ES8606538A1 - Procedimiento de fabricacion de circuitos impresos - Google Patents
Procedimiento de fabricacion de circuitos impresosInfo
- Publication number
- ES8606538A1 ES8606538A1 ES539959A ES539959A ES8606538A1 ES 8606538 A1 ES8606538 A1 ES 8606538A1 ES 539959 A ES539959 A ES 539959A ES 539959 A ES539959 A ES 539959A ES 8606538 A1 ES8606538 A1 ES 8606538A1
- Authority
- ES
- Spain
- Prior art keywords
- electrically conductive
- oxide particles
- metal oxide
- thermally stable
- electrically insulating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/54—Electroplating of non-metallic surfaces
- C25D5/56—Electroplating of non-metallic surfaces of plastics
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/188—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by direct electroplating
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
- Y10T428/12556—Organic component
- Y10T428/12569—Synthetic resin
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31721—Of polyimide
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electrochemistry (AREA)
- Mechanical Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Laminated Bodies (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Chemically Coating (AREA)
- Electroplating Methods And Accessories (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Burglar Alarm Systems (AREA)
- General Induction Heating (AREA)
Abstract
PROCEDIMIENTO PARA LA FABRICACION DE CIRCUITOS IMPRESOS, POR APLICACION DE DEPOSITOS METALICOS. COMPRENDE LAS SIGUIENTES OPERACIONES: PRIMERA, SE PREPARA UN COLODION FILMOGENO DE UN POLIMERO CON GRUPOS IMIDAS O AMIDAS AROMATICAS Y SE CONFORMA LA PELICULA SEGUN LOS PROCEDIMIENTOS CLASICOS; SEGUNDA, SE REDUCE CUANTITATIVAMENTE EL OXIDO METALICO CONTENIDO EN LA SUPERFICIE DE LA PELICULA, A METAL, MEDIANTE TRATAMIENTO CON UN BOROHIDRURO, PARA OBTENER UNA SUPERFICIE CONDUCTORA DE LA ELECTRICIDAD; TERCERA, SE REFUERZA ELECTROLITICAMENTE LA SUPERFICIE METALICA OBTENIDA MEDIANTE UNA CAPA METALICA Y A CONTINUACION SE LA REVISTE CON UNA FOTORRESERVA; CUARTA, SE REVELA LA FOTORRESERVA Y SE LA REFUERZA ELECTROLITICAMENTE; Y POR ULTIMO, SE ELIMINA LA FOTORRESERVA Y SE GRABA DE MANERA NO SELECTIVA LASUPERFICIE DE LA PELICULA.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR8306404A FR2544340A1 (fr) | 1983-04-15 | 1983-04-15 | Procede de metallisation de films souples electriquement isolants en matiere plastique thermostable et articles obtenus |
Publications (2)
Publication Number | Publication Date |
---|---|
ES8606538A1 true ES8606538A1 (es) | 1986-04-01 |
ES539959A0 ES539959A0 (es) | 1986-04-01 |
Family
ID=9288008
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES531590A Granted ES531590A0 (es) | 1983-04-15 | 1984-04-13 | Procedimiento de preparacion de peliculas flexibles, electricamente aislantes en todo su espesor y metalizadas en su superficie. |
ES539959A Expired ES8606538A1 (es) | 1983-04-15 | 1985-01-30 | Procedimiento de fabricacion de circuitos impresos |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES531590A Granted ES531590A0 (es) | 1983-04-15 | 1984-04-13 | Procedimiento de preparacion de peliculas flexibles, electricamente aislantes en todo su espesor y metalizadas en su superficie. |
Country Status (13)
Country | Link |
---|---|
US (1) | US4565606A (es) |
EP (1) | EP0126014B1 (es) |
JP (1) | JPS6036666A (es) |
KR (1) | KR910010147B1 (es) |
AT (1) | ATE31088T1 (es) |
AU (1) | AU572132B2 (es) |
CA (1) | CA1237092A (es) |
DE (1) | DE3467780D1 (es) |
ES (2) | ES531590A0 (es) |
FR (1) | FR2544340A1 (es) |
IE (1) | IE55467B1 (es) |
IL (1) | IL71543A (es) |
ZA (1) | ZA842726B (es) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2544341A1 (fr) * | 1983-04-15 | 1984-10-19 | Rhone Poulenc Rech | Procede de metallisation de films souples electriquement isolants et articles obtenus |
FR2566611A1 (fr) * | 1984-06-25 | 1985-12-27 | Rhone Poulenc Rech | Nouveaux circuits imprimes injectes et procede d'obtention |
US4910072A (en) * | 1986-11-07 | 1990-03-20 | Monsanto Company | Selective catalytic activation of polymeric films |
US4761303A (en) * | 1986-11-10 | 1988-08-02 | Macdermid, Incorporated | Process for preparing multilayer printed circuit boards |
US4868071A (en) * | 1987-02-24 | 1989-09-19 | Polyonics Corporation | Thermally stable dual metal coated laminate products made from textured polyimide film |
US4842946A (en) * | 1987-09-28 | 1989-06-27 | General Electric Company | Method for treating a polyimide surface to improve the adhesion of metal deposited thereon, and articles produced thereby |
JPH0713304B2 (ja) * | 1987-12-14 | 1995-02-15 | 日立化成工業株式会社 | 銅の表面処理法 |
US5242713A (en) * | 1988-12-23 | 1993-09-07 | International Business Machines Corporation | Method for conditioning an organic polymeric material |
US4992059A (en) * | 1989-12-01 | 1991-02-12 | Westinghouse Electric Corp. | Ultra fine line cable and a method for fabricating the same |
EP0460548A3 (en) * | 1990-06-08 | 1993-03-24 | Amp-Akzo Corporation | Printed circuits and base materials precatalyzed for etal deposition |
US5162144A (en) * | 1991-08-01 | 1992-11-10 | Motorola, Inc. | Process for metallizing substrates using starved-reaction metal-oxide reduction |
US6203859B1 (en) * | 1993-09-24 | 2001-03-20 | Optimum Air Corporation | Method of drying substrates and use thereof |
US6518198B1 (en) | 2000-08-31 | 2003-02-11 | Micron Technology, Inc. | Electroless deposition of doped noble metals and noble metal alloys |
TWI410530B (zh) * | 2006-09-07 | 2013-10-01 | Enthone | 導電聚合物的沈積與非導電基板的金屬化 |
DE102010012204B4 (de) | 2010-03-19 | 2019-01-24 | MacDermid Enthone Inc. (n.d.Ges.d. Staates Delaware) | Verbessertes Verfahren zur Direktmetallisierung von nicht leitenden Substraten |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3551304A (en) * | 1965-07-12 | 1970-12-29 | Bausch & Lomb | Method for producing a composite article |
US3558441A (en) * | 1968-11-01 | 1971-01-26 | Int Electronic Res Corp | Method of making a metal core printed circuit board |
US3619382A (en) * | 1970-01-27 | 1971-11-09 | Gen Electric | Process of reducing metal compounds to metal in a matrix |
DE2101049A1 (de) * | 1971-01-11 | 1972-08-03 | Siemens Ag | Verfahren zur vorzugsweise beidseitigen Beschichtung von Kunststoffolien mit .Metall |
DE2623695C2 (de) * | 1976-05-26 | 1984-06-20 | Mitsui Toatsu Chemicals, Inc., Tokio/Tokyo | Verfahren zur Herstellung eines leitfähigen, gehärteten Produktes |
AU548674B2 (en) * | 1978-02-28 | 1986-01-02 | Eurographics Holdings N.V. | Metallization process |
FR2518126B1 (fr) * | 1981-12-14 | 1986-01-17 | Rhone Poulenc Spec Chim | Procede de metallisation d'articles electriquement isolants en matiere plastique et les articles intermediaires et finis obtenus selon ce procede |
-
1983
- 1983-04-15 FR FR8306404A patent/FR2544340A1/fr active Pending
-
1984
- 1984-04-03 EP EP19840420060 patent/EP0126014B1/fr not_active Expired
- 1984-04-03 AT AT84420060T patent/ATE31088T1/de not_active IP Right Cessation
- 1984-04-03 DE DE8484420060T patent/DE3467780D1/de not_active Expired
- 1984-04-12 ZA ZA842726A patent/ZA842726B/xx unknown
- 1984-04-13 IL IL7154384A patent/IL71543A/xx not_active IP Right Cessation
- 1984-04-13 AU AU26801/84A patent/AU572132B2/en not_active Expired
- 1984-04-13 CA CA000452028A patent/CA1237092A/fr not_active Expired
- 1984-04-13 IE IE921/84A patent/IE55467B1/en not_active IP Right Cessation
- 1984-04-13 ES ES531590A patent/ES531590A0/es active Granted
- 1984-04-14 KR KR1019840001991A patent/KR910010147B1/ko not_active IP Right Cessation
- 1984-04-16 US US06/600,457 patent/US4565606A/en not_active Expired - Lifetime
- 1984-04-16 JP JP59075184A patent/JPS6036666A/ja active Pending
-
1985
- 1985-01-30 ES ES539959A patent/ES8606538A1/es not_active Expired
Also Published As
Publication number | Publication date |
---|---|
AU572132B2 (en) | 1988-05-05 |
DE3467780D1 (en) | 1988-01-07 |
IE55467B1 (en) | 1990-09-26 |
IL71543A0 (en) | 1984-07-31 |
KR910010147B1 (ko) | 1991-12-17 |
JPS6036666A (ja) | 1985-02-25 |
EP0126014A1 (fr) | 1984-11-21 |
CA1237092A (fr) | 1988-05-24 |
ATE31088T1 (de) | 1987-12-15 |
IL71543A (en) | 1987-09-16 |
IE840921L (en) | 1984-10-15 |
ES8505421A1 (es) | 1985-05-16 |
ES531590A0 (es) | 1985-05-16 |
AU2680184A (en) | 1985-10-24 |
ZA842726B (en) | 1984-11-28 |
US4565606A (en) | 1986-01-21 |
EP0126014B1 (fr) | 1987-11-25 |
KR840008466A (ko) | 1984-12-15 |
FR2544340A1 (fr) | 1984-10-19 |
ES539959A0 (es) | 1986-04-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
FD1A | Patent lapsed |
Effective date: 20051221 |