CA1209721A - Dispositif semiconducteur sous capsule plastique et son porte-conducteurs - Google Patents

Dispositif semiconducteur sous capsule plastique et son porte-conducteurs

Info

Publication number
CA1209721A
CA1209721A CA000480771A CA480771A CA1209721A CA 1209721 A CA1209721 A CA 1209721A CA 000480771 A CA000480771 A CA 000480771A CA 480771 A CA480771 A CA 480771A CA 1209721 A CA1209721 A CA 1209721A
Authority
CA
Canada
Prior art keywords
plastic
substrate support
lead frame
strips
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
CA000480771A
Other languages
English (en)
Inventor
Kenichi Tateno
Fujio Wada
Hiroyuki Fujii
Masami Yokozawa
Mikio Nishikawa
Michio Katoh
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP6489381A external-priority patent/JPS57178352A/ja
Priority claimed from JP6430781A external-priority patent/JPS5710325A/ja
Priority claimed from CA000401752A external-priority patent/CA1200623A/fr
Application filed by Matsushita Electronics Corp filed Critical Matsushita Electronics Corp
Priority to CA000480771A priority Critical patent/CA1209721A/fr
Application granted granted Critical
Publication of CA1209721A publication Critical patent/CA1209721A/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85909—Post-treatment of the connector or wire bonding area
    • H01L2224/8592—Applying permanent coating, e.g. protective coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
CA000480771A 1981-04-28 1985-05-03 Dispositif semiconducteur sous capsule plastique et son porte-conducteurs Expired CA1209721A (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CA000480771A CA1209721A (fr) 1981-04-28 1985-05-03 Dispositif semiconducteur sous capsule plastique et son porte-conducteurs

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP64893/1981 1981-04-28
JP6489381A JPS57178352A (en) 1981-04-28 1981-04-28 Manufacture of resin sealing type semiconductor device and lead frame employed thereon
JP6430781A JPS5710325A (en) 1980-05-16 1981-04-30 Device for simultaneously and continuously supplying powdered solid or liquid into treating machine
JP64307/1981 1981-04-30
CA000401752A CA1200623A (fr) 1981-04-28 1982-04-27 Semiconducteur sous capsule plastique avec porte-conducteurs
CA000480771A CA1209721A (fr) 1981-04-28 1985-05-03 Dispositif semiconducteur sous capsule plastique et son porte-conducteurs

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CA000401752A Division CA1200623A (fr) 1981-04-28 1982-04-27 Semiconducteur sous capsule plastique avec porte-conducteurs

Publications (1)

Publication Number Publication Date
CA1209721A true CA1209721A (fr) 1986-08-12

Family

ID=27167233

Family Applications (1)

Application Number Title Priority Date Filing Date
CA000480771A Expired CA1209721A (fr) 1981-04-28 1985-05-03 Dispositif semiconducteur sous capsule plastique et son porte-conducteurs

Country Status (1)

Country Link
CA (1) CA1209721A (fr)

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Legal Events

Date Code Title Description
MKEX Expiry