BRPI0411147A - composição e processo - Google Patents

composição e processo

Info

Publication number
BRPI0411147A
BRPI0411147A BRPI0411147-8A BRPI0411147A BRPI0411147A BR PI0411147 A BRPI0411147 A BR PI0411147A BR PI0411147 A BRPI0411147 A BR PI0411147A BR PI0411147 A BRPI0411147 A BR PI0411147A
Authority
BR
Brazil
Prior art keywords
composition
solvent
mold
optionally
mold release
Prior art date
Application number
BRPI0411147-8A
Other languages
English (en)
Portuguese (pt)
Inventor
Robert Harvey Moffett
Original Assignee
Du Pont
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Du Pont filed Critical Du Pont
Publication of BRPI0411147A publication Critical patent/BRPI0411147A/pt

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
    • C09D183/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/56—Coatings, e.g. enameled or galvanised; Releasing, lubricating or separating agents
    • B29C33/60—Releasing, lubricating or separating agents
    • B29C33/62—Releasing, lubricating or separating agents based on polymers or oligomers
    • B29C33/64—Silicone
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Wood Science & Technology (AREA)
  • Materials Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Paints Or Removers (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
BRPI0411147-8A 2003-05-23 2004-05-14 composição e processo BRPI0411147A (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/444,801 US20040235683A1 (en) 2003-05-23 2003-05-23 Mold release composition and process therewith
PCT/US2004/015266 WO2004106026A1 (en) 2003-05-23 2004-05-14 Mold release composition and process therewith

Publications (1)

Publication Number Publication Date
BRPI0411147A true BRPI0411147A (pt) 2006-07-11

Family

ID=33450752

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI0411147-8A BRPI0411147A (pt) 2003-05-23 2004-05-14 composição e processo

Country Status (11)

Country Link
US (1) US20040235683A1 (https=)
EP (1) EP1626849B1 (https=)
JP (1) JP4745241B2 (https=)
KR (1) KR101125400B1 (https=)
CN (1) CN100339204C (https=)
AU (1) AU2004242601B2 (https=)
BR (1) BRPI0411147A (https=)
CA (1) CA2523691C (https=)
DE (1) DE602004004267T2 (https=)
MX (1) MXPA05012539A (https=)
WO (1) WO2004106026A1 (https=)

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WO2005012431A1 (en) * 2003-07-25 2005-02-10 Henkel Corporation Low voc-solvent based mold release agent and curable mold release compositions based thereon
DE102004036343B4 (de) * 2004-07-27 2007-02-15 Ipgr International Partners In Glass Research Beschichtungsmaterial für eine Glasform und Verfahren zum Beschichten einer Glasform
US7318937B2 (en) * 2005-03-18 2008-01-15 Closure Medical Corporation Liquid coating compositions
US20070141362A1 (en) * 2005-12-19 2007-06-21 Elkins Casey L Composition for coating substrate to prevent sticking
US20070160547A1 (en) * 2006-01-11 2007-07-12 Janet Duffy Method of applying a composition
WO2008048565A1 (en) * 2006-10-16 2008-04-24 E.I. Du Pont De Nemours And Company Mold release composition and method for producing a rotational molding paint-ready polyurethane
US7851535B2 (en) 2007-07-26 2010-12-14 Henkel Corporation Mold release agents employing polyvinyl alcohol
WO2009042227A2 (en) * 2007-09-27 2009-04-02 Henkel Corporation Two-component high gloss semi-permanent water based release agent for polyester substrates
KR101725559B1 (ko) * 2009-10-06 2017-04-10 데쿠세리아루즈 가부시키가이샤 이형제 조성물, 이형 필름 및 이것을 사용한 접착 필름
CN101899779B (zh) * 2010-08-12 2013-04-24 浙江传化股份有限公司 一种100%有机硅涂层整理剂及其应用
CN102010149B (zh) * 2010-10-15 2013-02-13 航天材料及工艺研究所 一种水溶性模具及其制备方法和成型复合材料方法
JP2014148657A (ja) * 2013-01-30 2014-08-21 Dow Corning Corp 表面処理用組成物、表面処理された物品の調製方法及び表面処理された物品
US20160001468A1 (en) * 2013-02-26 2016-01-07 Bennett Precision Tooling Nsw Pty Ltd A method of preparing a mould for injection molding
JP2014210861A (ja) * 2013-04-19 2014-11-13 株式会社きもと 離型性能回復液、離型性能回復方法及びフォトマスク
US10036481B2 (en) * 2014-09-19 2018-07-31 Nibco Inc. Isolation valve with thermoplastic overmolding
CN105799104B (zh) * 2014-12-31 2018-07-24 上海荣信塑料有限公司 一种食品包装用塑料制品脱模剂及其生产方法
CN104608298A (zh) * 2015-01-13 2015-05-13 上海应用技术学院 一种注塑工业用的干性脱模剂及其制备方法
CN104647660A (zh) * 2015-02-09 2015-05-27 上海应用技术学院 一种注塑工业用的干性脱模剂及其制备方法
CN104762057B (zh) * 2015-04-03 2017-03-15 肇庆皓明有机硅材料有限公司 一种有机硅电子封装材料及其制备方法
CN104893562A (zh) * 2015-05-25 2015-09-09 巨化集团技术中心 一种橡胶制品成型模具用不粘涂料及其制备方法
JP2017024271A (ja) * 2015-07-23 2017-02-02 モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 ポリウレタンフォーム成形用離型剤組成物および軟質ポリウレタンフォームの製造方法
CN105216179A (zh) * 2015-09-06 2016-01-06 河南平高电气股份有限公司 一种环氧树脂浇注件用离型剂及其制备方法
CN105111031B (zh) * 2015-09-22 2017-08-29 中国工程物理研究院化工材料研究所 大型炸药件的脱模方法
CN105295723B (zh) * 2015-11-27 2017-07-07 怀化学院 一种固化型涂层组合物及其应用
CN106608008B (zh) * 2016-11-28 2018-11-23 西安空间无线电技术研究所 一种脱模剂及其制备方法和在环氧树脂灌封中的应用
CN106985264A (zh) * 2017-03-30 2017-07-28 佛山市蓝海石英石材有限公司 一种石英石水性脱模剂及其制备方法
CN107603704B (zh) * 2017-09-17 2020-09-01 石家庄市长安育才建材有限公司 用于清水混凝土的水性脱模剂及其制备方法
CN113165224B (zh) * 2018-11-23 2023-09-19 巴斯夫涂料有限公司 涂覆部件的注射模塑的手动方法
CN113166526B (zh) * 2018-11-23 2024-02-23 巴斯夫涂料有限公司 用于涂覆基材的自脱模模内涂层(imc)
KR102802709B1 (ko) 2018-12-07 2025-05-08 다우 도레이 캄파니 리미티드 필름 형성용 경화성 오가노폴리실록산 조성물 및 오가노폴리실록산 경화물 필름의 제조 방법
TWI845567B (zh) * 2018-12-07 2024-06-21 日商陶氏東麗股份有限公司 薄膜形成用固化性有機聚矽氧烷組成物以及有機聚矽氧烷固化物薄膜之製造方法
KR102247362B1 (ko) * 2019-05-17 2021-04-30 박성철 타이어 블래더용 이형코팅제 조성물 및 그의 제조방법
WO2020241164A1 (ja) * 2019-05-24 2020-12-03 信越化学工業株式会社 プラスチック用離型剤
CN111421103B (zh) * 2020-03-04 2021-04-02 东莞市溢美材料科技有限公司 一种一锅法合成水性有机硅金属压铸脱模剂
EP4146461B1 (en) 2020-05-07 2024-03-13 Alcon Inc. Method for producing silicone hydrogel contact lenses
JP2023529289A (ja) * 2020-05-14 2023-07-10 クェーカー・ケミカル・コーポレーション 水溶性シリコーン系離型剤
CN115461414B (zh) * 2020-06-29 2024-06-25 日东化成株式会社 用于聚合物固化的固化催化剂及其制造方法、湿气固化型组合物、固化物的制造方法
US11624467B2 (en) 2020-12-09 2023-04-11 Nibco Inc. Fusion outlet isolation valve with thermoplastic overmolding
CN112831053B (zh) * 2021-02-24 2022-04-29 烟台大学 一种反应型有机硅脱模剂及其制备方法
MX2023013822A (es) * 2021-05-25 2024-01-10 Henkel Ag & Co Kgaa Composiciones curables para material compuesto y liberacion de herramientas.
CN114515815A (zh) * 2022-02-22 2022-05-20 马鞍山中集瑞江润滑油有限公司 一种水基磁咓脱模剂
CN115109490B (zh) * 2022-08-11 2023-03-14 中山永辉化工股份有限公司 一种用于玩具的环保涂料及其制备方法

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US3684756A (en) * 1970-07-07 1972-08-15 Stauffer Wacker Silicone Corp Mold release compositions from mixtures of silicone resins and siloxane fluids
US4244912A (en) * 1979-03-05 1981-01-13 Dow Corning Corporation Molding process using curable silicone release compositions
JPS62275713A (ja) * 1986-05-26 1987-11-30 Daikin Ind Ltd 離型剤
US5052535A (en) * 1987-08-17 1991-10-01 Eaton Corporation Positive clutch structure
JP2590546B2 (ja) * 1987-09-16 1997-03-12 ダイキン工業株式会社 離型剤
US5026813A (en) * 1989-12-27 1991-06-25 General Electric Company Polysilsequioxane and polymethyl-N-hexylsilsesquioxane coating compositions
JP3520522B2 (ja) * 1994-05-30 2004-04-19 ダイキン工業株式会社 フルオロシリコーン化合物および該化合物を含有する組成物
JPH08319424A (ja) * 1995-05-25 1996-12-03 Toray Dow Corning Silicone Co Ltd 硬化性シリコーン組成物
US6294007B1 (en) * 1998-12-07 2001-09-25 Wacker Silicones Corporation Paintable organopolysiloxane mold release compositions and processes for their use
US6403163B1 (en) * 2000-06-27 2002-06-11 Chemrex, Inc. Method of treating surfaces with organosilicon water repellent compositions
US6593422B2 (en) * 2001-05-29 2003-07-15 Dow Corning Corporation Emulsions containing crosslinked and non-crosslinked silicone polyethers

Also Published As

Publication number Publication date
MXPA05012539A (es) 2006-02-08
KR20060012644A (ko) 2006-02-08
JP4745241B2 (ja) 2011-08-10
US20040235683A1 (en) 2004-11-25
CA2523691C (en) 2012-07-10
CN100339204C (zh) 2007-09-26
DE602004004267T2 (de) 2007-10-18
EP1626849B1 (en) 2007-01-10
JP2007500775A (ja) 2007-01-18
AU2004242601B2 (en) 2009-12-17
AU2004242601A1 (en) 2004-12-09
WO2004106026A1 (en) 2004-12-09
EP1626849A1 (en) 2006-02-22
DE602004004267D1 (de) 2007-02-22
HK1090603A1 (zh) 2006-12-29
KR101125400B1 (ko) 2012-03-27
CN1795082A (zh) 2006-06-28
CA2523691A1 (en) 2004-12-09

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Legal Events

Date Code Title Description
B08F Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette]

Free format text: REFERENTE AS 7A E 8A ANUIDADES.

B08K Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette]

Free format text: REFERENTE AO DESPACHO 8.6 PUBLICADO NA RPI 2159 DE 22/05/2012.