CA1206818A - Method of producing gold-alloy layers and patterns on substrates, products thus produced and the solutions to be used therefore - Google Patents

Method of producing gold-alloy layers and patterns on substrates, products thus produced and the solutions to be used therefore

Info

Publication number
CA1206818A
CA1206818A CA000406336A CA406336A CA1206818A CA 1206818 A CA1206818 A CA 1206818A CA 000406336 A CA000406336 A CA 000406336A CA 406336 A CA406336 A CA 406336A CA 1206818 A CA1206818 A CA 1206818A
Authority
CA
Canada
Prior art keywords
gold
complex
solution
copper
mole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
CA000406336A
Other languages
English (en)
French (fr)
Inventor
Arian Molenaar
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Philips Gloeilampenfabrieken NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Gloeilampenfabrieken NV filed Critical Philips Gloeilampenfabrieken NV
Application granted granted Critical
Publication of CA1206818A publication Critical patent/CA1206818A/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/42—Coating with noble metals
    • C23C18/44—Coating with noble metals using reducing agents
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/48—Coating with alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Electrodes Of Semiconductors (AREA)
CA000406336A 1981-07-02 1982-06-30 Method of producing gold-alloy layers and patterns on substrates, products thus produced and the solutions to be used therefore Expired CA1206818A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NL8103174 1981-07-02
NL8103174A NL8103174A (nl) 1981-07-02 1981-07-02 Werkwijze voor de vervaardiging van lagen en patronen van goud en van goudlegeringen op substraten, aldus vervaardigde produkten en de hiervoor toe te passen oplossingen.

Publications (1)

Publication Number Publication Date
CA1206818A true CA1206818A (en) 1986-07-02

Family

ID=19837727

Family Applications (1)

Application Number Title Priority Date Filing Date
CA000406336A Expired CA1206818A (en) 1981-07-02 1982-06-30 Method of producing gold-alloy layers and patterns on substrates, products thus produced and the solutions to be used therefore

Country Status (8)

Country Link
EP (1) EP0070061B1 (https=)
JP (1) JPS586967A (https=)
KR (1) KR880002601B1 (https=)
AT (1) ATE17502T1 (https=)
CA (1) CA1206818A (https=)
DE (1) DE3268530D1 (https=)
HK (1) HK75286A (https=)
NL (1) NL8103174A (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2538043B2 (ja) * 1989-04-05 1996-09-25 松下電器産業株式会社 パタ―ン形成用材料とそれを用いたパタ―ン形成基板の作製方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1258699B (de) * 1959-06-30 1968-01-11 Clevite Corp Alkalisches, waessriges Bad zum stromlosen Plattieren mit Kupfer
US3095309A (en) * 1960-05-03 1963-06-25 Day Company Electroless copper plating
US3468676A (en) * 1963-09-09 1969-09-23 Photocircuits Corp Electroless gold plating
SE361056B (https=) * 1969-10-30 1973-10-15 Western Electric Co
GB2083080A (en) * 1981-09-01 1982-03-17 Philips Nv Electroless deposition of copper alloy layers

Also Published As

Publication number Publication date
JPH0216385B2 (https=) 1990-04-17
ATE17502T1 (de) 1986-02-15
DE3268530D1 (en) 1986-02-27
HK75286A (en) 1986-10-17
EP0070061A1 (en) 1983-01-19
NL8103174A (nl) 1983-02-01
JPS586967A (ja) 1983-01-14
KR880002601B1 (ko) 1988-12-03
EP0070061B1 (en) 1986-01-15

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