액을 비전도성 재료의 표면에 적응시키고;
    (c) 실질적으로 모든 상기 액체 분산매를 상기 카아본블랙 입자들로부터 분리시켜서, 상기 입자들이 실질적으로 연속적인 층으로 상기 비전도성 표면에 용착되게 하고;
    (d) 실질적으로 연속적인 전도성 금속층을 용착된 카아본블랙층 및 상기 비전도성 표면에 무전해도금하는;
    것으로 구성되는 비전도성 재료의 표면에 전도성 금속층을 무전해 도금하는 방법.
  2. 제1항에 있어서, 상기 액체 분산액이, 상기 액체 분산액의 pH를 약 10-14범위로 올리는데 충분한 양의 적어도 하나의 알칼리성 수산화물을 포함하여 되는 방법.
  3. 제2항에 있어서, 상기 알칼리성 수산화물이 수산화칼륨, 수산화나트륨 및 수산화암모늄으로 구성되는 군으로 부터 선택되는 방법.
  4. 제2항에 있어서, 상기 액체분산액이, 훈증실리카 입자들 및 상기 알칼리성 수산화물의 반응에 의해 형성된 알칼리성 실리케이트를 포함하여 되는 방법.
  5. 제1항에 있어서, 상기 액체 분산매가 물인 방법.
  6. 제1항에 있어서, 상기 액체 분산액이 약 10중량%이하의 고체물 구성물을 함유하는 방법.
  7. 제1항에 있어서, 상기 카아본블랙입자들의 초기 pH가 약 2-약 4인 방법.
  8. 제1항에 있어서, 상기 계면활성제가 인산에스테르 음이온 게면환성제인 방법.
  9. 제1항에 있어서, 상기 전도성 금속이 구리, 니켈, 금, 팔라듐 및 은으로 구성되는 군으로부터 선택되는 방법.
  10. 제9항에 있어서, 상기 전도성 금속이 구리인 방법.
  11. 제1항에 있어서, 상기 적응단계(b)가 비전도성 재료를 상기 액체 카아본블랙 분산액내로 침지시킴으로써 수행되는 방법.
  12. 제1항에 있어서, 상기 분리단계(c)가 용착된 분산액을 가열시킴으로써 수행되는 방법.
  13. (a)(1) 분산액내에서 평균입자 크기가 약 3.0미크론 이하인 카아본블랙 입자들;
    (2) 상기 카아본블랙과 양립할 수 있는 유효 분산량의 계면활성제;및
    (3) 액체 분산매
    로 구성하고, 카아본블랙의 양이 실질적으로 모든 비전도성 표면을 피복시키기에 충분하고 상기 액체분산액의 약 4중량% 이하인, 카아본블랙의 액체 분산액으로 관통구멍들을 갖는 인쇄배선기판을 접촉시키고;
    (b) 실질적으로 모든 액체 분산매를 상기 분산액으로 부터 분리시켜서 상기 카아본블랙 입자들을 실질적으로 연속적인 층으로 상기 구멍벽들의 상기 비전도성 부분에 용착시키고;
    (c) 실질적으로 연속적인 제1의 금속층을 구멍벽들의 상기, 비전도성 부분에 용착된 카아본블랙층에 무전해금속 도금기술에 의해서 적용시키고;
    (d) 실질적으로 연속적인 제2의 금속응을 제1의 실질적으로 연속적인 전도성 금속층에 전기도금하는;
    단계들로 구성되는 적어도 2개의 분리된 전도성 금속층들에 적층된 적어도 하나의 비전도성 층으로 구성된 적층된 인쇄배선 기판내의 관통구멍벽들을 전기도금하는 방법.
  14. 제13항에 있어서, 상기 액체 분산액이, 상기 액체분산액의 pH를 약 10-14범위로 올리는데 충분한 양의 적어도 하나의 알칼리성 수산화물을 포함하여 되는 방법.
  15. 제14항에 있어서, 상기 액체 분산액이, 훈증실리카 입자들 상기 알칼리성 수산화물의 반응에 의해 형성된 알칼리성 실리케이트를 포함하여 되는 방법.
  16. 제15항에 있어서, 상기 액체 분산액이 약 10중량%이하의 고체물 구성물을 함유하는 방법.
  17. 제13항에 있어서, 상기 카아본블랙 입자들으 초기 pH가 약 2-약 4인 방법.
  18. 제13항에 있어서, 상기 계면활성제가 인산에스테르 음이온 계면활성제인 방법.
  19. 제13항에 있어서, 상기 전도성 금속이 구리인 방법.
  20. 제13항에 있어서, 상기 액체 분산매가 물인 방법.
  21. 제13항에 있어서, 상기 방법이, 단계(b)후 및 단계(c)전에 상기 인쇄배선 기관의 상기 금속층들을 마이크로 에칭하여 그로부터 임의의 용착된 카아본블랙을 제거시키는 것을 포함하여 되는 방법.
  22. 제21항에 있어서, 상기 방법이 상기 마이크로에칭후 물수세를 포함하여 되는 방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019860010362A 1986-05-05 1986-12-04 비전도성 재료의 표면에 전도성 금속층을 무전해 도금하는 방법. KR910004969B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US859,672 1986-05-05
US859.672 1986-05-05
US06/859,672 US4631117A (en) 1985-05-06 1986-05-05 Electroless plating process

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KR870011273A true KR870011273A (ko) 1987-12-22
KR910004969B1 KR910004969B1 (ko) 1991-07-20

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KR1019860010362A KR910004969B1 (ko) 1986-05-05 1986-12-04 비전도성 재료의 표면에 전도성 금속층을 무전해 도금하는 방법.

Country Status (7)

Country Link
US (1) US4631117A (ko)
EP (1) EP0244535B1 (ko)
JP (1) JPS62260068A (ko)
KR (1) KR910004969B1 (ko)
DE (1) DE3672284D1 (ko)
HK (1) HK99890A (ko)
SG (1) SG83490G (ko)

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SG83490G (en) 1990-11-23
EP0244535B1 (en) 1990-06-27
HK99890A (en) 1990-12-07
JPS62260068A (ja) 1987-11-12
JPH031381B2 (ko) 1991-01-10
EP0244535A1 (en) 1987-11-11
US4631117A (en) 1986-12-23
KR910004969B1 (ko) 1991-07-20
DE3672284D1 (de) 1990-08-02

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