CA1073557A - Multilayer interconnect system, and method of making - Google Patents

Multilayer interconnect system, and method of making

Info

Publication number
CA1073557A
CA1073557A CA279,129A CA279129A CA1073557A CA 1073557 A CA1073557 A CA 1073557A CA 279129 A CA279129 A CA 279129A CA 1073557 A CA1073557 A CA 1073557A
Authority
CA
Canada
Prior art keywords
layer
signal
forming
conductors
face
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
CA279,129A
Other languages
English (en)
French (fr)
Inventor
Ven Y. Doo
Frank F. Fang
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Application granted granted Critical
Publication of CA1073557A publication Critical patent/CA1073557A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/50—Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5385—Assembly of a plurality of insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L25/0652—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00 the devices being arranged next and on each other, i.e. mixed assemblies
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Structure Of Printed Boards (AREA)
  • Connection Or Junction Boxes (AREA)
CA279,129A 1976-06-30 1977-05-25 Multilayer interconnect system, and method of making Expired CA1073557A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US70144176A 1976-06-30 1976-06-30

Publications (1)

Publication Number Publication Date
CA1073557A true CA1073557A (en) 1980-03-11

Family

ID=24817392

Family Applications (1)

Application Number Title Priority Date Filing Date
CA279,129A Expired CA1073557A (en) 1976-06-30 1977-05-25 Multilayer interconnect system, and method of making

Country Status (5)

Country Link
JP (1) JPS5325864A (sv)
CA (1) CA1073557A (sv)
DE (1) DE2728360A1 (sv)
FR (1) FR2357072A1 (sv)
IT (1) IT1115527B (sv)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4210885A (en) * 1978-06-30 1980-07-01 International Business Machines Corporation Thin film lossy line for preventing reflections in microcircuit chip package interconnections
JPS5811117B2 (ja) * 1979-03-12 1983-03-01 富士通株式会社 多層印刷配線板の製造方法
JPS55123195A (en) * 1979-03-15 1980-09-22 Fujitsu Ltd Hollow coaxial structure multilayer printed board
JPS55153397A (en) * 1979-05-18 1980-11-29 Fujitsu Ltd Method of fabricating hollow multilayer printed board
JPS55156395A (en) * 1979-05-24 1980-12-05 Fujitsu Ltd Method of fabricating hollow multilayer printed board
FR2479520A1 (fr) * 1980-03-26 1981-10-02 Thomson Csf Transducteur composite a adressage electrique
DE3210826C2 (de) * 1982-03-24 1985-09-26 Siemens AG, 1000 Berlin und 8000 München Übertragungsleitung, bestehend aus einer Mehrlagenleiterplatte
DE3480984D1 (de) * 1983-05-31 1990-02-08 Trw Inc Verbindungseinrichtung mit knoepfen fuer einen chip und eine schaltungsplatte.
JPS6284973U (sv) * 1985-11-19 1987-05-30
US5495397A (en) * 1993-04-27 1996-02-27 International Business Machines Corporation Three dimensional package and architecture for high performance computer

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1136753A (en) * 1965-10-26 1968-12-18 English Electric Computers Ltd Improvements relating to electrical connecting arrangements

Also Published As

Publication number Publication date
FR2357072A1 (fr) 1978-01-27
DE2728360A1 (de) 1978-01-05
FR2357072B1 (sv) 1978-11-03
IT1115527B (it) 1986-02-03
JPS5325864A (en) 1978-03-10

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