IL71544A - Metallization of thin,electrically isolating films - Google Patents

Metallization of thin,electrically isolating films

Info

Publication number
IL71544A
IL71544A IL7154484A IL7154484A IL71544A IL 71544 A IL71544 A IL 71544A IL 7154484 A IL7154484 A IL 7154484A IL 7154484 A IL7154484 A IL 7154484A IL 71544 A IL71544 A IL 71544A
Authority
IL
Israel
Prior art keywords
electrically conductive
oxide particles
face surface
metal oxide
finely divided
Prior art date
Application number
IL7154484A
Other languages
English (en)
Other versions
IL71544A0 (en
Original Assignee
Rhone Poulenc Rech
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rhone Poulenc Rech filed Critical Rhone Poulenc Rech
Publication of IL71544A0 publication Critical patent/IL71544A0/xx
Publication of IL71544A publication Critical patent/IL71544A/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/188—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by direct electroplating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/54—Electroplating of non-metallic surfaces
    • C25D5/56—Electroplating of non-metallic surfaces of plastics
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
    • Y10T428/12556—Organic component
    • Y10T428/12569—Synthetic resin
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Electrochemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Laminated Bodies (AREA)
  • Paints Or Removers (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Chemically Coating (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Treatments Of Macromolecular Shaped Articles (AREA)
  • Weting (AREA)
  • ing And Chemical Polishing (AREA)
  • Burglar Alarm Systems (AREA)
  • General Induction Heating (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
IL7154484A 1983-04-15 1984-04-13 Metallization of thin,electrically isolating films IL71544A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR8306405A FR2544341A1 (fr) 1983-04-15 1983-04-15 Procede de metallisation de films souples electriquement isolants et articles obtenus

Publications (2)

Publication Number Publication Date
IL71544A0 IL71544A0 (en) 1984-07-31
IL71544A true IL71544A (en) 1987-07-31

Family

ID=9288009

Family Applications (1)

Application Number Title Priority Date Filing Date
IL7154484A IL71544A (en) 1983-04-15 1984-04-13 Metallization of thin,electrically isolating films

Country Status (13)

Country Link
US (1) US4564424A (xx)
EP (1) EP0124452B1 (xx)
JP (2) JPS6036667A (xx)
KR (1) KR910010148B1 (xx)
AT (1) ATE32753T1 (xx)
AU (1) AU571505B2 (xx)
CA (1) CA1234069A (xx)
DE (1) DE3469571D1 (xx)
ES (2) ES8504973A1 (xx)
FR (1) FR2544341A1 (xx)
IE (1) IE55468B1 (xx)
IL (1) IL71544A (xx)
ZA (1) ZA842727B (xx)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4692360A (en) * 1986-01-21 1987-09-08 E. I. Du Pont De Nemours And Company Metal interlayers in films by counter-current diffusion
US4752529A (en) * 1986-01-21 1988-06-21 E. I. Du Pont De Nemours And Company Metal interlayers in films by counter-current diffusion
US4910072A (en) * 1986-11-07 1990-03-20 Monsanto Company Selective catalytic activation of polymeric films
US4900618A (en) * 1986-11-07 1990-02-13 Monsanto Company Oxidation-resistant metal coatings
JPH0826462B2 (ja) * 1987-11-30 1996-03-13 龍徳 四十宮 表面金属化重合体成形物の製造方法
US5104688A (en) * 1990-06-04 1992-04-14 Macdermid, Incorporated Pretreatment composition and process for tin-lead immersion plating
EP0460548A3 (en) * 1990-06-08 1993-03-24 Amp-Akzo Corporation Printed circuits and base materials precatalyzed for etal deposition
US5162144A (en) * 1991-08-01 1992-11-10 Motorola, Inc. Process for metallizing substrates using starved-reaction metal-oxide reduction
US5281483A (en) * 1992-08-14 1994-01-25 Shell Oil Company Metallized films
JP3641275B2 (ja) * 1995-08-14 2005-04-20 ユニヴァーサル・リソーセズ・アクチェンゲゼルシャフト 電気エネルギーの化学的源泉のための電極の製造方法
US6518198B1 (en) 2000-08-31 2003-02-11 Micron Technology, Inc. Electroless deposition of doped noble metals and noble metal alloys
US20050139811A1 (en) * 2001-02-15 2005-06-30 Integral Technologies, Inc. Surface preparation method for articles manufactured from conductive loaded resin-based materials
TW554086B (en) * 2001-02-16 2003-09-21 Taiyo Mfg Co Ltd Method for producing plated molded product
DE60228606D1 (de) * 2001-11-13 2008-10-09 Reckitt Benckiser Inc Verbesserungen an hilfsmitteln zur säuberung einer toilettenschüssel
KR100622336B1 (ko) * 2001-12-18 2006-09-18 아사히 가세이 가부시키가이샤 금속 산화물 분산체, 그를 이용한 금속 박막 및 금속 박막의 제조방법
US7449099B1 (en) * 2004-04-13 2008-11-11 Novellus Systems, Inc. Selectively accelerated plating of metal features
AU2004252260A1 (en) * 2003-06-26 2005-01-06 Reckitt Benckiser Inc Improved dispensing device
WO2006013321A1 (en) 2004-08-04 2006-02-09 Reckitt Benckiser Inc Dispensing device
WO2006114431A1 (de) * 2005-04-27 2006-11-02 Basf Aktiengesellschaft Verfahren zur herstellung metallisierter, extrudierter kunststoff-gegenstände
KR101313151B1 (ko) * 2009-12-17 2013-09-30 비와이디 컴퍼니 리미티드 표면 금속화 방법, 플라스틱 제품 제조 방법 및 이로부터 제조된 플라스틱 제품
WO2023027640A2 (en) * 2021-08-26 2023-03-02 Nanyang Technological University Binder-free stretchable interconnect

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3551304A (en) * 1965-07-12 1970-12-29 Bausch & Lomb Method for producing a composite article
FR1469798A (fr) * 1966-02-22 1967-02-17 Ici Ltd Garnitures des encoches de dynamos électriques
FR1524702A (fr) * 1967-05-26 1968-05-10 Ici Ltd Bande d'enregistrement magnétique
US3558441A (en) * 1968-11-01 1971-01-26 Int Electronic Res Corp Method of making a metal core printed circuit board
US3619382A (en) * 1970-01-27 1971-11-09 Gen Electric Process of reducing metal compounds to metal in a matrix
DE2101049A1 (de) * 1971-01-11 1972-08-03 Siemens Ag Verfahren zur vorzugsweise beidseitigen Beschichtung von Kunststoffolien mit .Metall
DE2623695C2 (de) * 1976-05-26 1984-06-20 Mitsui Toatsu Chemicals, Inc., Tokio/Tokyo Verfahren zur Herstellung eines leitfähigen, gehärteten Produktes
AU548674B2 (en) * 1978-02-28 1986-01-02 Eurographics Holdings N.V. Metallization process
FR2518126B1 (fr) * 1981-12-14 1986-01-17 Rhone Poulenc Spec Chim Procede de metallisation d'articles electriquement isolants en matiere plastique et les articles intermediaires et finis obtenus selon ce procede
EP0082904B1 (fr) * 1981-12-29 1986-04-02 International Business Machines Corporation Système de gestion d'informations visualisables et descriptives
FR2544340A1 (fr) * 1983-04-15 1984-10-19 Rhone Poulenc Rech Procede de metallisation de films souples electriquement isolants en matiere plastique thermostable et articles obtenus

Also Published As

Publication number Publication date
JPH0521741B2 (xx) 1993-03-25
ES531591A0 (es) 1985-04-16
AU2680284A (en) 1984-10-18
US4564424A (en) 1986-01-14
KR840008467A (ko) 1984-12-15
JPS6036667A (ja) 1985-02-25
FR2544341A1 (fr) 1984-10-19
EP0124452B1 (fr) 1988-03-02
JPH02187330A (ja) 1990-07-23
CA1234069A (fr) 1988-03-15
IE55468B1 (en) 1990-09-26
IE840922L (en) 1984-10-15
AU571505B2 (en) 1988-04-21
ES539842A0 (es) 1986-04-01
KR910010148B1 (ko) 1991-12-17
ATE32753T1 (de) 1988-03-15
DE3469571D1 (en) 1988-04-07
IL71544A0 (en) 1984-07-31
ES8606537A1 (es) 1986-04-01
ES8504973A1 (es) 1985-04-16
ZA842727B (en) 1984-11-28
EP0124452A1 (fr) 1984-11-07
JPH0225432B2 (xx) 1990-06-04

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