CA1184359A - Metallic impurity control for electroless copper plating - Google Patents

Metallic impurity control for electroless copper plating

Info

Publication number
CA1184359A
CA1184359A CA000412763A CA412763A CA1184359A CA 1184359 A CA1184359 A CA 1184359A CA 000412763 A CA000412763 A CA 000412763A CA 412763 A CA412763 A CA 412763A CA 1184359 A CA1184359 A CA 1184359A
Authority
CA
Canada
Prior art keywords
solution
present
hydroxy compound
amount
group
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
CA000412763A
Other languages
English (en)
French (fr)
Inventor
Donald A. Arcilesi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
OMI International Corp
Original Assignee
OMI International Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by OMI International Corp filed Critical OMI International Corp
Application granted granted Critical
Publication of CA1184359A publication Critical patent/CA1184359A/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
CA000412763A 1981-10-23 1982-10-04 Metallic impurity control for electroless copper plating Expired CA1184359A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US31428081A 1981-10-23 1981-10-23
US314,280 1981-10-23

Publications (1)

Publication Number Publication Date
CA1184359A true CA1184359A (en) 1985-03-26

Family

ID=23219330

Family Applications (1)

Application Number Title Priority Date Filing Date
CA000412763A Expired CA1184359A (en) 1981-10-23 1982-10-04 Metallic impurity control for electroless copper plating

Country Status (7)

Country Link
AU (1) AU544591B2 (de)
BE (1) BE894789A (de)
CA (1) CA1184359A (de)
DE (1) DE3238921C2 (de)
GB (1) GB2109013A (de)
IT (1) IT1197434B (de)
SE (1) SE8205982L (de)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3404270A1 (de) * 1984-02-04 1985-08-08 Schering AG, 1000 Berlin und 4709 Bergkamen Waessriges alkalisches bad zur chemischen abscheidung von kupfer, nickel, kobalt und deren legierungen
GB2154250B (en) * 1984-02-17 1987-06-03 Omi Int Corp Complexing agent for electroless copper plating
DE3806306A1 (de) * 1988-02-27 1989-09-07 Basf Ag Verwendung von polyacetalen als komplexbildner zur chemischen abscheidung von kupfer und verfahren zur chemischen abscheidung von kupfer
JP3208410B2 (ja) 1997-04-07 2001-09-10 奥野製薬工業株式会社 非導電性プラスチック成形品への電気めっき方法
JP6035540B2 (ja) 2012-12-21 2016-11-30 奥野製薬工業株式会社 導電性皮膜形成浴
CN105765104A (zh) 2014-01-27 2016-07-13 奥野制药工业株式会社 导电膜形成浴
CN105132973A (zh) * 2015-09-22 2015-12-09 太原工业学院 一种环保型无氰电镀铜锌合金溶液及其电镀铜锌合金工艺

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3383224A (en) * 1965-11-09 1968-05-14 Shipley Co Electroless copper deposition
US3329512A (en) * 1966-04-04 1967-07-04 Shipley Co Chemical deposition of copper and solutions therefor
BE757573A (fr) * 1969-10-16 1971-04-15 Philips Nv Depot sans courant de cuivre flexible
US3650777A (en) * 1971-02-11 1972-03-21 Kollmorgen Corp Electroless copper plating

Also Published As

Publication number Publication date
IT1197434B (it) 1988-11-30
IT8249324A0 (it) 1982-10-21
AU8915282A (en) 1983-04-28
BE894789A (fr) 1983-04-22
SE8205982D0 (sv) 1982-10-21
AU544591B2 (en) 1985-06-06
GB2109013A (en) 1983-05-25
DE3238921A1 (de) 1983-05-05
SE8205982L (sv) 1983-04-24
DE3238921C2 (de) 1985-06-13

Similar Documents

Publication Publication Date Title
US4814205A (en) Process for rejuvenation electroless nickel solution
US3993799A (en) Electroless plating process employing non-noble metal hydrous oxide catalyst
CA1255975A (en) Formaldehyde-free autocatalytic electroless copper plating
EP0913502B1 (de) Verfahren zur elektrobeschichtung eines nichtleitenden geformten kunststoffgegenstands
KR101635661B1 (ko) 베타-아미노산 함유 전해질 및 금속 층 침착 방법
EP0100452A1 (de) Verfahren zur Vorbehandlung von Substraten vor der Plattierung
US4136216A (en) Non-precious metal colloidal dispersions for electroless metal deposition
US3853590A (en) Electroless plating solution and process
TW201741497A (zh) 鍍銅液及鍍銅方法
US3993848A (en) Catalytic primer
CA1184359A (en) Metallic impurity control for electroless copper plating
EP1988192B1 (de) Verfahren zum Aufbringen einer Metallbeschichtung auf ein nichtleitfähiges Substrat
US4450191A (en) Ammonium ions used as electroless copper plating rate controller
US3178311A (en) Electroless plating process
US4020197A (en) Process for the catalytic sensitization of non-metallic surfaces for subsequent electroless metallization
KR20120081107A (ko) 비전도성 기판에 금속 코팅을 적용하기 위한 프로세스
US4321285A (en) Electroless plating
US2976180A (en) Method of silver plating by chemical reduction
US3769061A (en) Pre-etch treatment of acrylonitrile-butadiene-styrene resins for electroless plating
JPH022952B2 (de)
US3754940A (en) Electroless plating solutions containing sulfamic acid and salts thereof
JPS60184683A (ja) 金属付着方法
US3645749A (en) Electroless plating baths with improved deposition rates
US3507681A (en) Metal plating of plastics
US3130072A (en) Silver-palladium immersion plating composition and process

Legal Events

Date Code Title Description
MKEC Expiry (correction)
MKEX Expiry