KR840008466A - 절연성이 있는 필름의 금속화 방법 - Google Patents

절연성이 있는 필름의 금속화 방법 Download PDF

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Publication number
KR840008466A
KR840008466A KR1019840001991A KR840001991A KR840008466A KR 840008466 A KR840008466 A KR 840008466A KR 1019840001991 A KR1019840001991 A KR 1019840001991A KR 840001991 A KR840001991 A KR 840001991A KR 840008466 A KR840008466 A KR 840008466A
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KR
South Korea
Prior art keywords
film
light
borohydride
electrolyte
ability
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KR1019840001991A
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English (en)
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KR910010147B1 (ko
Inventor
카사 로베르뜨
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로게르 리오브레어
롱쁠랑 르쉐르시
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Publication of KR840008466A publication Critical patent/KR840008466A/ko
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Publication of KR910010147B1 publication Critical patent/KR910010147B1/ko

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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/54—Electroplating of non-metallic surfaces
    • C25D5/56—Electroplating of non-metallic surfaces of plastics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/188—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by direct electroplating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
    • Y10T428/12556—Organic component
    • Y10T428/12569—Synthetic resin
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31721—Of polyimide

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electrochemistry (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Chemically Coating (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Burglar Alarm Systems (AREA)
  • General Induction Heating (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)

Abstract

내용 없음.

Description

절연성이 있는 필름의 금속화 방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (11)

  1. (1) 비전도체인 금속 산화물과 중합체와의 클로이돈 상 균일 혼합물의 농도를 20 내지 60%로 하고, (2) 필름을 부차 및 연신하고 (3) 보로하이드라이드의 염을 첨가하여 금속 산화물을 금속으로 당량적 환원시키므로써 표면 전기 전도체를 수득하고 (4) 전해질 용액내에서 금속화된 표면을 견고하게 부착시킴을 특징으로 하는, 방향성 이미드나 아마이드 화합물의 중합체를 전기 단열성의 우연성이 있는 필름으로 금속화하는 방법.
  2. 제1항에 있어서, 중합체가 방향족 폴리이미드 또는 방향족 폴리이미드 아마이드 또는 방향족 폴리 아미드인 방법.
  3. 제1항에 있어서, 금속 산화물이 산화 구리인 방법.
  4. 제1항에 있어서, 보로하이드라이드의 염이 비치환된 보로하이드라이드 또는 수소에 다른 치환체가 치환된 보로하이드라이드인 방법.
  5. 제1항에 있어서, 환원제의 혼합용액이 농도가 0.05 내지 1%인 물 또는 물과 적당한 농도의 중성의 극성용매의 균일한 혼합수용액인 방법.
  6. 제1항에 있어서, 생성된 필름의 표면을 묽은산에 의해 연금에 필요한 적당한 방법으로 처리하는 방법.
  7. 제1항에 있어서, 필름 표면의 금속 처리과정에서 입자의 크기가 1마이크론 이상의 두께를 가지도록 하는 방법.
  8. 제1항에 있어서, 금속화된 필름이 a) 수득된 전기 전도체의 성질에 의해 필름의 광에 대한 저항 능력을 감소시키거나, b) 광에 대한 저항 능력을 증가시키거나 c) 직접적으로 전해질을 취득하거나 d) 광에 대한 저항력을 소멸시키거나 e) 비선택적인 제판에 이용되는 방법.
  9. 제7항에 있어서, 주석-납 합금의 전해질 용액이 그의 전해질로서의 능력을 적당한 방법에 의해 다시 되찾을 수 있으며 광저항 능력을 상실한 것인 방법.
  10. 제1항에 있어서, 특정한 회로내에서의 교차점이 필름의 회로 내부에서 수득됨에 따라 광에 대한 저항능력이 현상 도중에 감소되었다가 전해질 용액내에서 다시 재생됨으로써 수득된 광에 대한 저항 능력을 상실한 전해질을 비선택적인 제판 과정에 사용하는 방법.
  11. 제1항에 있어서, 필름에 관한 과정에서 수득된 최종 또는 중간 물질이 이 범위에 속하는 방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019840001991A 1983-04-15 1984-04-14 전기 절연성 가요성(flexibility)필름의 금속화 방법 KR910010147B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
FR8306404A FR2544340A1 (fr) 1983-04-15 1983-04-15 Procede de metallisation de films souples electriquement isolants en matiere plastique thermostable et articles obtenus
FR83-06404 1983-04-15
FR8306404 1983-04-15

Publications (2)

Publication Number Publication Date
KR840008466A true KR840008466A (ko) 1984-12-15
KR910010147B1 KR910010147B1 (ko) 1991-12-17

Family

ID=9288008

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019840001991A KR910010147B1 (ko) 1983-04-15 1984-04-14 전기 절연성 가요성(flexibility)필름의 금속화 방법

Country Status (13)

Country Link
US (1) US4565606A (ko)
EP (1) EP0126014B1 (ko)
JP (1) JPS6036666A (ko)
KR (1) KR910010147B1 (ko)
AT (1) ATE31088T1 (ko)
AU (1) AU572132B2 (ko)
CA (1) CA1237092A (ko)
DE (1) DE3467780D1 (ko)
ES (2) ES8505421A1 (ko)
FR (1) FR2544340A1 (ko)
IE (1) IE55467B1 (ko)
IL (1) IL71543A (ko)
ZA (1) ZA842726B (ko)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2544341A1 (fr) * 1983-04-15 1984-10-19 Rhone Poulenc Rech Procede de metallisation de films souples electriquement isolants et articles obtenus
FR2566611A1 (fr) * 1984-06-25 1985-12-27 Rhone Poulenc Rech Nouveaux circuits imprimes injectes et procede d'obtention
US4910072A (en) * 1986-11-07 1990-03-20 Monsanto Company Selective catalytic activation of polymeric films
US4761303A (en) * 1986-11-10 1988-08-02 Macdermid, Incorporated Process for preparing multilayer printed circuit boards
US4868071A (en) * 1987-02-24 1989-09-19 Polyonics Corporation Thermally stable dual metal coated laminate products made from textured polyimide film
US4842946A (en) * 1987-09-28 1989-06-27 General Electric Company Method for treating a polyimide surface to improve the adhesion of metal deposited thereon, and articles produced thereby
JPH0713304B2 (ja) * 1987-12-14 1995-02-15 日立化成工業株式会社 銅の表面処理法
US5242713A (en) * 1988-12-23 1993-09-07 International Business Machines Corporation Method for conditioning an organic polymeric material
US4992059A (en) * 1989-12-01 1991-02-12 Westinghouse Electric Corp. Ultra fine line cable and a method for fabricating the same
EP0460548A3 (en) * 1990-06-08 1993-03-24 Amp-Akzo Corporation Printed circuits and base materials precatalyzed for etal deposition
US5162144A (en) * 1991-08-01 1992-11-10 Motorola, Inc. Process for metallizing substrates using starved-reaction metal-oxide reduction
US6203859B1 (en) * 1993-09-24 2001-03-20 Optimum Air Corporation Method of drying substrates and use thereof
US6518198B1 (en) * 2000-08-31 2003-02-11 Micron Technology, Inc. Electroless deposition of doped noble metals and noble metal alloys
US8366901B2 (en) * 2006-09-07 2013-02-05 Enthone Inc. Deposition of conductive polymer and metallization of non-conductive substrates
DE102010012204B4 (de) 2010-03-19 2019-01-24 MacDermid Enthone Inc. (n.d.Ges.d. Staates Delaware) Verbessertes Verfahren zur Direktmetallisierung von nicht leitenden Substraten

Family Cites Families (7)

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US3551304A (en) * 1965-07-12 1970-12-29 Bausch & Lomb Method for producing a composite article
US3558441A (en) * 1968-11-01 1971-01-26 Int Electronic Res Corp Method of making a metal core printed circuit board
US3619382A (en) * 1970-01-27 1971-11-09 Gen Electric Process of reducing metal compounds to metal in a matrix
DE2101049A1 (de) * 1971-01-11 1972-08-03 Siemens Ag Verfahren zur vorzugsweise beidseitigen Beschichtung von Kunststoffolien mit .Metall
DE2623695C2 (de) * 1976-05-26 1984-06-20 Mitsui Toatsu Chemicals, Inc., Tokio/Tokyo Verfahren zur Herstellung eines leitfähigen, gehärteten Produktes
AU548674B2 (en) * 1978-02-28 1986-01-02 Eurographics Holdings N.V. Metallization process
FR2518126B1 (fr) * 1981-12-14 1986-01-17 Rhone Poulenc Spec Chim Procede de metallisation d'articles electriquement isolants en matiere plastique et les articles intermediaires et finis obtenus selon ce procede

Also Published As

Publication number Publication date
IE840921L (en) 1984-10-15
AU572132B2 (en) 1988-05-05
ES8606538A1 (es) 1986-04-01
JPS6036666A (ja) 1985-02-25
FR2544340A1 (fr) 1984-10-19
AU2680184A (en) 1985-10-24
IL71543A0 (en) 1984-07-31
ZA842726B (en) 1984-11-28
US4565606A (en) 1986-01-21
EP0126014B1 (fr) 1987-11-25
DE3467780D1 (en) 1988-01-07
IL71543A (en) 1987-09-16
KR910010147B1 (ko) 1991-12-17
CA1237092A (fr) 1988-05-24
EP0126014A1 (fr) 1984-11-21
ATE31088T1 (de) 1987-12-15
ES531590A0 (es) 1985-05-16
ES8505421A1 (es) 1985-05-16
ES539959A0 (es) 1986-04-01
IE55467B1 (en) 1990-09-26

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