JP5658457B2 - 低温重合性/硬化性ベンゾオキサジン含有処方物 - Google Patents

低温重合性/硬化性ベンゾオキサジン含有処方物 Download PDF

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Publication number
JP5658457B2
JP5658457B2 JP2009528704A JP2009528704A JP5658457B2 JP 5658457 B2 JP5658457 B2 JP 5658457B2 JP 2009528704 A JP2009528704 A JP 2009528704A JP 2009528704 A JP2009528704 A JP 2009528704A JP 5658457 B2 JP5658457 B2 JP 5658457B2
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Prior art keywords
composition
composition according
group
benzoxazine
formula
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Expired - Fee Related
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JP2009528704A
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English (en)
Japanese (ja)
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JP2010504386A5 (enExample
JP2010504386A (ja
Inventor
須藤 篤
篤 須藤
遠藤 剛
剛 遠藤
アンドレアス・ターデン
ライナー・シェーンフェルト
トーマス・フーヴァー
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Henkel AG and Co KGaA
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Henkel AG and Co KGaA
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Publication of JP2010504386A5 publication Critical patent/JP2010504386A5/ja
Application granted granted Critical
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Expired - Fee Related legal-status Critical Current
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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/28Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293Organic, e.g. plastic
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F10/00Homopolymers and copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G61/00Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
    • C08G61/12Macromolecular compounds containing atoms other than carbon in the main chain of the macromolecule
    • C08G61/122Macromolecular compounds containing atoms other than carbon in the main chain of the macromolecule derived from five- or six-membered heterocyclic compounds, other than imides
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/02Polyamines
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/11Device type
    • H01L2924/12Passive devices, e.g. 2 terminal devices
    • H01L2924/1204Optical Diode
    • H01L2924/12044OLED

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Paints Or Removers (AREA)
  • Phenolic Resins Or Amino Resins (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
  • Heterocyclic Carbon Compounds Containing A Hetero Ring Having Nitrogen And Oxygen As The Only Ring Hetero Atoms (AREA)
  • Polyoxymethylene Polymers And Polymers With Carbon-To-Carbon Bonds (AREA)
JP2009528704A 2006-09-21 2007-09-18 低温重合性/硬化性ベンゾオキサジン含有処方物 Expired - Fee Related JP5658457B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP06019761 2006-09-21
EP06019761.3 2006-09-21
PCT/EP2007/059814 WO2008034814A2 (en) 2006-09-21 2007-09-18 Benzoxazine-containing formulations polymerizable/curable at low temperature

Publications (3)

Publication Number Publication Date
JP2010504386A JP2010504386A (ja) 2010-02-12
JP2010504386A5 JP2010504386A5 (enExample) 2010-11-11
JP5658457B2 true JP5658457B2 (ja) 2015-01-28

Family

ID=38819382

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009528704A Expired - Fee Related JP5658457B2 (ja) 2006-09-21 2007-09-18 低温重合性/硬化性ベンゾオキサジン含有処方物

Country Status (7)

Country Link
US (1) US8318878B2 (enExample)
EP (1) EP2064260B1 (enExample)
JP (1) JP5658457B2 (enExample)
CN (1) CN101516922B (enExample)
BR (1) BRPI0717583A2 (enExample)
ES (1) ES2550540T3 (enExample)
WO (1) WO2008034814A2 (enExample)

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101516961B (zh) * 2006-09-21 2012-09-05 汉高两合股份公司 催化低温聚合
WO2008145526A1 (en) * 2007-05-25 2008-12-04 Henkel Ag & Co. Kgaa Benzoxazine-formulations with reduced outgassing behaviour
WO2009115488A1 (en) * 2008-03-19 2009-09-24 Henkel Ag & Co. Kgaa Copolymerization method
US8389758B2 (en) 2009-06-05 2013-03-05 3M Innovative Properties Company Benzoxazine-thiol adducts
US8383706B2 (en) 2009-06-05 2013-02-26 3M Innovative Properties Company Benzoxazine-thiol adducts
US20110054100A1 (en) * 2009-08-26 2011-03-03 3M Innovative Properties Company Polybenzoxazine composition
JP5654026B2 (ja) * 2009-10-15 2015-01-14 ヘンケル コーポレイションHenkel Corporation 嫌気硬化性組成物
EP2336221A1 (en) * 2010-12-10 2011-06-22 Henkel AG & Co. KGaA Curable compositions
EP2814802B1 (en) * 2012-02-17 2020-12-16 Huntsman Advanced Materials Americas LLC Mixture of benzoxazine, epoxy and anhydride
EP2992057B1 (en) * 2013-04-30 2018-01-31 3M Innovative Properties Company Process for preparing poly(benzoxazines)
US10270033B2 (en) 2015-10-26 2019-04-23 Oti Lumionics Inc. Method for patterning a coating on a surface and device including a patterned coating
WO2017102405A1 (en) * 2015-12-16 2017-06-22 Solvay Specialty Polymers Italy S.P.A. Multilayer assembly
US10889686B2 (en) * 2016-05-10 2021-01-12 Huntsman Advanced Materials Americas Llc Benzothiazoles as latent catalysts for benzoxazine resins
CN106047270A (zh) * 2016-05-26 2016-10-26 合肥市田源精铸有限公司 一种可用于低温的金属胶黏剂及其制备方法
KR102383690B1 (ko) 2016-06-30 2022-04-06 코오롱인더스트리 주식회사 벤족사진계 혼합물, 및 이의 용도
CN109715689B (zh) * 2016-09-15 2022-08-09 3M创新有限公司 苯并噁嗪组合物
WO2018100559A1 (en) 2016-12-02 2018-06-07 Oti Lumionics Inc. Device including a conductive coating disposed over emissive regions and method therefor
KR102685809B1 (ko) 2017-05-17 2024-07-18 오티아이 루미오닉스 인크. 패턴화 코팅 위에 전도성 코팅을 선택적으로 증착시키는 방법 및 전도성 코팅을 포함하는 디바이스
CN108047870B (zh) * 2017-11-23 2019-11-22 中国航发北京航空材料研究院 一种用于钛合金紧固件外表面的防护涂料及其制备方法
US11751415B2 (en) 2018-02-02 2023-09-05 Oti Lumionics Inc. Materials for forming a nucleation-inhibiting coating and devices incorporating same
KR20250150689A (ko) 2018-05-07 2025-10-20 오티아이 루미오닉스 인크. 보조 전극을 제공하는 방법 및 보조 전극을 포함하는 장치
CN112889162A (zh) 2018-11-23 2021-06-01 Oti照明公司 包括光透射区域的光电装置
WO2020169785A1 (en) 2019-02-22 2020-08-27 Universitat Autonoma De Barcelona Process for polymerizing 1,3-benzoxazines
WO2020178804A1 (en) 2019-03-07 2020-09-10 Oti Lumionics Inc. Materials for forming a nucleation-inhibiting coating and devices incorporating same
KR20250110358A (ko) 2019-04-18 2025-07-18 오티아이 루미오닉스 인크. 핵 생성 억제 코팅 형성용 물질 및 이를 포함하는 디바이스
US12069938B2 (en) 2019-05-08 2024-08-20 Oti Lumionics Inc. Materials for forming a nucleation-inhibiting coating and devices incorporating same
KR20240134240A (ko) 2019-06-26 2024-09-06 오티아이 루미오닉스 인크. 광 회절 특성을 갖는 광 투과 영역을 포함하는 광전자 디바이스
US12302691B2 (en) 2019-08-09 2025-05-13 Oti Lumionics Inc. Opto-electronic device including an auxiliary electrode and a partition
US11737298B2 (en) 2019-12-24 2023-08-22 Oti Lumionics Inc. Light emitting device including capping layers on respective emissive regions
CA3240373A1 (en) 2020-12-07 2022-06-16 Michael HELANDER Patterning a conductive deposited layer using a nucleation inhibiting coating and an underlying metallic coating

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3424815A (en) * 1967-05-29 1969-01-28 Shell Oil Co Olefin oligomerization
US3694410A (en) * 1969-03-05 1972-09-26 Minnesota Mining & Mfg Use of chelates in preparing polycyanurates
US3640989A (en) 1969-05-02 1972-02-08 Goodyear Tire & Rubber Novel binary catalyst system for the polymerization of diolefins
JPS5040440B2 (enExample) * 1972-06-02 1975-12-24
US4628077A (en) 1983-12-16 1986-12-09 The Standard Oil Company Preparation of polyamide with catalyst comprising transition metal attached to a ligand which contains electron withdrawing groups
US4501864A (en) * 1983-12-22 1985-02-26 Monsanto Company Polymerizable compositions comprising polyamines and poly(dihydrobenzoxazines)
JPS61254621A (ja) * 1985-05-08 1986-11-12 Teijin Ltd ポリエステルの製造法
US5476716A (en) 1988-10-17 1995-12-19 The Dexter Corporation Flame retardant epoxy molding compound, method and encapsulated device
EP0493310A1 (de) * 1990-12-21 1992-07-01 Gurit-Essex AG Zu schwerentflammbaren Kunststoffen härtbare Harzmischungen und deren Verwendung
US5292859A (en) 1992-12-22 1994-03-08 E. I. Du Pont De Nemours And Company Rare earth metal coordination compounds as lactone polymerization catalysts
JP3353847B2 (ja) * 1993-05-12 2002-12-03 日立化成工業株式会社 半導体封止用樹脂組成物及び樹脂封止型半導体装置
JP3724051B2 (ja) 1996-04-25 2005-12-07 住友化学株式会社 フェノールの酸化重合用触媒およびフェノールの酸化重合法
US6376080B1 (en) * 1999-06-07 2002-04-23 Loctite Corporation Method for preparing polybenzoxazine
JP2002128987A (ja) * 2000-10-30 2002-05-09 Sumitomo Bakelite Co Ltd 熱硬化性樹脂組成物
JP4570419B2 (ja) * 2004-08-20 2010-10-27 ナミックス株式会社 液状の封止用樹脂組成物

Also Published As

Publication number Publication date
ES2550540T3 (es) 2015-11-10
EP2064260A2 (en) 2009-06-03
BRPI0717583A2 (pt) 2013-10-29
WO2008034814A3 (en) 2008-07-03
JP2010504386A (ja) 2010-02-12
WO2008034814A2 (en) 2008-03-27
EP2064260B1 (en) 2015-08-26
US20100144964A1 (en) 2010-06-10
CN101516922A (zh) 2009-08-26
CN101516922B (zh) 2013-03-06
US8318878B2 (en) 2012-11-27

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