KR880002601B1 - 기질상에 금-합금층 및 패턴을 제조하는 방법, 제조된 제품 및 이에 사용되는 용액 - Google Patents

기질상에 금-합금층 및 패턴을 제조하는 방법, 제조된 제품 및 이에 사용되는 용액 Download PDF

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Publication number
KR880002601B1
KR880002601B1 KR8202904A KR820002904A KR880002601B1 KR 880002601 B1 KR880002601 B1 KR 880002601B1 KR 8202904 A KR8202904 A KR 8202904A KR 820002904 A KR820002904 A KR 820002904A KR 880002601 B1 KR880002601 B1 KR 880002601B1
Authority
KR
South Korea
Prior art keywords
solution
gold
copper
complex
mol
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
KR8202904A
Other languages
English (en)
Korean (ko)
Inventor
몰렌아르 아리안
Original Assignee
디.제이.삭커스
엔.브이, 필립스 글로에이람펜 파브리에켄
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 디.제이.삭커스, 엔.브이, 필립스 글로에이람펜 파브리에켄 filed Critical 디.제이.삭커스
Application granted granted Critical
Publication of KR880002601B1 publication Critical patent/KR880002601B1/ko
Expired legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/42—Coating with noble metals
    • C23C18/44—Coating with noble metals using reducing agents
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/48—Coating with alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Electrodes Of Semiconductors (AREA)
KR8202904A 1981-07-02 1982-06-29 기질상에 금-합금층 및 패턴을 제조하는 방법, 제조된 제품 및 이에 사용되는 용액 Expired KR880002601B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NL8103174 1981-07-02
NL8103174A NL8103174A (nl) 1981-07-02 1981-07-02 Werkwijze voor de vervaardiging van lagen en patronen van goud en van goudlegeringen op substraten, aldus vervaardigde produkten en de hiervoor toe te passen oplossingen.

Publications (1)

Publication Number Publication Date
KR880002601B1 true KR880002601B1 (ko) 1988-12-03

Family

ID=19837727

Family Applications (1)

Application Number Title Priority Date Filing Date
KR8202904A Expired KR880002601B1 (ko) 1981-07-02 1982-06-29 기질상에 금-합금층 및 패턴을 제조하는 방법, 제조된 제품 및 이에 사용되는 용액

Country Status (8)

Country Link
EP (1) EP0070061B1 (https=)
JP (1) JPS586967A (https=)
KR (1) KR880002601B1 (https=)
AT (1) ATE17502T1 (https=)
CA (1) CA1206818A (https=)
DE (1) DE3268530D1 (https=)
HK (1) HK75286A (https=)
NL (1) NL8103174A (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2538043B2 (ja) * 1989-04-05 1996-09-25 松下電器産業株式会社 パタ―ン形成用材料とそれを用いたパタ―ン形成基板の作製方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1258699B (de) * 1959-06-30 1968-01-11 Clevite Corp Alkalisches, waessriges Bad zum stromlosen Plattieren mit Kupfer
US3095309A (en) * 1960-05-03 1963-06-25 Day Company Electroless copper plating
US3468676A (en) * 1963-09-09 1969-09-23 Photocircuits Corp Electroless gold plating
SE361056B (https=) * 1969-10-30 1973-10-15 Western Electric Co
GB2083080A (en) * 1981-09-01 1982-03-17 Philips Nv Electroless deposition of copper alloy layers

Also Published As

Publication number Publication date
JPH0216385B2 (https=) 1990-04-17
ATE17502T1 (de) 1986-02-15
DE3268530D1 (en) 1986-02-27
HK75286A (en) 1986-10-17
EP0070061A1 (en) 1983-01-19
NL8103174A (nl) 1983-02-01
JPS586967A (ja) 1983-01-14
EP0070061B1 (en) 1986-01-15
CA1206818A (en) 1986-07-02

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