KR870011272A - 중합체 표면상에 금속을 증착시키는 방법 - Google Patents

중합체 표면상에 금속을 증착시키는 방법 Download PDF

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KR870011272A
KR870011272A KR870004337A KR870004337A KR870011272A KR 870011272 A KR870011272 A KR 870011272A KR 870004337 A KR870004337 A KR 870004337A KR 870004337 A KR870004337 A KR 870004337A KR 870011272 A KR870011272 A KR 870011272A
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polymer
ions
metal
negatively charged
solution
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KR870004337A
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KR950000013B1 (ko
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조셉 크라우스 래리
앤드루우 라이더 잭
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도날드 밀러 셀
미네소타 마이닝 앤드 매뉴팩츄어링 컴퍼니
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Publication of KR870011272A publication Critical patent/KR870011272A/ko
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/52—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating using reducing agents for coating with metallic material not provided for in a single one of groups C23C18/32 - C23C18/50

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemically Coating (AREA)
  • Laminated Bodies (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Polyoxymethylene Polymers And Polymers With Carbon-To-Carbon Bonds (AREA)

Abstract

내용 없음

Description

중합체 표면상에 금속을 증착시키는 방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (14)

  1. 모든 음전하 주입 이온중 적어도 10몰%가 단일 또는 착화의 음전하 주입이온인 제1용액과 전기활성자리를 지닌 적어도 하나의 중합체 표면을 접촉시켜 적어도 하나의 중합체 표면상에서 금속의 도금이거의 없는 적어도 하나의 중합체 표면상의 중합체를 환원시키고, 적어도 한표면의 환원된 중합체를 환원성 금속 양이온을 지닌 제2용액과 접촉시켜 적어도 하나의 중합체 표면상의 금속입자로 구성되는 그룹으로 부터 선택된 금속형태를 형성하도록 금속 이온을 환원시키는 단계로 구성되는 전기활성 자리를 지닌 적어도 하나의 중합체 표면상에 금속층을 증착시키는 방법.
  2. 제1항에 있어서, 상기 단일 또는 착화 음전하 주입 이온은 상기 제1용액에 모든 음전하 주입 이온중 적어도 60몰% 함유되는 것을 특징으로 하는 방법.
  3. 제1항에 있어서, 상기 단일 또는 착화 음전하 주입 이온은 상기 제1용액에 모든 음전하 주입 이온중 적어도 90몰% 함유되는 것을 특징으로 하는 방법.
  4. 제1항에 있어서, 상기 단일 또는 착화 음전하 주입 이온은 상기 제1용액에 모든 음전하 주입 이온중 적어도 100몰% 함유되는 것을 특징으로 하는 방법.
  5. 제1항, 제2항, 제3항 또는 제4항에 있어서, 상기 이온은 단이온 또는 전이금속 착화물서 존재하는 것을 특징으로 하는 방법.
  6. 제1항, 제2항, 제3항 또는 제4항에 있어서, 상기 이온은 Te2-이온 및 Co(Ⅰ) 및 V(Ⅱ)착화물로 부터 선택되는 것을 특징으로 하는 방법.
  7. 제5항에 있어서, 금속입자는 상기 적어도 하나의 금속 표면의 중합체내에 증착되는 것을 특징으로 하는 방법.
  8. 제7항에 있어서, 상기 금속 입자는 1마이크론 이상의 깊이로 증착되는 것을 특징으로 하는 방법.
  9. 제5항에 있어서, 금속입자는 적어도 하나의 중합체 표면의 중합체내에 증착되는 것을 특징으로 하는 방법.
  10. 제5항에 있어서,적어도 하나의 중합에 표면의 중합체는 이미드 전기활성 자리를 함유하는 것을 특징으로 하는 방법.
  11. 제5항에 있어서,적어도 하나의 중합에 표면의 중합체는 피로멜리티미드 전기활성 자리를 함유하는 것을 특징으로 하는 방법.
  12. 제5항에 있어서,적어도 하나의 중합에 표면의 중합체는 폴리이미드인 것을 특징으로 하는 방법.
  13. 제5항에 있어서,적어도 25%의 환원된 중합체가 금속을 형성하도록 금속 이온에 의해 산화된 후 제2금속화가 시작되는 것을 특징으로 하는 방법.
  14. 제5항에 있어서, 거의 모든 환원된 중합체가 금속을 형성하도록 금속이온에 의해 산화된 후 제2금속화가 시작되는 것을 특징으로 하는 방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019870004337A 1986-05-05 1987-05-04 중합체 표면상에 금속층을 침착시키는 방법 KR950000013B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US06/859,471 US4710403A (en) 1986-05-05 1986-05-05 Metallized polymers
US859471 1986-05-05
US859,471 1986-05-05

Publications (2)

Publication Number Publication Date
KR870011272A true KR870011272A (ko) 1987-12-22
KR950000013B1 KR950000013B1 (ko) 1995-01-07

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KR1019870004337A KR950000013B1 (ko) 1986-05-05 1987-05-04 중합체 표면상에 금속층을 침착시키는 방법

Country Status (14)

Country Link
US (1) US4710403A (ko)
EP (1) EP0245016B1 (ko)
JP (1) JPS62267474A (ko)
KR (1) KR950000013B1 (ko)
CN (1) CN1013771B (ko)
AR (1) AR243916A1 (ko)
AU (1) AU591767B2 (ko)
BR (1) BR8702230A (ko)
CA (1) CA1266592A (ko)
DE (1) DE3787312T2 (ko)
ES (1) ES2058110T3 (ko)
HK (1) HK65394A (ko)
MX (1) MX165052B (ko)
MY (1) MY102300A (ko)

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US5399425A (en) * 1988-07-07 1995-03-21 E. I. Du Pont De Nemours And Company Metallized polymers
US5135779A (en) * 1988-12-23 1992-08-04 International Business Machines Corporation Method for conditioning an organic polymeric material
US5242713A (en) * 1988-12-23 1993-09-07 International Business Machines Corporation Method for conditioning an organic polymeric material
US4975327A (en) 1989-07-11 1990-12-04 Minnesota Mining And Manufacturing Company Polyimide substrate having a textured surface and metallizing such a substrate
US5032467A (en) * 1989-09-22 1991-07-16 Minnesota Mining And Manufacturing Company Process for electroplating electroactive polymers and articles derived therefrom
US5015538A (en) * 1989-09-22 1991-05-14 Minnesota Mining And Manufacturing Company Process for pulse electroplating electroactive polymers and articles derived therefrom
US5021129A (en) * 1989-09-25 1991-06-04 International Business Machines Corporation Multilayer structures of different electroactive materials and methods of fabrication thereof
JP2775647B2 (ja) * 1989-11-17 1998-07-16 宇部興産株式会社 メタライズドポリイミドフィルムの製法
JP2524436B2 (ja) * 1990-09-18 1996-08-14 インターナショナル・ビジネス・マシーンズ・コーポレイション 表面処理方法
JP2768390B2 (ja) * 1990-12-11 1998-06-25 インターナショナル・ビジネス・マシーンズ・コーポレイション 無電解金属付着のために基体をコンディショニングする方法
US5264248A (en) * 1992-08-03 1993-11-23 General Electric Company Adhesion of metal coatings of polypyromellitimides
US6099939A (en) * 1995-04-13 2000-08-08 International Business Machines Corporation Enhanced adhesion between a vapor deposited metal and an organic polymer surface exhibiting tailored morphology
US7048716B1 (en) 1997-05-15 2006-05-23 Stanford University MR-compatible devices
US6272370B1 (en) 1998-08-07 2001-08-07 The Regents Of University Of Minnesota MR-visible medical device for neurological interventions using nonlinear magnetic stereotaxis and a method imaging
US6141870A (en) 1997-08-04 2000-11-07 Peter K. Trzyna Method for making electrical device
US6463317B1 (en) 1998-05-19 2002-10-08 Regents Of The University Of Minnesota Device and method for the endovascular treatment of aneurysms
US6783645B2 (en) 2001-12-18 2004-08-31 Dionex Corporation Disposable working electrode for an electrochemical cell
JP4135887B2 (ja) * 2002-09-12 2008-08-20 独立行政法人科学技術振興機構 金属微粒子分散高分子およびその製造方法、並びにその製造に用いる金属イオン含有高分子およびその製造方法
CN103966549A (zh) * 2014-05-07 2014-08-06 哈尔滨工业大学 一种图案化电致变色聚苯胺薄膜的制备方法

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US4459330A (en) * 1982-09-20 1984-07-10 The United States Of America As Represented By The United States Department Of Energy Electroless metal plating of plastics
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US4512855A (en) * 1984-07-23 1985-04-23 E. I. Du Pont De Nemours And Company Deposition of metals as interlayers within organic polymeric films

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Publication number Publication date
CN1013771B (zh) 1991-09-04
EP0245016B1 (en) 1993-09-08
JPS62267474A (ja) 1987-11-20
HK65394A (en) 1994-07-15
MX165052B (es) 1992-10-20
KR950000013B1 (ko) 1995-01-07
BR8702230A (pt) 1988-02-17
US4710403A (en) 1987-12-01
EP0245016A2 (en) 1987-11-11
CA1266592A (en) 1990-03-13
CN87103276A (zh) 1988-01-20
ES2058110T3 (es) 1994-11-01
DE3787312D1 (de) 1993-10-14
EP0245016A3 (en) 1988-12-07
AU591767B2 (en) 1989-12-14
AU7131987A (en) 1987-11-12
AR243916A1 (es) 1993-09-30
MY102300A (en) 1992-05-28
DE3787312T2 (de) 1994-03-24

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