ES2058110T3 - Polimeros metalizados. - Google Patents
Polimeros metalizados.Info
- Publication number
- ES2058110T3 ES2058110T3 ES87303808T ES87303808T ES2058110T3 ES 2058110 T3 ES2058110 T3 ES 2058110T3 ES 87303808 T ES87303808 T ES 87303808T ES 87303808 T ES87303808 T ES 87303808T ES 2058110 T3 ES2058110 T3 ES 2058110T3
- Authority
- ES
- Spain
- Prior art keywords
- items
- formation
- procedure
- metallic polymers
- repetitive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/52—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating using reducing agents for coating with metallic material not provided for in a single one of groups C23C18/32 - C23C18/50
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemically Coating (AREA)
- Laminated Bodies (AREA)
- Electroplating Methods And Accessories (AREA)
- Polyoxymethylene Polymers And Polymers With Carbon-To-Carbon Bonds (AREA)
Abstract
FOEMACION DE CAPAS DE METAL BIEN ADHERIDAS SOBRE SUSTRATOS DE POLIMEROS AROMATICOS MEDIANTE UN PROCEDIMIENTO EN DOS ETAPAS. SE BASA EN EL ALMACENAMIENTO DE CARGA REVERSIBLE EN EL SUSTRATO QUE CONTIENE EL CENTRO ELECTROACTIVO. SE FABRICAN ARTICULOS ESPECIALMENTE UTILES PARA ELECTRONICA, FORMACION DE IMAGENES Y APLICACIONES SOLARES. EL PROCEDIMIENTO PRESENTADO PUEDE SER TOTALMENTE REPETITIVO DE MODO QUE LOS ARTICULOS SE PUEDEN FABRICAR EN FORMA CONTINUA.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US06/859,471 US4710403A (en) | 1986-05-05 | 1986-05-05 | Metallized polymers |
Publications (1)
Publication Number | Publication Date |
---|---|
ES2058110T3 true ES2058110T3 (es) | 1994-11-01 |
Family
ID=25331008
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES87303808T Expired - Lifetime ES2058110T3 (es) | 1986-05-05 | 1987-04-29 | Polimeros metalizados. |
Country Status (14)
Country | Link |
---|---|
US (1) | US4710403A (es) |
EP (1) | EP0245016B1 (es) |
JP (1) | JPS62267474A (es) |
KR (1) | KR950000013B1 (es) |
CN (1) | CN1013771B (es) |
AR (1) | AR243916A1 (es) |
AU (1) | AU591767B2 (es) |
BR (1) | BR8702230A (es) |
CA (1) | CA1266592A (es) |
DE (1) | DE3787312T2 (es) |
ES (1) | ES2058110T3 (es) |
HK (1) | HK65394A (es) |
MX (1) | MX165052B (es) |
MY (1) | MY102300A (es) |
Families Citing this family (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4775556A (en) * | 1986-08-05 | 1988-10-04 | Minnesota Mining And Manufacturing Company | Process for metallized imaging |
US4900618A (en) * | 1986-11-07 | 1990-02-13 | Monsanto Company | Oxidation-resistant metal coatings |
US5399425A (en) * | 1988-07-07 | 1995-03-21 | E. I. Du Pont De Nemours And Company | Metallized polymers |
US5024858A (en) * | 1988-07-07 | 1991-06-18 | E. I. Du Pont De Nemours And Company | Metallized polymers and method |
US5242713A (en) * | 1988-12-23 | 1993-09-07 | International Business Machines Corporation | Method for conditioning an organic polymeric material |
US5135779A (en) * | 1988-12-23 | 1992-08-04 | International Business Machines Corporation | Method for conditioning an organic polymeric material |
US4975327A (en) | 1989-07-11 | 1990-12-04 | Minnesota Mining And Manufacturing Company | Polyimide substrate having a textured surface and metallizing such a substrate |
US5015538A (en) * | 1989-09-22 | 1991-05-14 | Minnesota Mining And Manufacturing Company | Process for pulse electroplating electroactive polymers and articles derived therefrom |
US5032467A (en) * | 1989-09-22 | 1991-07-16 | Minnesota Mining And Manufacturing Company | Process for electroplating electroactive polymers and articles derived therefrom |
US5021129A (en) * | 1989-09-25 | 1991-06-04 | International Business Machines Corporation | Multilayer structures of different electroactive materials and methods of fabrication thereof |
JP2775647B2 (ja) * | 1989-11-17 | 1998-07-16 | 宇部興産株式会社 | メタライズドポリイミドフィルムの製法 |
JP2524436B2 (ja) * | 1990-09-18 | 1996-08-14 | インターナショナル・ビジネス・マシーンズ・コーポレイション | 表面処理方法 |
JP2768390B2 (ja) * | 1990-12-11 | 1998-06-25 | インターナショナル・ビジネス・マシーンズ・コーポレイション | 無電解金属付着のために基体をコンディショニングする方法 |
US5264248A (en) * | 1992-08-03 | 1993-11-23 | General Electric Company | Adhesion of metal coatings of polypyromellitimides |
US6099939A (en) * | 1995-04-13 | 2000-08-08 | International Business Machines Corporation | Enhanced adhesion between a vapor deposited metal and an organic polymer surface exhibiting tailored morphology |
US6272370B1 (en) | 1998-08-07 | 2001-08-07 | The Regents Of University Of Minnesota | MR-visible medical device for neurological interventions using nonlinear magnetic stereotaxis and a method imaging |
US7048716B1 (en) | 1997-05-15 | 2006-05-23 | Stanford University | MR-compatible devices |
US6141870A (en) | 1997-08-04 | 2000-11-07 | Peter K. Trzyna | Method for making electrical device |
US6463317B1 (en) | 1998-05-19 | 2002-10-08 | Regents Of The University Of Minnesota | Device and method for the endovascular treatment of aneurysms |
US6783645B2 (en) * | 2001-12-18 | 2004-08-31 | Dionex Corporation | Disposable working electrode for an electrochemical cell |
JP4135887B2 (ja) * | 2002-09-12 | 2008-08-20 | 独立行政法人科学技術振興機構 | 金属微粒子分散高分子およびその製造方法、並びにその製造に用いる金属イオン含有高分子およびその製造方法 |
CN103966549A (zh) * | 2014-05-07 | 2014-08-06 | 哈尔滨工业大学 | 一种图案化电致变色聚苯胺薄膜的制备方法 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2239539B1 (es) * | 1973-08-01 | 1976-04-30 | Rhone Poulenc Textile | |
US4459330A (en) * | 1982-09-20 | 1984-07-10 | The United States Of America As Represented By The United States Department Of Energy | Electroless metal plating of plastics |
US4617204A (en) * | 1983-01-04 | 1986-10-14 | The United States Of America As Represented By The United States Department Of Energy | Chemical synthesis of thin films and supported crystals by oxidation of zintl anions |
US4512855A (en) * | 1984-07-23 | 1985-04-23 | E. I. Du Pont De Nemours And Company | Deposition of metals as interlayers within organic polymeric films |
-
1986
- 1986-05-05 US US06/859,471 patent/US4710403A/en not_active Expired - Fee Related
-
1987
- 1987-04-09 AU AU71319/87A patent/AU591767B2/en not_active Ceased
- 1987-04-11 MY MYPI87000470A patent/MY102300A/en unknown
- 1987-04-14 CA CA000534600A patent/CA1266592A/en not_active Expired - Fee Related
- 1987-04-24 MX MX6214A patent/MX165052B/es unknown
- 1987-04-29 ES ES87303808T patent/ES2058110T3/es not_active Expired - Lifetime
- 1987-04-29 EP EP87303808A patent/EP0245016B1/en not_active Expired - Lifetime
- 1987-04-29 DE DE87303808T patent/DE3787312T2/de not_active Expired - Fee Related
- 1987-05-01 JP JP62108731A patent/JPS62267474A/ja active Pending
- 1987-05-03 CN CN87103276A patent/CN1013771B/zh not_active Expired
- 1987-05-04 KR KR1019870004337A patent/KR950000013B1/ko not_active IP Right Cessation
- 1987-05-04 BR BR8702230A patent/BR8702230A/pt not_active IP Right Cessation
- 1987-05-05 AR AR87307462A patent/AR243916A1/es active
-
1994
- 1994-07-07 HK HK65394A patent/HK65394A/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
US4710403A (en) | 1987-12-01 |
JPS62267474A (ja) | 1987-11-20 |
CN87103276A (zh) | 1988-01-20 |
DE3787312D1 (de) | 1993-10-14 |
CN1013771B (zh) | 1991-09-04 |
BR8702230A (pt) | 1988-02-17 |
CA1266592A (en) | 1990-03-13 |
MY102300A (en) | 1992-05-28 |
AU7131987A (en) | 1987-11-12 |
DE3787312T2 (de) | 1994-03-24 |
AU591767B2 (en) | 1989-12-14 |
KR950000013B1 (ko) | 1995-01-07 |
HK65394A (en) | 1994-07-15 |
EP0245016B1 (en) | 1993-09-08 |
MX165052B (es) | 1992-10-20 |
EP0245016A2 (en) | 1987-11-11 |
AR243916A1 (es) | 1993-09-30 |
EP0245016A3 (en) | 1988-12-07 |
KR870011272A (ko) | 1987-12-22 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
ES2058110T3 (es) | Polimeros metalizados. | |
US4888061A (en) | Thin-film solar cells resistant to damage during flexion | |
EP1308492A3 (de) | Doppelseitiges Klebeband | |
KR890005241A (ko) | 양면, 감압성 접착 테이프 및 이의 제조방법 | |
EP0379190A3 (en) | A polyester laminated film | |
ATE136160T1 (de) | Elektrisches dünnschicht-bauelement mit polymersubstrat | |
CA2030785A1 (en) | Electroluminescent devices | |
MX9206318A (es) | Catalizador termicamente estable de alto desempeño | |
BR9509010A (pt) | Estrutura de adesivo sensível á pressão com múltiplas camadas | |
EP1595696A3 (en) | Transparent conductive films and touch panels | |
ES8609406A1 (es) | Un procedimiento para producir una estructura de pelicula de polipropileno, de capas multiples y orientada. | |
KR890003850A (ko) | 액정중합체 함유 필름 | |
CA2380470A1 (en) | Load cell | |
DE69411479D1 (de) | Isolierband oder -folie | |
MY122581A (en) | Electrolytic copper foil with carrier foil and copper-clad laminate using the electrolytic copper foil with carrier foil. | |
DK0508615T3 (da) | Modstand af folietypen | |
EP0356981A3 (en) | Thermally-transferable fluorescent 7-aminocoumarins | |
KR890002907A (ko) | 초전도성 박층 | |
ATE321327T1 (de) | Selbstklebeetikett | |
KR970072513A (ko) | 얇은 절연층을 삽입한 전기 발광소자 | |
EP0782376A3 (en) | Polyimide-metal foil composite film | |
EP0350961A3 (en) | Semiconductor device having thin film resistor and method of producing same | |
DE69416462D1 (de) | Schichtstruktur mit isolierender Dünnschicht und Oxydsupraleiter-Dünnschicht | |
ATE141436T1 (de) | Informationsaufzeichnungsmedien | |
GAUTHIER | Sorting out structural adhesives |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
FG2A | Definitive protection |
Ref document number: 245016 Country of ref document: ES |