CA1213678A - Passe-fils pour semiconducteur sous capsule thermoplastique - Google Patents

Passe-fils pour semiconducteur sous capsule thermoplastique

Info

Publication number
CA1213678A
CA1213678A CA000471714A CA471714A CA1213678A CA 1213678 A CA1213678 A CA 1213678A CA 000471714 A CA000471714 A CA 000471714A CA 471714 A CA471714 A CA 471714A CA 1213678 A CA1213678 A CA 1213678A
Authority
CA
Canada
Prior art keywords
lead frame
substrate support
hole
connecting band
plastic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
CA000471714A
Other languages
English (en)
Inventor
Mikio Nishikawa
Hiroyuki Fujii
Kenichi Tateno
Masami Yokozawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP1981100697U external-priority patent/JPS587356U/ja
Priority claimed from JP10790581A external-priority patent/JPS589348A/ja
Priority claimed from CA000406545A external-priority patent/CA1195782A/fr
Application filed by Matsushita Electronics Corp filed Critical Matsushita Electronics Corp
Priority to CA000471714A priority Critical patent/CA1213678A/fr
Application granted granted Critical
Publication of CA1213678A publication Critical patent/CA1213678A/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85909—Post-treatment of the connector or wire bonding area
    • H01L2224/8592—Applying permanent coating, e.g. protective coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
CA000471714A 1981-07-06 1985-01-08 Passe-fils pour semiconducteur sous capsule thermoplastique Expired CA1213678A (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CA000471714A CA1213678A (fr) 1981-07-06 1985-01-08 Passe-fils pour semiconducteur sous capsule thermoplastique

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP100697/1981 1981-07-06
JP1981100697U JPS587356U (ja) 1981-07-06 1981-07-06 樹脂封止形半導体装置用リ−ドフレ−ム
JP107905/1981 1981-07-09
JP10790581A JPS589348A (ja) 1981-07-09 1981-07-09 リ−ドフレ−ム
CA000406545A CA1195782A (fr) 1981-07-06 1982-07-05 Cadre de montage pour dispositif a semiconducteur encapsule de plastique
CA000471714A CA1213678A (fr) 1981-07-06 1985-01-08 Passe-fils pour semiconducteur sous capsule thermoplastique

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CA000406545A Division CA1195782A (fr) 1981-07-06 1982-07-05 Cadre de montage pour dispositif a semiconducteur encapsule de plastique

Publications (1)

Publication Number Publication Date
CA1213678A true CA1213678A (fr) 1986-11-04

Family

ID=27167259

Family Applications (1)

Application Number Title Priority Date Filing Date
CA000471714A Expired CA1213678A (fr) 1981-07-06 1985-01-08 Passe-fils pour semiconducteur sous capsule thermoplastique

Country Status (1)

Country Link
CA (1) CA1213678A (fr)

Similar Documents

Publication Publication Date Title
US4451973A (en) Method for manufacturing a plastic encapsulated semiconductor device and a lead frame therefor
US4637130A (en) Method for manufacturing a plastic encapsulated semiconductor device and a lead frame therefor
US4482915A (en) Lead frame for plastic encapsulated semiconductor device
US5091341A (en) Method of sealing semiconductor device with resin by pressing a lead frame to a heat sink using an upper mold pressure member
US5935502A (en) Method for manufacturing plastic package for electronic device having a fully insulated dissipator
US4503452A (en) Plastic encapsulated semiconductor device and method for manufacturing the same
JPS59135753A (ja) 半導体装置とその製造方法
JP3129660B2 (ja) Ｓｏｎパッケージの樹脂封止方法及び樹脂封止装置
CA1213678A (fr) Passe-fils pour semiconducteur sous capsule thermoplastique
JP4010860B2 (ja) 混成集積回路装置およびその製造方法
JP2508567B2 (ja) 半導体装置の製造方法
JP3367272B2 (ja) リードフレーム及び半導体装置
JPS6244815B2 (fr)
US20230031356A1 (en) Method of producing substrates for semiconductor devices, corresponding substrate and semiconductor device
JPS61194755A (ja) 半導体装置
JP2939094B2 (ja) 電力用半導体装置の製造方法
CA1209721A (fr) Dispositif semiconducteur sous capsule plastique et son porte-conducteurs
JP2917556B2 (ja) 絶縁物封止型電子部品の製造方法
JPH10163383A (ja) 樹脂封止型半導体装置及びその製造方法
JP3284604B2 (ja) 放熱板付樹脂封止半導体装置の製造方法
JPH08250531A (ja) 樹脂封止型半導体装置の製造方法
JPH04729A (ja) 樹脂封止形電子部品の製造方法
JPH0512857B2 (fr)
JPH08204099A (ja) 半導体装置の構造及び形成方法
JPS61219143A (ja) 樹脂封止形半導体装置の製造方法

Legal Events

Date Code Title Description
MKEX Expiry