CA1180469A - Plastic encapsulated semiconductor device and method for manufacturing the same - Google Patents
Plastic encapsulated semiconductor device and method for manufacturing the sameInfo
- Publication number
- CA1180469A CA1180469A CA000403080A CA403080A CA1180469A CA 1180469 A CA1180469 A CA 1180469A CA 000403080 A CA000403080 A CA 000403080A CA 403080 A CA403080 A CA 403080A CA 1180469 A CA1180469 A CA 1180469A
- Authority
- CA
- Canada
- Prior art keywords
- plastic
- encapsulating housing
- strips
- substrate support
- plastic encapsulating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004033 plastic Substances 0.000 title claims abstract description 96
- 239000004065 semiconductor Substances 0.000 title claims abstract description 36
- 238000000034 method Methods 0.000 title claims abstract description 12
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 11
- 239000000758 substrate Substances 0.000 claims abstract description 51
- 238000005538 encapsulation Methods 0.000 description 10
- 239000002184 metal Substances 0.000 description 4
- 238000004806 packaging method and process Methods 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- 238000010292 electrical insulation Methods 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 229920000136 polysorbate Polymers 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 241000905957 Channa melasoma Species 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000000875 corresponding effect Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 230000000593 degrading effect Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3135—Double encapsulation or coating and encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
- H01L23/49562—Geometry of the lead-frame for devices being provided for in H01L29/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1203—Rectifying Diode
- H01L2924/12033—Gunn diode
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP56075444A JPS57188858A (en) | 1981-05-18 | 1981-05-18 | Plastic molded type semiconductor device |
JP75444/1981 | 1981-05-18 |
Publications (1)
Publication Number | Publication Date |
---|---|
CA1180469A true CA1180469A (en) | 1985-01-02 |
Family
ID=13576421
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CA000403080A Expired CA1180469A (en) | 1981-05-18 | 1982-05-17 | Plastic encapsulated semiconductor device and method for manufacturing the same |
Country Status (5)
Families Citing this family (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59130449A (ja) * | 1983-01-17 | 1984-07-27 | Nec Corp | 絶縁型半導体素子用リードフレーム |
JPS59135753A (ja) * | 1983-01-25 | 1984-08-04 | Toshiba Corp | 半導体装置とその製造方法 |
JPS60128645A (ja) * | 1983-12-16 | 1985-07-09 | Hitachi Ltd | 絶縁型パワートランジスタの製造方法 |
JPS60128646A (ja) * | 1983-12-16 | 1985-07-09 | Hitachi Ltd | 絶縁型パワートランジスタの製造方法 |
JPS60229352A (ja) * | 1984-04-26 | 1985-11-14 | Fuji Electric Co Ltd | 樹脂封止形半導体装置および樹脂封止方法 |
DE3535605C1 (de) * | 1985-10-05 | 1986-12-04 | Telefunken electronic GmbH, 7100 Heilbronn | Halbleiteranordnung |
EP0257681A3 (en) * | 1986-08-27 | 1990-02-07 | STMicroelectronics S.r.l. | Method for manufacturing plastic encapsulated semiconductor devices and devices obtained thereby |
EP0264780B1 (en) * | 1986-10-15 | 1992-03-11 | Sanyo Electric Co., Ltd. | Hybrid integrated circuit device capable of being inserted into socket |
JP2602234B2 (ja) * | 1987-07-10 | 1997-04-23 | 株式会社日立製作所 | 樹脂封止半導体装置 |
DE3881218D1 (de) * | 1988-02-20 | 1993-06-24 | Itt Ind Gmbh Deutsche | Halbleiterbauelement, herstellungsverfahren, vorrichtung und montageplatz. |
EP0336173A3 (en) * | 1988-04-05 | 1990-04-25 | Siemens Aktiengesellschaft | Molded component package isolating interior substrate by recesses containing exposed breakoffs |
US5011256A (en) * | 1988-10-28 | 1991-04-30 | E. I. Du Pont De Nemours And Company | Package for an opto-electronic component |
US5521427A (en) * | 1992-12-18 | 1996-05-28 | Lsi Logic Corporation | Printed wiring board mounted semiconductor device having leadframe with alignment feature |
US5886400A (en) * | 1995-08-31 | 1999-03-23 | Motorola, Inc. | Semiconductor device having an insulating layer and method for making |
US5977630A (en) * | 1997-08-15 | 1999-11-02 | International Rectifier Corp. | Plural semiconductor die housed in common package with split heat sink |
US6255722B1 (en) * | 1998-06-11 | 2001-07-03 | International Rectifier Corp. | High current capacity semiconductor device housing |
JP2010073841A (ja) * | 2008-09-18 | 2010-04-02 | Sony Corp | 光学パッケージ素子、表示装置、および電子機器 |
DE102013220880B4 (de) * | 2013-10-15 | 2016-08-18 | Infineon Technologies Ag | Elektronisches Halbleitergehäuse mit einer elektrisch isolierenden, thermischen Schnittstellenstruktur auf einer Diskontinuität einer Verkapselungsstruktur sowie ein Herstellungsverfahren dafür und eine elektronische Anordung dies aufweisend |
DE102015118245A1 (de) * | 2015-10-26 | 2017-04-27 | Infineon Technologies Austria Ag | Thermisches Schnittstellenmaterial mit definierten thermischen, mechanischen und elektrischen Eigenschaften |
JP1646470S (US07534539-20090519-C00280.png) * | 2019-05-14 | 2019-11-25 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3716764A (en) * | 1963-12-16 | 1973-02-13 | Texas Instruments Inc | Process for encapsulating electronic components in plastic |
NL6903229A (US07534539-20090519-C00280.png) * | 1969-03-01 | 1970-09-03 | ||
US3611250A (en) * | 1969-09-10 | 1971-10-05 | Amp Inc | Integrated circuit module and assembly |
US3793709A (en) * | 1972-04-24 | 1974-02-26 | Texas Instruments Inc | Process for making a plastic-encapsulated semiconductor device |
IT993429B (it) * | 1973-09-26 | 1975-09-30 | Sgs Ates Componenti | Perfezionamento di una cassa per dispositivo a semiconduttori |
JPS51137376A (en) * | 1975-05-22 | 1976-11-27 | Mitsubishi Electric Corp | Manufacturing method for plastic seal type semi conductor |
JPS5380969A (en) * | 1976-12-27 | 1978-07-17 | Hitachi Ltd | Manufacture of resin shield type semiconductor device and lead frame used for the said process |
JPS54111766A (en) * | 1978-02-22 | 1979-09-01 | Hitachi Ltd | Coupling construction of lead and heat sink in semiconductor device |
JPS54159177A (en) * | 1978-06-07 | 1979-12-15 | Hitachi Ltd | Resin sealed semiconductor device |
US4224637A (en) * | 1978-08-10 | 1980-09-23 | Minnesota Mining And Manufacturing Company | Leaded mounting and connector unit for an electronic device |
JPS5563854A (en) * | 1978-11-08 | 1980-05-14 | Nec Kyushu Ltd | Method of manufacturing semiconductor device |
JPS5587468A (en) * | 1978-12-25 | 1980-07-02 | Nec Corp | Lead frame |
JPS5596663A (en) * | 1979-01-16 | 1980-07-23 | Nec Corp | Method of fabricating semiconductor device |
JPS55108755A (en) * | 1979-02-14 | 1980-08-21 | Nec Corp | Resin seal type semiconductor device |
JPS5619646A (en) * | 1979-07-27 | 1981-02-24 | Hitachi Ltd | Resin sealing type semiconductor device |
JPS5662344A (en) * | 1979-10-26 | 1981-05-28 | Hitachi Ltd | Resin sealed semiconductor device |
-
1981
- 1981-05-18 JP JP56075444A patent/JPS57188858A/ja active Granted
-
1982
- 1982-05-14 US US06/378,435 patent/US4503452A/en not_active Expired - Lifetime
- 1982-05-17 CA CA000403080A patent/CA1180469A/en not_active Expired
- 1982-05-18 EP EP82104364A patent/EP0066188B1/en not_active Expired
- 1982-05-18 DE DE8282104364T patent/DE3267996D1/de not_active Expired
Also Published As
Publication number | Publication date |
---|---|
EP0066188B1 (en) | 1985-12-18 |
JPS57188858A (en) | 1982-11-19 |
US4503452A (en) | 1985-03-05 |
JPS6227750B2 (US07534539-20090519-C00280.png) | 1987-06-16 |
DE3267996D1 (en) | 1986-01-30 |
EP0066188A1 (en) | 1982-12-08 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MKEC | Expiry (correction) | ||
MKEX | Expiry |