BRPI0717583A2 - Formulações contendo benzoxazina polimerizáveis / curáveis em baixa temperatura. - Google Patents
Formulações contendo benzoxazina polimerizáveis / curáveis em baixa temperatura. Download PDFInfo
- Publication number
- BRPI0717583A2 BRPI0717583A2 BRPI0717583-3A BRPI0717583A BRPI0717583A2 BR PI0717583 A2 BRPI0717583 A2 BR PI0717583A2 BR PI0717583 A BRPI0717583 A BR PI0717583A BR PI0717583 A2 BRPI0717583 A2 BR PI0717583A2
- Authority
- BR
- Brazil
- Prior art keywords
- composition
- catalyst
- benzoxazine
- formula
- component
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F10/00—Homopolymers and copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G61/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
- C08G61/12—Macromolecular compounds containing atoms other than carbon in the main chain of the macromolecule
- C08G61/122—Macromolecular compounds containing atoms other than carbon in the main chain of the macromolecule derived from five- or six-membered heterocyclic compounds, other than imides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/02—Polyamines
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12044—OLED
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Organic Chemistry (AREA)
- Polymers & Plastics (AREA)
- Medicinal Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Paints Or Removers (AREA)
- Phenolic Resins Or Amino Resins (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Heterocyclic Carbon Compounds Containing A Hetero Ring Having Nitrogen And Oxygen As The Only Ring Hetero Atoms (AREA)
- Polyoxymethylene Polymers And Polymers With Carbon-To-Carbon Bonds (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP06019761.3 | 2006-09-21 | ||
| EP06019761 | 2006-09-21 | ||
| PCT/EP2007/059814 WO2008034814A2 (en) | 2006-09-21 | 2007-09-18 | Benzoxazine-containing formulations polymerizable/curable at low temperature |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| BRPI0717583A2 true BRPI0717583A2 (pt) | 2013-10-29 |
Family
ID=38819382
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| BRPI0717583-3A BRPI0717583A2 (pt) | 2006-09-21 | 2007-09-18 | Formulações contendo benzoxazina polimerizáveis / curáveis em baixa temperatura. |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US8318878B2 (enExample) |
| EP (1) | EP2064260B1 (enExample) |
| JP (1) | JP5658457B2 (enExample) |
| CN (1) | CN101516922B (enExample) |
| BR (1) | BRPI0717583A2 (enExample) |
| ES (1) | ES2550540T3 (enExample) |
| WO (1) | WO2008034814A2 (enExample) |
Families Citing this family (30)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101516961B (zh) * | 2006-09-21 | 2012-09-05 | 汉高两合股份公司 | 催化低温聚合 |
| EP2152784A1 (en) | 2007-05-25 | 2010-02-17 | Henkel AG & Co. KGaA | Benzoxazine-formulations with reduced outgassing behaviour |
| WO2009115488A1 (en) * | 2008-03-19 | 2009-09-24 | Henkel Ag & Co. Kgaa | Copolymerization method |
| US8389758B2 (en) | 2009-06-05 | 2013-03-05 | 3M Innovative Properties Company | Benzoxazine-thiol adducts |
| US8383706B2 (en) | 2009-06-05 | 2013-02-26 | 3M Innovative Properties Company | Benzoxazine-thiol adducts |
| US20110054100A1 (en) * | 2009-08-26 | 2011-03-03 | 3M Innovative Properties Company | Polybenzoxazine composition |
| EP2488580B1 (en) * | 2009-10-15 | 2015-09-09 | Henkel IP & Holding GmbH | Anaerobically curable compositions |
| EP2336221A1 (en) * | 2010-12-10 | 2011-06-22 | Henkel AG & Co. KGaA | Curable compositions |
| WO2013122800A1 (en) * | 2012-02-17 | 2013-08-22 | Huntsman Advanced Materials Americas Llc | Mixture of benzoxazine, epoxy and anhydride |
| US9896599B2 (en) * | 2013-04-30 | 2018-02-20 | 3M Innovative Properties Company | Process for preparing poly(benzoxazines) |
| CN108496260B (zh) | 2015-10-26 | 2020-05-19 | Oti照明公司 | 用于图案化表面上覆层的方法和包括图案化覆层的装置 |
| US11376815B2 (en) | 2015-12-16 | 2022-07-05 | Solvay Specialty Polymers Italy S.P.A. | Multilayer assembly |
| JP6968099B2 (ja) * | 2016-05-10 | 2021-11-17 | ハンツマン・アドバンスド・マテリアルズ・アメリカズ・エルエルシー | ベンズオキサジン樹脂のための潜在性触媒としてのベンゾチアゾール |
| CN106047270A (zh) * | 2016-05-26 | 2016-10-26 | 合肥市田源精铸有限公司 | 一种可用于低温的金属胶黏剂及其制备方法 |
| KR102383690B1 (ko) | 2016-06-30 | 2022-04-06 | 코오롱인더스트리 주식회사 | 벤족사진계 혼합물, 및 이의 용도 |
| EP3512895B1 (en) * | 2016-09-15 | 2020-11-04 | 3M Innovative Properties Company | Benzoxazine composition |
| KR20250068773A (ko) | 2016-12-02 | 2025-05-16 | 오티아이 루미오닉스 인크. | 방출 영역 위에 배치된 전도성 코팅을 포함하는 디바이스 및 이를 위한 방법 |
| CN110832660B (zh) | 2017-05-17 | 2023-07-28 | Oti照明公司 | 在图案化涂层上选择性沉积传导性涂层的方法和包括传导性涂层的装置 |
| CN108047870B (zh) * | 2017-11-23 | 2019-11-22 | 中国航发北京航空材料研究院 | 一种用于钛合金紧固件外表面的防护涂料及其制备方法 |
| US11751415B2 (en) | 2018-02-02 | 2023-09-05 | Oti Lumionics Inc. | Materials for forming a nucleation-inhibiting coating and devices incorporating same |
| WO2019215591A1 (en) | 2018-05-07 | 2019-11-14 | Oti Lumionics Inc. | Method for providing an auxiliary electrode and device including an auxiliary electrode |
| US12167634B2 (en) | 2018-11-23 | 2024-12-10 | Oti Lumionics Inc. | Optoelectronic device including a light transmissive region |
| WO2020169785A1 (en) | 2019-02-22 | 2020-08-27 | Universitat Autonoma De Barcelona | Process for polymerizing 1,3-benzoxazines |
| CN113785411B (zh) | 2019-03-07 | 2023-04-11 | Oti照明公司 | 用于形成成核抑制涂层的材料和结合所述成核抑制涂层的装置 |
| CN113950630A (zh) | 2019-04-18 | 2022-01-18 | Oti照明公司 | 用于形成成核抑制涂层的材料和结合所述成核抑制涂层的装置 |
| KR20220017918A (ko) | 2019-05-08 | 2022-02-14 | 오티아이 루미오닉스 인크. | 핵 생성 억제 코팅 형성용 물질 및 이를 포함하는 디바이스 |
| KR20240134240A (ko) | 2019-06-26 | 2024-09-06 | 오티아이 루미오닉스 인크. | 광 회절 특성을 갖는 광 투과 영역을 포함하는 광전자 디바이스 |
| US12302691B2 (en) | 2019-08-09 | 2025-05-13 | Oti Lumionics Inc. | Opto-electronic device including an auxiliary electrode and a partition |
| CN115552643B (zh) | 2019-12-24 | 2025-08-19 | Oti照明公司 | 包含覆盖层的发光装置和其制造方法 |
| JP2023553379A (ja) | 2020-12-07 | 2023-12-21 | オーティーアイ ルミオニクス インコーポレーテッド | 核形成抑制被膜及び下地金属被膜を用いた導電性堆積層のパターニング |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3424815A (en) * | 1967-05-29 | 1969-01-28 | Shell Oil Co | Olefin oligomerization |
| US3694410A (en) | 1969-03-05 | 1972-09-26 | Minnesota Mining & Mfg | Use of chelates in preparing polycyanurates |
| US3640989A (en) | 1969-05-02 | 1972-02-08 | Goodyear Tire & Rubber | Novel binary catalyst system for the polymerization of diolefins |
| JPS5040440B2 (enExample) * | 1972-06-02 | 1975-12-24 | ||
| US4628077A (en) | 1983-12-16 | 1986-12-09 | The Standard Oil Company | Preparation of polyamide with catalyst comprising transition metal attached to a ligand which contains electron withdrawing groups |
| US4501864A (en) * | 1983-12-22 | 1985-02-26 | Monsanto Company | Polymerizable compositions comprising polyamines and poly(dihydrobenzoxazines) |
| JPS61254621A (ja) * | 1985-05-08 | 1986-11-12 | Teijin Ltd | ポリエステルの製造法 |
| US5476716A (en) | 1988-10-17 | 1995-12-19 | The Dexter Corporation | Flame retardant epoxy molding compound, method and encapsulated device |
| EP0493310A1 (de) * | 1990-12-21 | 1992-07-01 | Gurit-Essex AG | Zu schwerentflammbaren Kunststoffen härtbare Harzmischungen und deren Verwendung |
| US5292859A (en) | 1992-12-22 | 1994-03-08 | E. I. Du Pont De Nemours And Company | Rare earth metal coordination compounds as lactone polymerization catalysts |
| JP3353847B2 (ja) * | 1993-05-12 | 2002-12-03 | 日立化成工業株式会社 | 半導体封止用樹脂組成物及び樹脂封止型半導体装置 |
| JP3724051B2 (ja) | 1996-04-25 | 2005-12-07 | 住友化学株式会社 | フェノールの酸化重合用触媒およびフェノールの酸化重合法 |
| US6376080B1 (en) * | 1999-06-07 | 2002-04-23 | Loctite Corporation | Method for preparing polybenzoxazine |
| JP2002128987A (ja) * | 2000-10-30 | 2002-05-09 | Sumitomo Bakelite Co Ltd | 熱硬化性樹脂組成物 |
| JP4570419B2 (ja) * | 2004-08-20 | 2010-10-27 | ナミックス株式会社 | 液状の封止用樹脂組成物 |
-
2007
- 2007-09-18 BR BRPI0717583-3A patent/BRPI0717583A2/pt not_active IP Right Cessation
- 2007-09-18 EP EP07820279.3A patent/EP2064260B1/en not_active Not-in-force
- 2007-09-18 CN CN2007800349434A patent/CN101516922B/zh active Active
- 2007-09-18 WO PCT/EP2007/059814 patent/WO2008034814A2/en not_active Ceased
- 2007-09-18 ES ES07820279.3T patent/ES2550540T3/es active Active
- 2007-09-18 US US12/442,298 patent/US8318878B2/en active Active
- 2007-09-18 JP JP2009528704A patent/JP5658457B2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| US8318878B2 (en) | 2012-11-27 |
| JP2010504386A (ja) | 2010-02-12 |
| EP2064260B1 (en) | 2015-08-26 |
| CN101516922B (zh) | 2013-03-06 |
| WO2008034814A2 (en) | 2008-03-27 |
| WO2008034814A3 (en) | 2008-07-03 |
| EP2064260A2 (en) | 2009-06-03 |
| ES2550540T3 (es) | 2015-11-10 |
| JP5658457B2 (ja) | 2015-01-28 |
| US20100144964A1 (en) | 2010-06-10 |
| CN101516922A (zh) | 2009-08-26 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| BRPI0717583A2 (pt) | Formulações contendo benzoxazina polimerizáveis / curáveis em baixa temperatura. | |
| KR101318456B1 (ko) | 전기 라미네이트의 제조에 유용한 균질한 비스말레이미드-트리아진-에폭시 조성물 | |
| TW201136990A (en) | Polyarylene sulfide having excellent and sustainable property, and preparation method thereof | |
| JP5750004B2 (ja) | 熱硬化性組成物、そのワニスおよびその熱硬化物 | |
| CA2889002A1 (en) | Cross-linked organic polymer compositions and methods for controlling cross-linking reaction rate and of modifying same to enhance processability | |
| KR20110112319A (ko) | 에폭시 수지용 금속 안정화제 | |
| CN102356099B (zh) | 耐磷酸的聚马来酰亚胺预聚物组合物 | |
| JP5474551B2 (ja) | 触媒による低温重合 | |
| TWI781304B (zh) | 樹脂組成物、清漆、積層板以及印刷配線基板 | |
| CN109563287B (zh) | 用于苯并噁嗪树脂作为潜在催化剂的苯并噻唑 | |
| CN101980604A (zh) | 储存稳定的聚马来酰亚胺预聚物组合物 | |
| JP6955329B2 (ja) | 硬化性樹脂組成物、それを用いた封止材及び半導体装置 | |
| BRPI0717583B1 (pt) | Catalisador de polimerização, composição curável, produto de copolimerização e/ou polimerização, usos de pelo menos um catalisador e de uma composição curável, método de revestimento de dispositivo e dispositivo | |
| JP6927535B2 (ja) | ディスプレイ基板用ポリイミドフィルム | |
| CN111315799B (zh) | 树脂组合物及其应用、树脂组合物的制造方法 | |
| CN101679629B (zh) | 具有减少的放气性能的苯并噁嗪制剂 | |
| BRPI0717577B1 (pt) | Composição curável, produto de copolimerização e polimerização, uso de catalisador de polimerização na composição curável, método de revestir um dispositivo e dispositivo | |
| TWI772579B (zh) | （甲基）丙烯酸系組成物的製造方法、包含（甲基）丙烯酸系組成物的塗料及硬化體 | |
| JP2019035035A (ja) | 熱硬化性樹脂組成物及び熱硬化性樹脂 | |
| JP6706818B2 (ja) | 半導体装置 | |
| JPH04202529A (ja) | 熱硬化性樹脂組成物 | |
| JPWO2018043380A1 (ja) | マレイミド樹脂成型体、マレイミド樹脂成型体の製造方法、マレイミド樹脂組成物及びその硬化物 | |
| JP4507034B2 (ja) | イミド骨格ポリエステル樹脂及びそれを用いた熱硬化型樹脂組成物並びにその硬化物 | |
| JPS59149923A (ja) | 耐熱性成形組成物 | |
| JPS61113610A (ja) | 耐熱性成形組成物 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| B07A | Application suspended after technical examination (opinion) [chapter 7.1 patent gazette] | ||
| B09A | Decision: intention to grant [chapter 9.1 patent gazette] | ||
| B16A | Patent or certificate of addition of invention granted [chapter 16.1 patent gazette] | ||
| B21F | Lapse acc. art. 78, item iv - on non-payment of the annual fees in time |
Free format text: REFERENTE A 17A ANUIDADE. |
|
| B24J | Lapse because of non-payment of annual fees (definitively: art 78 iv lpi, resolution 113/2013 art. 12) |
Free format text: EM VIRTUDE DA EXTINCAO PUBLICADA NA RPI 2792 DE 09-07-2024 E CONSIDERANDO AUSENCIA DE MANIFESTACAO DENTRO DOS PRAZOS LEGAIS, INFORMO QUE CABE SER MANTIDA A EXTINCAO DA PATENTE E SEUS CERTIFICADOS, CONFORME O DISPOSTO NO ARTIGO 12, DA RESOLUCAO 113/2013. |