BRPI0516703A - composição de resina sólida curável, composição de revestimento em pó curável, processo para preparar uma composição de resina sólida curável, processo para preparar uma composição de revestimento em pó curável, processo para preparar um substrato revestido e artigo revestido - Google Patents

composição de resina sólida curável, composição de revestimento em pó curável, processo para preparar uma composição de resina sólida curável, processo para preparar uma composição de revestimento em pó curável, processo para preparar um substrato revestido e artigo revestido

Info

Publication number
BRPI0516703A
BRPI0516703A BRPI0516703-5A BRPI0516703A BRPI0516703A BR PI0516703 A BRPI0516703 A BR PI0516703A BR PI0516703 A BRPI0516703 A BR PI0516703A BR PI0516703 A BRPI0516703 A BR PI0516703A
Authority
BR
Brazil
Prior art keywords
preparing
curable
resin composition
powder coating
solid resin
Prior art date
Application number
BRPI0516703-5A
Other languages
English (en)
Portuguese (pt)
Inventor
Kandathil E Verghese
Marcos Franca
Original Assignee
Dow Global Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Global Technologies Inc filed Critical Dow Global Technologies Inc
Publication of BRPI0516703A publication Critical patent/BRPI0516703A/pt

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/02—Polyalkylene oxides
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S525/00—Synthetic resins or natural rubbers -- part of the class 520 series
    • Y10S525/934—Powdered coating composition
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Paints Or Removers (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
BRPI0516703-5A 2004-11-10 2005-11-02 composição de resina sólida curável, composição de revestimento em pó curável, processo para preparar uma composição de resina sólida curável, processo para preparar uma composição de revestimento em pó curável, processo para preparar um substrato revestido e artigo revestido BRPI0516703A (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US62661204P 2004-11-10 2004-11-10
PCT/US2005/039966 WO2006052730A1 (en) 2004-11-10 2005-11-02 Amphiphilic block copolymer-toughened epoxy resins and powder coatings made therefrom

Publications (1)

Publication Number Publication Date
BRPI0516703A true BRPI0516703A (pt) 2008-09-16

Family

ID=35766914

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI0516703-5A BRPI0516703A (pt) 2004-11-10 2005-11-02 composição de resina sólida curável, composição de revestimento em pó curável, processo para preparar uma composição de resina sólida curável, processo para preparar uma composição de revestimento em pó curável, processo para preparar um substrato revestido e artigo revestido

Country Status (15)

Country Link
US (1) US8021586B2 (https=)
EP (1) EP1812513B1 (https=)
JP (1) JP5260055B2 (https=)
KR (1) KR101226377B1 (https=)
CN (1) CN101056936B (https=)
AT (1) ATE458788T1 (https=)
BR (1) BRPI0516703A (https=)
CA (1) CA2582341A1 (https=)
DE (1) DE602005019608D1 (https=)
ES (1) ES2338680T3 (https=)
MX (1) MX2007005601A (https=)
NO (1) NO20071761L (https=)
RU (1) RU2389743C2 (https=)
TW (1) TW200624520A (https=)
WO (1) WO2006052730A1 (https=)

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EP2182025B1 (de) 2008-10-31 2010-10-06 Sika Technology AG Hitzehärtende Epoxidharzzusammensetzungen einsetzbar als Rohbauklebstoff oder Strukturschaum
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EP2365046A1 (de) 2010-03-02 2011-09-14 Sika Technology AG Schlagzäher bei Raumtemperatur härtender zwei-komponentiger Strukturklebstoff
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MX365593B (es) 2011-12-20 2019-06-07 Dow Global Technologies Llc Proceso para preparar compuestos epoxicos curados.
KR102173954B1 (ko) * 2012-08-13 2020-11-04 헨켈 아이피 앤드 홀딩 게엠베하 액체 압축 성형 캡슐화제
US9988508B2 (en) 2012-08-20 2018-06-05 Mitsubishi Chemical Corporation Epoxy-resin composition and film, prepreg, and fiber-reinforced plastic using same
KR20200063250A (ko) * 2012-10-17 2020-06-04 다우 글로벌 테크놀로지스 엘엘씨 코어 쉘 고무 개질된 고체 에폭시 수지
CN104837921B (zh) 2012-11-07 2018-04-13 陶氏环球技术有限公司 可固化环氧树脂组合物和由其制成的复合物
JP6377074B2 (ja) * 2012-12-20 2018-08-22 ダウ グローバル テクノロジーズ エルエルシー 無線通信塔のためのポリマー複合体構成部品
CN103387663B (zh) * 2013-07-29 2016-02-17 山东理工大学 制备端基含巯基的两亲性嵌段共聚物的方法
KR101355979B1 (ko) * 2013-11-06 2014-02-03 주식회사 신아티앤씨 전기적 특성이 우수한 폴리 에폭시 수지, 이의 조성물 및 제조방법
CN105315614B (zh) * 2014-07-31 2018-10-30 太阳油墨（苏州）有限公司 印刷电路板的填孔用热固化性树脂组合物、固化物、及印刷电路板
US10208157B2 (en) * 2014-09-11 2019-02-19 Blue Cube Ip Llc Ester resins
CN105598858B (zh) * 2014-10-29 2018-11-09 厦门精铎建筑科技有限公司 热固性树脂结合剂金刚石磨具
US10392539B2 (en) 2014-12-31 2019-08-27 Dow Global Technologies Llc Crash durable epoxy adhesive compositions having improved low-temperature impact resistance and wash off resistance
WO2016197305A1 (en) * 2015-06-08 2016-12-15 Blue Cube Ip Llc Coating composition
CN106336859B (zh) 2015-07-07 2019-05-24 中国石油化工股份有限公司 一种组合物及其应用和油基钻井液及提高油基钻井液切力的方法
CN105906814A (zh) * 2016-06-13 2016-08-31 四川大学 端环氧基聚醚及其制备方法与作为环氧树脂增韧剂的应用
EP3532527A1 (en) 2016-10-28 2019-09-04 Dow Global Technologies, LLC Crash durable epoxy adhesive having improved low-temperature impact resistance
WO2019087877A1 (ja) * 2017-11-02 2019-05-09 日鉄ケミカル＆マテリアル株式会社 エポキシ樹脂組成物及びその硬化物
US11820915B2 (en) 2018-12-14 2023-11-21 Swimc Llc Fusion bonded epoxy rebar powder coatings
CN110066494B (zh) * 2019-05-07 2022-05-17 金安国纪科技（杭州）有限公司 环氧树脂组合物及其制备方法和应用、铝基覆铜板
US11459482B2 (en) * 2020-06-19 2022-10-04 Pall Corporation Icephobic coating and coated articles
JP7541419B2 (ja) * 2022-04-22 2024-08-28 エル・コーポレイション アクリレート官能基を有する線状ブロック共重合体強化剤
CN115386282B (zh) * 2022-10-07 2023-04-28 浙江绿环新材料科技有限公司 一种高效防腐粉末涂料及其制备方法
CN115746261A (zh) * 2022-12-20 2023-03-07 江西科技师范大学 一种改性环氧聚合物及其制备方法和一种粉末涂料
CN118599399B (zh) * 2024-06-24 2024-11-12 浙江捷宇新材料科技股份有限公司 一种消防管道用防腐粉末涂料及其制备方法

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Also Published As

Publication number Publication date
ATE458788T1 (de) 2010-03-15
ES2338680T3 (es) 2010-05-11
MX2007005601A (es) 2007-05-23
EP1812513A1 (en) 2007-08-01
JP5260055B2 (ja) 2013-08-14
CN101056936B (zh) 2012-05-23
KR20070084115A (ko) 2007-08-24
RU2389743C2 (ru) 2010-05-20
WO2006052730A1 (en) 2006-05-18
US8021586B2 (en) 2011-09-20
NO20071761L (no) 2007-08-08
CA2582341A1 (en) 2006-05-18
DE602005019608D1 (de) 2010-04-08
US20080188626A1 (en) 2008-08-07
KR101226377B1 (ko) 2013-01-24
EP1812513B1 (en) 2010-02-24
CN101056936A (zh) 2007-10-17
TW200624520A (en) 2006-07-16
RU2007121664A (ru) 2008-12-20
JP2008519889A (ja) 2008-06-12

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Legal Events

Date Code Title Description
B08F Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette]

Free format text: REFERENTE AS 3A E 4A ANUIDADES.

B08K Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette]

Free format text: REFERENTE AO DESPACHO 8.6 PUBLICADO NA RPI 2160 DE 29/05/2012.