HK65394A - Metallized polymers - Google Patents

Metallized polymers

Info

Publication number
HK65394A
HK65394A HK65394A HK65394A HK65394A HK 65394 A HK65394 A HK 65394A HK 65394 A HK65394 A HK 65394A HK 65394 A HK65394 A HK 65394A HK 65394 A HK65394 A HK 65394A
Authority
HK
Hong Kong
Prior art keywords
metallized polymers
metallized
polymers
Prior art date
Application number
HK65394A
Other languages
English (en)
Inventor
Larry J Krause
Jack A Rider
Original Assignee
Minnesota Mining & Mfg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Minnesota Mining & Mfg filed Critical Minnesota Mining & Mfg
Publication of HK65394A publication Critical patent/HK65394A/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/52—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating using reducing agents for coating with metallic material not provided for in a single one of groups C23C18/32 - C23C18/50

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemically Coating (AREA)
  • Laminated Bodies (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Polyoxymethylene Polymers And Polymers With Carbon-To-Carbon Bonds (AREA)
HK65394A 1986-05-05 1994-07-07 Metallized polymers HK65394A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/859,471 US4710403A (en) 1986-05-05 1986-05-05 Metallized polymers

Publications (1)

Publication Number Publication Date
HK65394A true HK65394A (en) 1994-07-15

Family

ID=25331008

Family Applications (1)

Application Number Title Priority Date Filing Date
HK65394A HK65394A (en) 1986-05-05 1994-07-07 Metallized polymers

Country Status (14)

Country Link
US (1) US4710403A (ko)
EP (1) EP0245016B1 (ko)
JP (1) JPS62267474A (ko)
KR (1) KR950000013B1 (ko)
CN (1) CN1013771B (ko)
AR (1) AR243916A1 (ko)
AU (1) AU591767B2 (ko)
BR (1) BR8702230A (ko)
CA (1) CA1266592A (ko)
DE (1) DE3787312T2 (ko)
ES (1) ES2058110T3 (ko)
HK (1) HK65394A (ko)
MX (1) MX165052B (ko)
MY (1) MY102300A (ko)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4775556A (en) * 1986-08-05 1988-10-04 Minnesota Mining And Manufacturing Company Process for metallized imaging
US4900618A (en) * 1986-11-07 1990-02-13 Monsanto Company Oxidation-resistant metal coatings
US5399425A (en) * 1988-07-07 1995-03-21 E. I. Du Pont De Nemours And Company Metallized polymers
US5024858A (en) * 1988-07-07 1991-06-18 E. I. Du Pont De Nemours And Company Metallized polymers and method
US5135779A (en) * 1988-12-23 1992-08-04 International Business Machines Corporation Method for conditioning an organic polymeric material
US5242713A (en) * 1988-12-23 1993-09-07 International Business Machines Corporation Method for conditioning an organic polymeric material
US4975327A (en) 1989-07-11 1990-12-04 Minnesota Mining And Manufacturing Company Polyimide substrate having a textured surface and metallizing such a substrate
US5015538A (en) * 1989-09-22 1991-05-14 Minnesota Mining And Manufacturing Company Process for pulse electroplating electroactive polymers and articles derived therefrom
US5032467A (en) * 1989-09-22 1991-07-16 Minnesota Mining And Manufacturing Company Process for electroplating electroactive polymers and articles derived therefrom
US5021129A (en) * 1989-09-25 1991-06-04 International Business Machines Corporation Multilayer structures of different electroactive materials and methods of fabrication thereof
JP2775647B2 (ja) * 1989-11-17 1998-07-16 宇部興産株式会社 メタライズドポリイミドフィルムの製法
JP2524436B2 (ja) * 1990-09-18 1996-08-14 インターナショナル・ビジネス・マシーンズ・コーポレイション 表面処理方法
JP2768390B2 (ja) * 1990-12-11 1998-06-25 インターナショナル・ビジネス・マシーンズ・コーポレイション 無電解金属付着のために基体をコンディショニングする方法
US5264248A (en) * 1992-08-03 1993-11-23 General Electric Company Adhesion of metal coatings of polypyromellitimides
US6099939A (en) * 1995-04-13 2000-08-08 International Business Machines Corporation Enhanced adhesion between a vapor deposited metal and an organic polymer surface exhibiting tailored morphology
US6272370B1 (en) 1998-08-07 2001-08-07 The Regents Of University Of Minnesota MR-visible medical device for neurological interventions using nonlinear magnetic stereotaxis and a method imaging
US7048716B1 (en) 1997-05-15 2006-05-23 Stanford University MR-compatible devices
US6141870A (en) 1997-08-04 2000-11-07 Peter K. Trzyna Method for making electrical device
US6463317B1 (en) 1998-05-19 2002-10-08 Regents Of The University Of Minnesota Device and method for the endovascular treatment of aneurysms
US6783645B2 (en) * 2001-12-18 2004-08-31 Dionex Corporation Disposable working electrode for an electrochemical cell
JP4135887B2 (ja) * 2002-09-12 2008-08-20 独立行政法人科学技術振興機構 金属微粒子分散高分子およびその製造方法、並びにその製造に用いる金属イオン含有高分子およびその製造方法
CN103966549A (zh) * 2014-05-07 2014-08-06 哈尔滨工业大学 一种图案化电致变色聚苯胺薄膜的制备方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2239539B1 (ko) * 1973-08-01 1976-04-30 Rhone Poulenc Textile
US4459330A (en) * 1982-09-20 1984-07-10 The United States Of America As Represented By The United States Department Of Energy Electroless metal plating of plastics
US4617204A (en) * 1983-01-04 1986-10-14 The United States Of America As Represented By The United States Department Of Energy Chemical synthesis of thin films and supported crystals by oxidation of zintl anions
US4512855A (en) * 1984-07-23 1985-04-23 E. I. Du Pont De Nemours And Company Deposition of metals as interlayers within organic polymeric films

Also Published As

Publication number Publication date
DE3787312D1 (de) 1993-10-14
EP0245016A3 (en) 1988-12-07
JPS62267474A (ja) 1987-11-20
KR950000013B1 (ko) 1995-01-07
EP0245016B1 (en) 1993-09-08
BR8702230A (pt) 1988-02-17
US4710403A (en) 1987-12-01
KR870011272A (ko) 1987-12-22
CA1266592A (en) 1990-03-13
AU7131987A (en) 1987-11-12
MY102300A (en) 1992-05-28
CN87103276A (zh) 1988-01-20
ES2058110T3 (es) 1994-11-01
DE3787312T2 (de) 1994-03-24
AR243916A1 (es) 1993-09-30
EP0245016A2 (en) 1987-11-11
CN1013771B (zh) 1991-09-04
MX165052B (es) 1992-10-20
AU591767B2 (en) 1989-12-14

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)