BRPI0516703A - composição de resina sólida curável, composição de revestimento em pó curável, processo para preparar uma composição de resina sólida curável, processo para preparar uma composição de revestimento em pó curável, processo para preparar um substrato revestido e artigo revestido - Google Patents

composição de resina sólida curável, composição de revestimento em pó curável, processo para preparar uma composição de resina sólida curável, processo para preparar uma composição de revestimento em pó curável, processo para preparar um substrato revestido e artigo revestido

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Publication number
BRPI0516703A
BRPI0516703A BRPI0516703-5A BRPI0516703A BRPI0516703A BR PI0516703 A BRPI0516703 A BR PI0516703A BR PI0516703 A BRPI0516703 A BR PI0516703A BR PI0516703 A BRPI0516703 A BR PI0516703A
Authority
BR
Brazil
Prior art keywords
preparing
curable
resin composition
powder coating
solid resin
Prior art date
Application number
BRPI0516703-5A
Other languages
English (en)
Inventor
Kandathil E Verghese
Marcos Franca
Original Assignee
Dow Global Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Global Technologies Inc filed Critical Dow Global Technologies Inc
Publication of BRPI0516703A publication Critical patent/BRPI0516703A/pt

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/02—Polyalkylene oxides
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S525/00—Synthetic resins or natural rubbers -- part of the class 520 series
    • Y10S525/934—Powdered coating composition
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether

Abstract

COMPOSIçãO DE RESINA SóLIDA CURáVEL, COMPOSIçãO DE REVESTIMENTO EM Pó CURáVEL, PROCESSO PARA PREPARAR UMA COMPOSIçãO DE RESINA SóLIDA CURáVEL, PROCESSO PARA PREPARAR UMA COMPOSIçãO DE REVESTIMENTO EM Pó CURáVEL, PROCESSO PARA PREPARAR UM SUESTRATO REVESTIDO E ARTIGO REVESTIDO. A presente invenção refere-se a uma composição de resina curável e a composições de revestimento em pó feita da mesma incluindo(a) uma resina epóxi; (b) um copolímero em bloco anfifílico contendo pelo menos um segmento de bloco miscível com resina epóxi e pelo menos um segmento de bloco imiscível com resina epóxi; sendo que o segmento de bloco imiscível compreende pelo menos uma estrutura de poliéter com a ressalva de que a estrutura de poliéter do dito segmento de bloco imiscível contenha pelo menos uma ou mais unidades de monómero de óxido de alquileno tendo pelo menos quatro átomos de carbono; de maneira tal que quando a composição de resina epóxi seja curada, a tenacidade da composição de resina epóxi curada seja aumentada; e (c) pelo menos um agente de cura requerido para a manufatura, aplicação e desempenho adequado do revestimento em pó. O copolímero em bloco anfifílico é preferivelmente um copolímero em bloco integralmente de póliéter, tal como um copolímero em dibloco de PEO-PBO ou um copolímero em tribloco de PEO-PBO-PEO.
BRPI0516703-5A 2004-11-10 2005-11-02 composição de resina sólida curável, composição de revestimento em pó curável, processo para preparar uma composição de resina sólida curável, processo para preparar uma composição de revestimento em pó curável, processo para preparar um substrato revestido e artigo revestido BRPI0516703A (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US62661204P 2004-11-10 2004-11-10
PCT/US2005/039966 WO2006052730A1 (en) 2004-11-10 2005-11-02 Amphiphilic block copolymer-toughened epoxy resins and powder coatings made therefrom

Publications (1)

Publication Number Publication Date
BRPI0516703A true BRPI0516703A (pt) 2008-09-16

Family

ID=35766914

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI0516703-5A BRPI0516703A (pt) 2004-11-10 2005-11-02 composição de resina sólida curável, composição de revestimento em pó curável, processo para preparar uma composição de resina sólida curável, processo para preparar uma composição de revestimento em pó curável, processo para preparar um substrato revestido e artigo revestido

Country Status (15)

Country Link
US (1) US8021586B2 (pt)
EP (1) EP1812513B1 (pt)
JP (1) JP5260055B2 (pt)
KR (1) KR101226377B1 (pt)
CN (1) CN101056936B (pt)
AT (1) ATE458788T1 (pt)
BR (1) BRPI0516703A (pt)
CA (1) CA2582341A1 (pt)
DE (1) DE602005019608D1 (pt)
ES (1) ES2338680T3 (pt)
MX (1) MX2007005601A (pt)
NO (1) NO20071761L (pt)
RU (1) RU2389743C2 (pt)
TW (1) TW200624520A (pt)
WO (1) WO2006052730A1 (pt)

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MX361304B (es) * 2012-12-20 2018-12-03 Dow Global Technologies Llc Componentes de compuestos polimericos para torres de comunicaciones inalambricas.
CN103387663B (zh) * 2013-07-29 2016-02-17 山东理工大学 制备端基含巯基的两亲性嵌段共聚物的方法
KR101355979B1 (ko) * 2013-11-06 2014-02-03 주식회사 신아티앤씨 전기적 특성이 우수한 폴리 에폭시 수지, 이의 조성물 및 제조방법
CN105315614B (zh) * 2014-07-31 2018-10-30 太阳油墨（苏州）有限公司 印刷电路板的填孔用热固化性树脂组合物、固化物、及印刷电路板
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CN106336859B (zh) 2015-07-07 2019-05-24 中国石油化工股份有限公司 一种组合物及其应用和油基钻井液及提高油基钻井液切力的方法
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Also Published As

Publication number Publication date
CN101056936B (zh) 2012-05-23
DE602005019608D1 (de) 2010-04-08
JP5260055B2 (ja) 2013-08-14
EP1812513A1 (en) 2007-08-01
US20080188626A1 (en) 2008-08-07
ES2338680T3 (es) 2010-05-11
NO20071761L (no) 2007-08-08
CA2582341A1 (en) 2006-05-18
KR101226377B1 (ko) 2013-01-24
JP2008519889A (ja) 2008-06-12
MX2007005601A (es) 2007-05-23
ATE458788T1 (de) 2010-03-15
RU2007121664A (ru) 2008-12-20
RU2389743C2 (ru) 2010-05-20
KR20070084115A (ko) 2007-08-24
WO2006052730A1 (en) 2006-05-18
TW200624520A (en) 2006-07-16
CN101056936A (zh) 2007-10-17
EP1812513B1 (en) 2010-02-24
US8021586B2 (en) 2011-09-20

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Legal Events

Date Code Title Description
B08F Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette]

Free format text: REFERENTE AS 3A E 4A ANUIDADES.

B08K Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette]

Free format text: REFERENTE AO DESPACHO 8.6 PUBLICADO NA RPI 2160 DE 29/05/2012.