BE894789A - Suppression des impuretes metalliques pour le depot anelectrolytique du cuivre - Google Patents

Suppression des impuretes metalliques pour le depot anelectrolytique du cuivre

Info

Publication number
BE894789A
BE894789A BE0/209315A BE209315A BE894789A BE 894789 A BE894789 A BE 894789A BE 0/209315 A BE0/209315 A BE 0/209315A BE 209315 A BE209315 A BE 209315A BE 894789 A BE894789 A BE 894789A
Authority
BE
Belgium
Prior art keywords
anelectrolytic
removal
metal impurities
copper deposition
deposition
Prior art date
Application number
BE0/209315A
Other languages
English (en)
French (fr)
Inventor
D A Arcilesi
Original Assignee
Occidental Chem Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Occidental Chem Co filed Critical Occidental Chem Co
Publication of BE894789A publication Critical patent/BE894789A/fr

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
BE0/209315A 1981-10-23 1982-10-22 Suppression des impuretes metalliques pour le depot anelectrolytique du cuivre BE894789A (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US31428081A 1981-10-23 1981-10-23

Publications (1)

Publication Number Publication Date
BE894789A true BE894789A (fr) 1983-04-22

Family

ID=23219330

Family Applications (1)

Application Number Title Priority Date Filing Date
BE0/209315A BE894789A (fr) 1981-10-23 1982-10-22 Suppression des impuretes metalliques pour le depot anelectrolytique du cuivre

Country Status (7)

Country Link
AU (1) AU544591B2 (de)
BE (1) BE894789A (de)
CA (1) CA1184359A (de)
DE (1) DE3238921C2 (de)
GB (1) GB2109013A (de)
IT (1) IT1197434B (de)
SE (1) SE8205982L (de)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3404270A1 (de) * 1984-02-04 1985-08-08 Schering AG, 1000 Berlin und 4709 Bergkamen Waessriges alkalisches bad zur chemischen abscheidung von kupfer, nickel, kobalt und deren legierungen
GB2154250B (en) * 1984-02-17 1987-06-03 Omi Int Corp Complexing agent for electroless copper plating
DE3806306A1 (de) * 1988-02-27 1989-09-07 Basf Ag Verwendung von polyacetalen als komplexbildner zur chemischen abscheidung von kupfer und verfahren zur chemischen abscheidung von kupfer
US6331239B1 (en) 1997-04-07 2001-12-18 Okuno Chemical Industries Co., Ltd. Method of electroplating non-conductive plastic molded products
JP6035540B2 (ja) 2012-12-21 2016-11-30 奥野製薬工業株式会社 導電性皮膜形成浴
EP3070185B1 (de) 2014-01-27 2024-05-29 Okuno Chemical Industries Co., Ltd. Bad zur bildung eines leitfähigen films
CN105132973A (zh) * 2015-09-22 2015-12-09 太原工业学院 一种环保型无氰电镀铜锌合金溶液及其电镀铜锌合金工艺

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3383224A (en) * 1965-11-09 1968-05-14 Shipley Co Electroless copper deposition
US3329512A (en) * 1966-04-04 1967-07-04 Shipley Co Chemical deposition of copper and solutions therefor
BE757573A (fr) * 1969-10-16 1971-04-15 Philips Nv Depot sans courant de cuivre flexible
US3650777A (en) * 1971-02-11 1972-03-21 Kollmorgen Corp Electroless copper plating

Also Published As

Publication number Publication date
DE3238921C2 (de) 1985-06-13
CA1184359A (en) 1985-03-26
DE3238921A1 (de) 1983-05-05
IT1197434B (it) 1988-11-30
AU8915282A (en) 1983-04-28
AU544591B2 (en) 1985-06-06
SE8205982L (sv) 1983-04-24
IT8249324A0 (it) 1982-10-21
SE8205982D0 (sv) 1982-10-21
GB2109013A (en) 1983-05-25

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Legal Events

Date Code Title Description
RE Patent lapsed

Owner name: OCCIDENTAL CHEMICAL CORP.

Effective date: 19851031