BRPI1001259A2 - filme compósito de filme de metal fino e de filme de plástico riscados linearmente e sua aparelhagem de produção - Google Patents
filme compósito de filme de metal fino e de filme de plástico riscados linearmente e sua aparelhagem de produçãoInfo
- Publication number
- BRPI1001259A2 BRPI1001259A2 BRPI1001259A BRPI1001259A BRPI1001259A2 BR PI1001259 A2 BRPI1001259 A2 BR PI1001259A2 BR PI1001259 A BRPI1001259 A BR PI1001259A BR PI1001259 A BRPI1001259 A BR PI1001259A BR PI1001259 A2 BRPI1001259 A2 BR PI1001259A2
- Authority
- BR
- Brazil
- Prior art keywords
- film
- linear
- thin metal
- production equipment
- composite
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D3/00—Cutting work characterised by the nature of the cut made; Apparatus therefor
- B26D3/08—Making a superficial cut in the surface of the work without removal of material, e.g. scoring, incising
- B26D3/085—On sheet material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
- B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
- B32B27/285—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyethers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
- B32B27/286—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polysulphones; polysulfides
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
- B32B27/288—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyketones
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
- B32B27/302—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising aromatic vinyl (co)polymers, e.g. styrenic (co)polymers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
- B32B27/308—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising acrylic (co)polymers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/34—Layered products comprising a layer of synthetic resin comprising polyamides
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
- B32B27/365—Layered products comprising a layer of synthetic resin comprising polyesters comprising polycarbonates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q17/00—Devices for absorbing waves radiated from an antenna; Combinations of such devices with active antenna elements or systems
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
- H05K9/0084—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single continuous metallic layer on an electrically insulating supporting structure, e.g. metal foil, film, plating coating, electro-deposition, vapour-deposition
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
- H05K9/0086—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single discontinuous metallic layer on an electrically insulating supporting structure, e.g. metal grid, perforated metal foil, film, aggregated flakes, sintering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2250/00—Layers arrangement
- B32B2250/42—Alternating layers, e.g. ABAB(C), AABBAABB(C)
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
- B32B2307/212—Electromagnetic interference shielding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
- B32B2307/546—Flexural strength; Flexion stiffness
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/70—Other properties
- B32B2307/708—Isotropic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2509/00—Household appliances
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness
- Y10T428/2457—Parallel ribs and/or grooves
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T83/00—Cutting
- Y10T83/02—Other than completely through work thickness
- Y10T83/0304—Grooving
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Life Sciences & Earth Sciences (AREA)
- Forests & Forestry (AREA)
- Mechanical Engineering (AREA)
- Laminated Bodies (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Aerials With Secondary Devices (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009032070 | 2009-02-13 | ||
JP2009250843 | 2009-10-30 | ||
PCT/JP2010/052106 WO2010093027A1 (ja) | 2009-02-13 | 2010-02-12 | 線状痕付き金属薄膜-プラスチック複合フィルム及びその製造装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
BRPI1001259A2 true BRPI1001259A2 (pt) | 2016-10-04 |
Family
ID=42561867
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
BRPI1001259A BRPI1001259A2 (pt) | 2009-02-13 | 2010-02-12 | filme compósito de filme de metal fino e de filme de plástico riscados linearmente e sua aparelhagem de produção |
Country Status (9)
Country | Link |
---|---|
US (2) | US9238351B2 (pt) |
EP (1) | EP2399734B1 (pt) |
JP (1) | JP4685977B2 (pt) |
KR (1) | KR101688471B1 (pt) |
CN (1) | CN102046370B (pt) |
BR (1) | BRPI1001259A2 (pt) |
RU (1) | RU2519942C2 (pt) |
TW (1) | TWI511877B (pt) |
WO (1) | WO2010093027A1 (pt) |
Families Citing this family (29)
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WO2011077834A1 (ja) * | 2009-12-25 | 2011-06-30 | Kagawa Seiji | 複合電磁波吸収フィルム |
JP5302287B2 (ja) * | 2010-11-02 | 2013-10-02 | 清二 加川 | 電磁波吸収体 |
JP5559668B2 (ja) * | 2010-12-07 | 2014-07-23 | 清二 加川 | 電磁波吸収体 |
KR20140023270A (ko) * | 2010-12-27 | 2014-02-26 | 세이지 까가와 | 근거리 전자파 흡수체 |
JP5582539B2 (ja) * | 2011-02-25 | 2014-09-03 | 清二 加川 | 近傍界ノイズ抑制シート |
EP2741595B1 (en) * | 2011-07-26 | 2018-05-30 | Seiji Kagawa | Electromagnetic wave absorption film having high heat dissipation properties |
JP2013084864A (ja) * | 2011-10-12 | 2013-05-09 | Seiji Kagawa | 電磁波吸収フレキシブル回路基板及びそれに用いる電磁波吸収フレキシブル基板シート |
CN103959927B (zh) * | 2011-11-30 | 2017-07-18 | 加川清二 | 复合电磁波吸收片 |
CN103140124A (zh) * | 2011-12-03 | 2013-06-05 | 深圳富泰宏精密工业有限公司 | 电磁屏蔽方法及制品 |
KR20140110909A (ko) * | 2011-12-14 | 2014-09-17 | 이에이디에스 도이치란트 게엠베하 | 레이다 반사-흡수 글레이징 |
EP3919174A3 (en) | 2012-10-24 | 2022-03-09 | Genmark Diagnostics Inc. | Integrated multiplex target analysis |
KR101283671B1 (ko) * | 2012-12-20 | 2013-07-08 | 주식회사 지오 | 페라이트 시트의 재단장치 및 재단방법 |
EP3061152A4 (en) * | 2013-10-24 | 2017-07-26 | Nanyang Technological University | Microwave absorbing composite for turbine blade applications |
KR101533305B1 (ko) * | 2013-11-05 | 2015-07-02 | 에이큐 주식회사 | 안테나 기판용 연성시트를 이용한 안테나 장치의 제조방법 |
CN103872024A (zh) * | 2014-02-18 | 2014-06-18 | 南京银茂微电子制造有限公司 | 一种高频防电磁干扰功率模块 |
US20150343965A1 (en) * | 2014-06-02 | 2015-12-03 | Ford Global Technologies, Llc | Truck cab liner with noise absorber |
JP6571920B2 (ja) * | 2014-10-21 | 2019-09-04 | 川崎重工業株式会社 | 電磁シールド部材及びそれを備える電磁シールドテント |
TWI632726B (zh) * | 2014-10-21 | 2018-08-11 | 加川清二 | 微多孔金屬箔的製造方法及裝置 |
JP5973099B1 (ja) * | 2016-02-26 | 2016-08-23 | 加川 清二 | 近傍界電磁波吸収フィルム |
JP6027281B1 (ja) * | 2016-04-01 | 2016-11-16 | 加川 清二 | 近傍界電磁波吸収フィルム |
RU185008U1 (ru) * | 2016-12-07 | 2018-11-16 | Российская Федерация, от имени которой выступает Федеральное государственное казенное учреждение "Войсковая часть 68240" | Устройство для бесконтактной регистрации и идентификации |
JP6727408B2 (ja) * | 2017-03-29 | 2020-07-22 | 富士フイルム株式会社 | 電波吸収体及び電波吸収体の製造方法 |
JP6208394B1 (ja) * | 2017-05-23 | 2017-10-04 | 加川 清二 | 電磁波吸収フィルタ |
TWI668708B (zh) | 2017-07-07 | 2019-08-11 | 加川清二 | 電磁波吸收纜線 |
JP6461416B1 (ja) | 2018-06-21 | 2019-01-30 | 加川 清二 | 電磁波吸収複合シート |
JP6404522B1 (ja) * | 2018-07-03 | 2018-10-10 | 加川 清二 | 電磁波吸収複合シート |
DE102019131499A1 (de) | 2019-11-21 | 2021-05-27 | Carl Freudenberg Kg | Flexibles Laminat zur Abschirmung elektromagnetischer Strahlung |
WO2022107637A1 (ja) | 2020-11-18 | 2022-05-27 | 凸版印刷株式会社 | 電磁波減衰フィルム |
JP7323692B1 (ja) | 2022-08-19 | 2023-08-08 | 清二 加川 | 近傍界電磁波吸収体 |
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RU2040404C1 (ru) * | 1987-10-15 | 1995-07-25 | Карнауд Металбокс ПЛС | Ламинированный материал и способ его получения |
DE69209336T2 (de) * | 1991-01-28 | 1996-11-14 | Sony Corp | Mikroelektronischer ballistischer Transistor und Verfahren zu seiner Herstellung |
US5343616B1 (en) * | 1992-02-14 | 1998-12-29 | Rock Ltd | Method of making high density self-aligning conductive networks and contact clusters |
JP2603411B2 (ja) | 1992-09-24 | 1997-04-23 | 株式会社ジーティシー | 液晶用配向膜およびその製法 |
JP2542790B2 (ja) * | 1993-10-15 | 1996-10-09 | 清二 加川 | 多孔質フィルムの製造装置 |
US5659477A (en) * | 1994-12-28 | 1997-08-19 | Collins; Charles Michael | Self reproducing fundamental fabricating machines (F-Units) |
EP0776063A1 (en) * | 1995-11-27 | 1997-05-28 | Nippon Paint Co., Ltd. | Electromagnetic wave absorbing and shielding |
JPH09148782A (ja) * | 1995-11-27 | 1997-06-06 | Nippon Paint Co Ltd | 透明電磁波吸収シールド材 |
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JP3782250B2 (ja) * | 1999-03-31 | 2006-06-07 | 共同印刷株式会社 | 電磁波シールド基材の製造方法 |
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JP2002059487A (ja) | 2000-08-14 | 2002-02-26 | Seiji Kagawa | 多孔質フィルムの製造装置 |
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TW583688B (en) * | 2002-02-21 | 2004-04-11 | Dainippon Printing Co Ltd | Electromagnetic shielding sheet and method of producing the same |
CN100471654C (zh) * | 2002-04-25 | 2009-03-25 | 加川清二 | 直线易撕性的热塑性树脂薄膜以及制造方法及其制造装置 |
US6486017B1 (en) * | 2002-06-04 | 2002-11-26 | Chartered Semiconductor Manufacturing Ltd. | Method of reducing substrate coupling for chip inductors by creation of dielectric islands by selective EPI deposition |
US7749620B2 (en) * | 2002-07-12 | 2010-07-06 | Fujimori Kogyo Co., Ltd. | Electromagnetic wave shield material and process for producing the same |
KR101011358B1 (ko) * | 2002-09-20 | 2011-01-28 | 세이지 까가와 | 폴리부틸렌 테레프탈레이트 필름의 제조 방법 및 제조장치, 및 형상 기억 폴리부틸렌 테레프탈레이트 적층 필름 |
US7489597B2 (en) * | 2004-09-27 | 2009-02-10 | Sharp Kabushiki Kaisha | Electromagnetic field generating element, information recording/reproducing head, and information recording/reproducing apparatus |
JP4976316B2 (ja) * | 2008-01-22 | 2012-07-18 | 清二 加川 | 電磁波吸収フィルム |
JP5038497B2 (ja) * | 2008-06-26 | 2012-10-03 | 清二 加川 | 電磁波吸収フィルム及びそれを用いた電磁波吸収体 |
-
2010
- 2010-02-12 JP JP2010535141A patent/JP4685977B2/ja active Active
- 2010-02-12 WO PCT/JP2010/052106 patent/WO2010093027A1/ja active Application Filing
- 2010-02-12 BR BRPI1001259A patent/BRPI1001259A2/pt not_active IP Right Cessation
- 2010-02-12 CN CN201080001708.9A patent/CN102046370B/zh active Active
- 2010-02-12 US US12/922,089 patent/US9238351B2/en active Active
- 2010-02-12 EP EP10741304.9A patent/EP2399734B1/en not_active Not-in-force
- 2010-02-12 KR KR1020107020364A patent/KR101688471B1/ko active IP Right Grant
- 2010-02-12 RU RU2011127548/04A patent/RU2519942C2/ru not_active IP Right Cessation
- 2010-02-22 TW TW099104981A patent/TWI511877B/zh active
-
2015
- 2015-09-02 US US14/843,449 patent/US9616640B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
EP2399734A1 (en) | 2011-12-28 |
RU2519942C2 (ru) | 2014-06-20 |
JPWO2010093027A1 (ja) | 2012-08-16 |
JP4685977B2 (ja) | 2011-05-18 |
KR101688471B1 (ko) | 2016-12-21 |
CN102046370A (zh) | 2011-05-04 |
RU2011127548A (ru) | 2013-01-10 |
US9616640B2 (en) | 2017-04-11 |
US9238351B2 (en) | 2016-01-19 |
WO2010093027A1 (ja) | 2010-08-19 |
US20150382518A1 (en) | 2015-12-31 |
EP2399734B1 (en) | 2017-08-16 |
TWI511877B (zh) | 2015-12-11 |
KR20110113715A (ko) | 2011-10-18 |
TW201107128A (en) | 2011-03-01 |
US20110008580A1 (en) | 2011-01-13 |
EP2399734A4 (en) | 2013-10-09 |
CN102046370B (zh) | 2014-05-14 |
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