CA1226373A - Process for forming conductive through-holes through a dielectric layer - Google Patents
Process for forming conductive through-holes through a dielectric layerInfo
- Publication number
- CA1226373A CA1226373A CA000469289A CA469289A CA1226373A CA 1226373 A CA1226373 A CA 1226373A CA 000469289 A CA000469289 A CA 000469289A CA 469289 A CA469289 A CA 469289A CA 1226373 A CA1226373 A CA 1226373A
- Authority
- CA
- Canada
- Prior art keywords
- layer
- conductive
- hole
- dielectric
- dielectric layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000000034 method Methods 0.000 title claims abstract description 34
- 238000005530 etching Methods 0.000 claims abstract description 32
- 239000004020 conductor Substances 0.000 claims abstract description 23
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 68
- 229910052802 copper Inorganic materials 0.000 claims description 45
- 239000010949 copper Substances 0.000 claims description 45
- 230000015572 biosynthetic process Effects 0.000 claims description 15
- 239000000463 material Substances 0.000 claims description 9
- 230000037361 pathway Effects 0.000 claims description 9
- 238000003486 chemical etching Methods 0.000 claims description 8
- 239000003989 dielectric material Substances 0.000 claims description 5
- 239000007788 liquid Substances 0.000 claims description 5
- 238000010276 construction Methods 0.000 claims description 3
- 239000011889 copper foil Substances 0.000 description 22
- 229920000642 polymer Polymers 0.000 description 19
- 229910052751 metal Inorganic materials 0.000 description 17
- 239000002184 metal Substances 0.000 description 17
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 12
- 239000004593 Epoxy Substances 0.000 description 9
- -1 polyethylene terephthalate Polymers 0.000 description 9
- 238000005553 drilling Methods 0.000 description 7
- 239000000523 sample Substances 0.000 description 7
- 229920001577 copolymer Polymers 0.000 description 6
- 238000010030 laminating Methods 0.000 description 6
- 238000007747 plating Methods 0.000 description 6
- BGTFCAQCKWKTRL-YDEUACAXSA-N chembl1095986 Chemical compound C1[C@@H](N)[C@@H](O)[C@H](C)O[C@H]1O[C@@H]([C@H]1C(N[C@H](C2=CC(O)=CC(O[C@@H]3[C@H]([C@@H](O)[C@H](O)[C@@H](CO)O3)O)=C2C=2C(O)=CC=C(C=2)[C@@H](NC(=O)[C@@H]2NC(=O)[C@@H]3C=4C=C(C(=C(O)C=4)C)OC=4C(O)=CC=C(C=4)[C@@H](N)C(=O)N[C@@H](C(=O)N3)[C@H](O)C=3C=CC(O4)=CC=3)C(=O)N1)C(O)=O)=O)C(C=C1)=CC=C1OC1=C(O[C@@H]3[C@H]([C@H](O)[C@@H](O)[C@H](CO[C@@H]5[C@H]([C@@H](O)[C@H](O)[C@@H](C)O5)O)O3)O[C@@H]3[C@H]([C@@H](O)[C@H](O)[C@@H](CO)O3)O[C@@H]3[C@H]([C@H](O)[C@@H](CO)O3)O)C4=CC2=C1 BGTFCAQCKWKTRL-YDEUACAXSA-N 0.000 description 5
- 239000002131 composite material Substances 0.000 description 5
- 239000011888 foil Substances 0.000 description 5
- 239000000203 mixture Substances 0.000 description 5
- UOCLXMDMGBRAIB-UHFFFAOYSA-N 1,1,1-trichloroethane Chemical compound CC(Cl)(Cl)Cl UOCLXMDMGBRAIB-UHFFFAOYSA-N 0.000 description 4
- 239000002253 acid Substances 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 229920001971 elastomer Polymers 0.000 description 4
- 238000009713 electroplating Methods 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 239000005060 rubber Substances 0.000 description 4
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 description 3
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 3
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 3
- 239000012965 benzophenone Substances 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 239000001056 green pigment Substances 0.000 description 3
- 238000003475 lamination Methods 0.000 description 3
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 3
- 229920000139 polyethylene terephthalate Polymers 0.000 description 3
- 239000005020 polyethylene terephthalate Substances 0.000 description 3
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 2
- ZYUVGYBAPZYKSA-UHFFFAOYSA-N 5-(3-hydroxybutan-2-yl)-4-methylbenzene-1,3-diol Chemical compound CC(O)C(C)C1=CC(O)=CC(O)=C1C ZYUVGYBAPZYKSA-UHFFFAOYSA-N 0.000 description 2
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 2
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- CYTYCFOTNPOANT-UHFFFAOYSA-N Perchloroethylene Chemical group ClC(Cl)=C(Cl)Cl CYTYCFOTNPOANT-UHFFFAOYSA-N 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 229910000365 copper sulfate Inorganic materials 0.000 description 2
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 2
- NHADDZMCASKINP-HTRCEHHLSA-N decarboxydihydrocitrinin Natural products C1=C(O)C(C)=C2[C@H](C)[C@@H](C)OCC2=C1O NHADDZMCASKINP-HTRCEHHLSA-N 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 2
- 238000001020 plasma etching Methods 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 210000002320 radius Anatomy 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 229950011008 tetrachloroethylene Drugs 0.000 description 2
- TXEYQDLBPFQVAA-UHFFFAOYSA-N tetrafluoromethane Chemical group FC(F)(F)F TXEYQDLBPFQVAA-UHFFFAOYSA-N 0.000 description 2
- AFBBKYQYNPNMAT-UHFFFAOYSA-N 1h-1,2,4-triazol-1-ium-3-thiolate Chemical compound SC=1N=CNN=1 AFBBKYQYNPNMAT-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- VVBLNCFGVYUYGU-UHFFFAOYSA-N 4,4'-Bis(dimethylamino)benzophenone Chemical compound C1=CC(N(C)C)=CC=C1C(=O)C1=CC=C(N(C)C)C=C1 VVBLNCFGVYUYGU-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- 241001600451 Chromis Species 0.000 description 1
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- 241000490229 Eucephalus Species 0.000 description 1
- 241000282326 Felis catus Species 0.000 description 1
- 229920000271 Kevlar® Polymers 0.000 description 1
- 208000003251 Pruritus Diseases 0.000 description 1
- 241000700159 Rattus Species 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 239000002174 Styrene-butadiene Substances 0.000 description 1
- 241000950638 Symphysodon discus Species 0.000 description 1
- 244000223014 Syzygium aromaticum Species 0.000 description 1
- 235000016639 Syzygium aromaticum Nutrition 0.000 description 1
- 241001125929 Trisopterus luscus Species 0.000 description 1
- 241001504505 Troglodytes troglodytes Species 0.000 description 1
- LEHOTFFKMJEONL-UHFFFAOYSA-N Uric Acid Chemical compound N1C(=O)NC(=O)C2=C1NC(=O)N2 LEHOTFFKMJEONL-UHFFFAOYSA-N 0.000 description 1
- TVWHNULVHGKJHS-UHFFFAOYSA-N Uric acid Natural products N1C(=O)NC(=O)C2NC(=O)NC21 TVWHNULVHGKJHS-UHFFFAOYSA-N 0.000 description 1
- 240000004543 Vicia ervilia Species 0.000 description 1
- RVWADWOERKNWRY-UHFFFAOYSA-N [2-(dimethylamino)phenyl]-phenylmethanone Chemical compound CN(C)C1=CC=CC=C1C(=O)C1=CC=CC=C1 RVWADWOERKNWRY-UHFFFAOYSA-N 0.000 description 1
- HVVWZTWDBSEWIH-UHFFFAOYSA-N [2-(hydroxymethyl)-3-prop-2-enoyloxy-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(CO)(COC(=O)C=C)COC(=O)C=C HVVWZTWDBSEWIH-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000001476 alcoholic effect Effects 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- MTAZNLWOLGHBHU-UHFFFAOYSA-N butadiene-styrene rubber Chemical compound C=CC=C.C=CC1=CC=CC=C1 MTAZNLWOLGHBHU-UHFFFAOYSA-N 0.000 description 1
- 239000003518 caustics Substances 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 230000002939 deleterious effect Effects 0.000 description 1
- 125000004386 diacrylate group Chemical group 0.000 description 1
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 1
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 150000002118 epoxides Chemical class 0.000 description 1
- SUPCQIBBMFXVTL-UHFFFAOYSA-N ethyl 2-methylprop-2-enoate Chemical compound CCOC(=O)C(C)=C SUPCQIBBMFXVTL-UHFFFAOYSA-N 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 210000000569 greater omentum Anatomy 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 230000007803 itching Effects 0.000 description 1
- 239000010977 jade Substances 0.000 description 1
- 239000004761 kevlar Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002674 ointment Substances 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 244000062804 prey Species 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 229920000638 styrene acrylonitrile Polymers 0.000 description 1
- 239000011115 styrene butadiene Substances 0.000 description 1
- 229920003048 styrene butadiene rubber Polymers 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 229940116269 uric acid Drugs 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4084—Through-connections; Vertical interconnect access [VIA] connections by deforming at least one of the conductive layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0388—Other aspects of conductors
- H05K2201/0394—Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0388—Other aspects of conductors
- H05K2201/0397—Tab
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09509—Blind vias, i.e. vias having one side closed
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0548—Masks
- H05K2203/0554—Metal used as mask for etching vias, e.g. by laser ablation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/09—Treatments involving charged particles
- H05K2203/095—Plasma, e.g. for treating a substrate to improve adhesion with a conductor or for cleaning holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1184—Underetching, e.g. etching of substrate under conductors or etching of conductor under dielectrics; Means for allowing or controlling underetching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/002—Etching of the substrate by chemical or physical means by liquid chemical etching
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base
- Y10T29/49167—Manufacturing circuit on or in base by forming conductive walled aperture in base with deforming of conductive path
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49204—Contact or terminal manufacturing
- Y10T29/49208—Contact or terminal manufacturing by assembling plural parts
- Y10T29/49218—Contact or terminal manufacturing by assembling plural parts with deforming
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US06/558,307 US4517050A (en) | 1983-12-05 | 1983-12-05 | Process for forming conductive through-holes through a dielectric layer |
| US558,307 | 1983-12-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA1226373A true CA1226373A (en) | 1987-09-01 |
Family
ID=24229036
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA000469289A Expired CA1226373A (en) | 1983-12-05 | 1984-12-04 | Process for forming conductive through-holes through a dielectric layer |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US4517050A (enExample) |
| EP (1) | EP0144944B1 (enExample) |
| JP (1) | JPS60140792A (enExample) |
| AU (1) | AU575364B2 (enExample) |
| BR (1) | BR8406131A (enExample) |
| CA (1) | CA1226373A (enExample) |
| DE (1) | DE3485704D1 (enExample) |
Families Citing this family (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60137092A (ja) * | 1983-12-19 | 1985-07-20 | 株式会社東芝 | 回路基板の製造方法 |
| US4617730A (en) * | 1984-08-13 | 1986-10-21 | International Business Machines Corporation | Method of fabricating a chip interposer |
| US4635358A (en) * | 1985-01-03 | 1987-01-13 | E. I. Du Pont De Nemours And Company | Method for forming electrically conductive paths through a dielectric layer |
| JPS61203695A (ja) * | 1985-03-06 | 1986-09-09 | シャープ株式会社 | 片面配線基板の部品実装方式 |
| EP0228694A3 (en) * | 1985-12-30 | 1989-10-04 | E.I. Du Pont De Nemours And Company | Process using combination of laser etching and another etchant in formation of conductive through-holes in a dielectric layer |
| US4840923A (en) * | 1986-04-30 | 1989-06-20 | International Business Machine Corporation | Simultaneous multiple level interconnection process |
| US4707394A (en) * | 1986-09-19 | 1987-11-17 | Firan Corporation | Method for producing circuit boards with deposited metal patterns and circuit boards produced thereby |
| US4797508A (en) * | 1986-09-19 | 1989-01-10 | Firan Corporation | Method for producing circuit boards with deposited metal patterns and circuit boards produced thereby |
| GB8630392D0 (en) * | 1986-12-19 | 1987-01-28 | Prestwick Circuits Ltd | Producing printed circuit boards |
| US4720322A (en) * | 1987-04-13 | 1988-01-19 | Texas Instruments Incorporated | Plasma etching of blind vias in printed wiring board dielectric |
| US4965702A (en) * | 1989-06-19 | 1990-10-23 | E. I. Du Pont De Nemours And Company | Chip carrier package and method of manufacture |
| US4991285A (en) * | 1989-11-17 | 1991-02-12 | Rockwell International Corporation | Method of fabricating multi-layer board |
| DE4125018A1 (de) * | 1991-07-27 | 1993-01-28 | Prokopp Manfred | Elektrische verbindung, insbesondere durchkontaktierung bei einer leiterplatte |
| DE59302260D1 (de) * | 1992-06-15 | 1996-05-23 | Heinze Dyconex Patente | Verfahren zur herstellung von nachträglich konditionierbaren kontaktstellen an schaltungsträgern und schaltungsträger mit solchen kontaktstellen |
| CA2137861A1 (en) * | 1994-02-21 | 1995-08-22 | Walter Schmidt | Process for the production of structures |
| EP0740497A1 (de) * | 1995-04-24 | 1996-10-30 | Dyconex Patente Ag | Elektrisches Verbindungssubstrat |
| US5766499A (en) * | 1996-04-26 | 1998-06-16 | International Business Machines Corporation | Method of making a circuitized substrate |
| JPH1056099A (ja) * | 1996-08-12 | 1998-02-24 | Shinko Electric Ind Co Ltd | 多層回路基板およびその製造方法 |
| DE19633449A1 (de) * | 1996-08-20 | 1998-02-26 | Univ Dresden Tech | Räumliche Gitternetzstruktur aus Funktionselementen und Verfahren zu deren Herstellung |
| US5976391A (en) * | 1998-01-13 | 1999-11-02 | Ford Motor Company | Continuous Flexible chemically-milled circuit assembly with multiple conductor layers and method of making same |
| GB9828490D0 (en) * | 1998-12-23 | 1999-02-17 | Lucas Ind Plc | Printed circuit device |
| JP2000332369A (ja) * | 1999-05-25 | 2000-11-30 | Mitsui Mining & Smelting Co Ltd | プリント回路板及びその製造方法 |
| GB0012754D0 (en) * | 2000-02-28 | 2000-07-19 | Sts Atl Corp | Apparatus for forming interconnects on a substrate and related method |
| US20050155957A1 (en) * | 2001-02-26 | 2005-07-21 | John Gregory | Method of forming an opening or cavity in a substrate for receiving an electronic component |
| CN107371338B (zh) * | 2016-05-13 | 2019-08-20 | 苏州卫鹏机电科技有限公司 | 一种超薄金属层的印刷线路板的制备方法 |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2974284A (en) * | 1961-03-07 | Rotors for electrical indicating instruments | ||
| FR1378154A (fr) * | 1962-09-24 | 1964-11-13 | North American Aviation Inc | Interconnexions électriques pour panneaux de circuits imprimés |
| US3186883A (en) * | 1962-11-02 | 1965-06-01 | Buckbee Mears Co | Etching polyester film |
| FR1418598A (fr) * | 1964-12-23 | 1965-11-19 | Ibm | Connexions à travers un panneau de circuits imprimés. et méthodes de fabrication |
| US3364300A (en) * | 1965-03-19 | 1968-01-16 | Texas Instruments Inc | Modular circuit boards |
| US3557446A (en) * | 1968-12-16 | 1971-01-26 | Western Electric Co | Method of forming printed circuit board through-connections |
| US4023999A (en) * | 1972-06-14 | 1977-05-17 | Westinghouse Electric Corporation | Formation of openings in dielectric sheet |
| GB1439179A (en) * | 1972-06-14 | 1976-06-09 | Westinghouse Electric Corp | Dielectric sheets |
| DE2347217A1 (de) * | 1973-09-19 | 1975-03-27 | Siemens Ag | Verfahren zum durchkontaktieren eines beidseitig metallkaschierten basismaterials fuer gedruckte schaltungen |
| GB1497312A (en) * | 1975-10-22 | 1978-01-05 | Int Computers Ltd | Production of printed circuit arrangements |
| US4319708A (en) * | 1977-02-15 | 1982-03-16 | Lomerson Robert B | Mechanical bonding of surface conductive layers |
| US4184909A (en) * | 1978-08-21 | 1980-01-22 | International Business Machines Corporation | Method of forming thin film interconnection systems |
| US4289573A (en) * | 1979-03-30 | 1981-09-15 | International Business Machines Corporation | Process for forming microcircuits |
| US4501638A (en) * | 1983-12-05 | 1985-02-26 | E. I. Du Pont De Nemours And Company | Liquid chemical process for forming conductive through-holes through a dielectric layer |
| US4472238A (en) * | 1983-12-05 | 1984-09-18 | E. I. Du Pont De Nemours And Company | Process using plasma for forming conductive through-holes through a dielectric layer |
-
1983
- 1983-12-05 US US06/558,307 patent/US4517050A/en not_active Expired - Fee Related
-
1984
- 1984-11-30 BR BR8406131A patent/BR8406131A/pt not_active IP Right Cessation
- 1984-12-01 DE DE8484114616T patent/DE3485704D1/de not_active Expired - Lifetime
- 1984-12-01 EP EP84114616A patent/EP0144944B1/en not_active Expired - Lifetime
- 1984-12-04 AU AU36279/84A patent/AU575364B2/en not_active Ceased
- 1984-12-04 JP JP59255165A patent/JPS60140792A/ja active Granted
- 1984-12-04 CA CA000469289A patent/CA1226373A/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60140792A (ja) | 1985-07-25 |
| US4517050A (en) | 1985-05-14 |
| DE3485704D1 (de) | 1992-06-11 |
| EP0144944B1 (en) | 1992-05-06 |
| EP0144944A2 (en) | 1985-06-19 |
| EP0144944A3 (en) | 1986-10-22 |
| AU575364B2 (en) | 1988-07-28 |
| AU3627984A (en) | 1985-06-13 |
| JPH0141274B2 (enExample) | 1989-09-04 |
| BR8406131A (pt) | 1985-09-24 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4517050A (en) | Process for forming conductive through-holes through a dielectric layer | |
| KR100427794B1 (ko) | 다층 배선 기판의 제조 방법 | |
| US4472238A (en) | Process using plasma for forming conductive through-holes through a dielectric layer | |
| EP0969707B1 (en) | Multilayer printed wiring board and method for manufacturing same | |
| KR100760432B1 (ko) | 다층 인쇄회로기판의 제작방법 및 이에 이용되는 복합 호일 | |
| JP3779745B2 (ja) | プリント回路基板とフィルム回路基板の製造方法 | |
| EP2647267B1 (en) | Method for manufacturing printed circuit board | |
| US7140103B2 (en) | Process for the production of high-density printed wiring board | |
| JP2009260370A (ja) | 陽極酸化による微細回路パターン付きパッケージ基板の製造方法 | |
| US4501638A (en) | Liquid chemical process for forming conductive through-holes through a dielectric layer | |
| JP5133406B2 (ja) | 高密度相互接続（ｈｄｉ）基材材料上の誘電コーティングを貫く固体ブラインドビアを形成する方法 | |
| EP0228694A2 (en) | Process using combination of laser etching and another etchant in formation of conductive through-holes in a dielectric layer | |
| US4635358A (en) | Method for forming electrically conductive paths through a dielectric layer | |
| KR950003244B1 (ko) | 다층 회로판 제조공정 | |
| US4769269A (en) | Article containing conductive through-holes | |
| JP2003179321A (ja) | 回路基板及び多層回路基板及び回路基板の製造方法 | |
| JPH11204942A (ja) | 多層配線板の製造方法 | |
| US6576402B2 (en) | Method for producing wiring configurations having coarse conductor structures and at least one region having fine conductor structures | |
| JP2005108941A (ja) | 多層配線板及びその製造方法 | |
| JPWO2000052977A1 (ja) | 多層配線基板の製造方法 | |
| JP2003007777A (ja) | フィルムキャリア及びその製造方法 | |
| JP2004087550A (ja) | プリント配線板 | |
| WO2002093989A1 (en) | Method for laser drilling in materials used for production of printed circuits | |
| JPH06260771A (ja) | プリント配線板用銅張絶縁シート | |
| JPH02201995A (ja) | 印刷配線板の製造方法 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MKEX | Expiry |