NL8103174A - Werkwijze voor de vervaardiging van lagen en patronen van goud en van goudlegeringen op substraten, aldus vervaardigde produkten en de hiervoor toe te passen oplossingen. - Google Patents

Werkwijze voor de vervaardiging van lagen en patronen van goud en van goudlegeringen op substraten, aldus vervaardigde produkten en de hiervoor toe te passen oplossingen. Download PDF

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Publication number
NL8103174A
NL8103174A NL8103174A NL8103174A NL8103174A NL 8103174 A NL8103174 A NL 8103174A NL 8103174 A NL8103174 A NL 8103174A NL 8103174 A NL8103174 A NL 8103174A NL 8103174 A NL8103174 A NL 8103174A
Authority
NL
Netherlands
Prior art keywords
gold
complex
solution
copper
ions
Prior art date
Application number
NL8103174A
Other languages
English (en)
Dutch (nl)
Original Assignee
Philips Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Nv filed Critical Philips Nv
Priority to NL8103174A priority Critical patent/NL8103174A/nl
Priority to JP57110907A priority patent/JPS586967A/ja
Priority to KR8202904A priority patent/KR880002601B1/ko
Priority to AT82200808T priority patent/ATE17502T1/de
Priority to EP82200808A priority patent/EP0070061B1/en
Priority to DE8282200808T priority patent/DE3268530D1/de
Priority to CA000406336A priority patent/CA1206818A/en
Publication of NL8103174A publication Critical patent/NL8103174A/nl
Priority to HK752/86A priority patent/HK75286A/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/42—Coating with noble metals
    • C23C18/44—Coating with noble metals using reducing agents
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/48—Coating with alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Electrodes Of Semiconductors (AREA)
NL8103174A 1981-07-02 1981-07-02 Werkwijze voor de vervaardiging van lagen en patronen van goud en van goudlegeringen op substraten, aldus vervaardigde produkten en de hiervoor toe te passen oplossingen. NL8103174A (nl)

Priority Applications (8)

Application Number Priority Date Filing Date Title
NL8103174A NL8103174A (nl) 1981-07-02 1981-07-02 Werkwijze voor de vervaardiging van lagen en patronen van goud en van goudlegeringen op substraten, aldus vervaardigde produkten en de hiervoor toe te passen oplossingen.
JP57110907A JPS586967A (ja) 1981-07-02 1982-06-29 基板上に金合金の層を無電堆積する方法、及びそれに用いる溶液
KR8202904A KR880002601B1 (ko) 1981-07-02 1982-06-29 기질상에 금-합금층 및 패턴을 제조하는 방법, 제조된 제품 및 이에 사용되는 용액
AT82200808T ATE17502T1 (de) 1981-07-02 1982-06-30 Loesung zur stromlosen abscheidung von goldlegierungen auf einem substrat.
EP82200808A EP0070061B1 (en) 1981-07-02 1982-06-30 A solution for the electroless deposition of gold-alloys onto a substrate
DE8282200808T DE3268530D1 (en) 1981-07-02 1982-06-30 A solution for the electroless deposition of gold-alloys onto a substrate
CA000406336A CA1206818A (en) 1981-07-02 1982-06-30 Method of producing gold-alloy layers and patterns on substrates, products thus produced and the solutions to be used therefore
HK752/86A HK75286A (en) 1981-07-02 1986-10-09 A solution for the electroless deposition of gold-alloys onto a substrate

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NL8103174 1981-07-02
NL8103174A NL8103174A (nl) 1981-07-02 1981-07-02 Werkwijze voor de vervaardiging van lagen en patronen van goud en van goudlegeringen op substraten, aldus vervaardigde produkten en de hiervoor toe te passen oplossingen.

Publications (1)

Publication Number Publication Date
NL8103174A true NL8103174A (nl) 1983-02-01

Family

ID=19837727

Family Applications (1)

Application Number Title Priority Date Filing Date
NL8103174A NL8103174A (nl) 1981-07-02 1981-07-02 Werkwijze voor de vervaardiging van lagen en patronen van goud en van goudlegeringen op substraten, aldus vervaardigde produkten en de hiervoor toe te passen oplossingen.

Country Status (8)

Country Link
EP (1) EP0070061B1 (https=)
JP (1) JPS586967A (https=)
KR (1) KR880002601B1 (https=)
AT (1) ATE17502T1 (https=)
CA (1) CA1206818A (https=)
DE (1) DE3268530D1 (https=)
HK (1) HK75286A (https=)
NL (1) NL8103174A (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2538043B2 (ja) * 1989-04-05 1996-09-25 松下電器産業株式会社 パタ―ン形成用材料とそれを用いたパタ―ン形成基板の作製方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1258699B (de) * 1959-06-30 1968-01-11 Clevite Corp Alkalisches, waessriges Bad zum stromlosen Plattieren mit Kupfer
US3095309A (en) * 1960-05-03 1963-06-25 Day Company Electroless copper plating
US3468676A (en) * 1963-09-09 1969-09-23 Photocircuits Corp Electroless gold plating
SE361056B (https=) * 1969-10-30 1973-10-15 Western Electric Co
GB2083080A (en) * 1981-09-01 1982-03-17 Philips Nv Electroless deposition of copper alloy layers

Also Published As

Publication number Publication date
JPH0216385B2 (https=) 1990-04-17
ATE17502T1 (de) 1986-02-15
DE3268530D1 (en) 1986-02-27
HK75286A (en) 1986-10-17
EP0070061A1 (en) 1983-01-19
JPS586967A (ja) 1983-01-14
KR880002601B1 (ko) 1988-12-03
EP0070061B1 (en) 1986-01-15
CA1206818A (en) 1986-07-02

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A1B A search report has been drawn up
BV The patent application has lapsed