BR9200581A - Soldadura por onda em recinto de atmosfera protetora sobre cadinho de solda - Google Patents

Soldadura por onda em recinto de atmosfera protetora sobre cadinho de solda

Info

Publication number
BR9200581A
BR9200581A BR929200581A BR9200581A BR9200581A BR 9200581 A BR9200581 A BR 9200581A BR 929200581 A BR929200581 A BR 929200581A BR 9200581 A BR9200581 A BR 9200581A BR 9200581 A BR9200581 A BR 9200581A
Authority
BR
Brazil
Prior art keywords
welding
cruck
protective atmosphere
wave
atmosphere enclosure
Prior art date
Application number
BR929200581A
Other languages
English (en)
Inventor
Lawrence John Hagerty
Mark Stephen Nowotarski
David Arthur Diamantopoulos
Original Assignee
Union Carbide Ind Gases Tech
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=24649455&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=BR9200581(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Union Carbide Ind Gases Tech filed Critical Union Carbide Ind Gases Tech
Publication of BR9200581A publication Critical patent/BR9200581A/pt

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/08—Soldering by means of dipping in molten solder
    • B23K1/085—Wave soldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/38—Selection of media, e.g. special atmospheres for surrounding the working area
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3468—Applying molten solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/086—Using an inert gas
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3489—Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S118/00—Coating apparatus
    • Y10S118/07—Hoods

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Molten Solder (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Gas-Insulated Switchgears (AREA)
BR929200581A 1991-02-22 1992-02-21 Soldadura por onda em recinto de atmosfera protetora sobre cadinho de solda BR9200581A (pt)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/660,415 US5176307A (en) 1991-02-22 1991-02-22 Wave soldering in a protective atmosphere enclosure over a solder pot

Publications (1)

Publication Number Publication Date
BR9200581A true BR9200581A (pt) 1992-10-27

Family

ID=24649455

Family Applications (1)

Application Number Title Priority Date Filing Date
BR929200581A BR9200581A (pt) 1991-02-22 1992-02-21 Soldadura por onda em recinto de atmosfera protetora sobre cadinho de solda

Country Status (10)

Country Link
US (1) US5176307A (pt)
EP (1) EP0500135B2 (pt)
JP (1) JPH0577038A (pt)
KR (1) KR0139096B1 (pt)
CN (1) CN1037227C (pt)
BR (1) BR9200581A (pt)
CA (1) CA2061646C (pt)
DE (1) DE69209693T3 (pt)
ES (1) ES2085504T5 (pt)
MX (1) MX9200746A (pt)

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US5292055A (en) * 1991-12-06 1994-03-08 Electrovert Ltd. Gas shrouded wave improvement
US5397049A (en) * 1991-12-06 1995-03-14 Electrovert Ltd. Gas shrouded solder wave with reduced solder splatter
US5333776A (en) * 1993-09-30 1994-08-02 Air Products And Chemicals, Inc. Atmospheres for brazing aluminum and aluminum alloys
NL9301935A (nl) * 1993-11-08 1995-06-01 Soltec Bv Soldeermachine met aangepaste soldeertoren.
JPH07212028A (ja) * 1994-01-13 1995-08-11 Matsushita Electric Ind Co Ltd リフロー装置
JP3120695B2 (ja) * 1995-05-19 2000-12-25 株式会社日立製作所 電子回路の製造方法
DE19749184B4 (de) * 1997-11-07 2007-03-01 Air Liquide Deutschland Gmbh Lötvorrichtung
DE19749186A1 (de) * 1997-11-07 1999-06-10 Messer Griesheim Gmbh Anordnung einer Ummantelung zur Aufnahme einer Schutzgasatmosphäre zum Löten von Flachbaugruppen
DE19749185A1 (de) * 1997-11-07 1999-05-12 Messer Griesheim Gmbh Mit einer Gasversorgung verbindbare Gasverteilung
US6168065B1 (en) * 1998-02-17 2001-01-02 Soltec B.V. Movable selective debridging apparatus for debridging soldered joints on printed circuit boards
DE19903957B4 (de) * 1999-01-25 2008-05-21 Finetech Gmbh & Co.Kg Verfahren und Vorrichtung zum Entfernen von Lot
WO2000053337A1 (en) * 1999-03-08 2000-09-14 S. C. Johnson & Son, Inc. Improved attachment method for piezoelectric elements
DE19912718C1 (de) * 1999-03-20 2000-02-03 Messer Griesheim Gmbh Lötvorrichtung
US6367677B1 (en) 1999-09-28 2002-04-09 Hill-Rom Services, Inc. Wave solder apparatus and method
DE10024458B4 (de) * 2000-05-18 2005-08-18 Air Liquide Deutschland Gmbh Lötvorrichtung und Verfahren zum Löten von Flachbaugruppen
TW570856B (en) * 2001-01-18 2004-01-11 Fujitsu Ltd Solder jointing system, solder jointing method, semiconductor device manufacturing method, and semiconductor device manufacturing system
DE10125552C2 (de) * 2001-05-23 2003-05-28 Messer Griesheim Gmbh Lötvorrichtung zum Löten von Flachbaugruppen
JP2003290913A (ja) * 2002-03-29 2003-10-14 Tohoku Tsushin Kk 局部半田付け装置の噴流ノズル構造
US7861915B2 (en) * 2004-04-16 2011-01-04 Ms2 Technologies, Llc Soldering process
GB0411666D0 (en) * 2004-05-25 2004-06-30 Pillarhouse Int Ltd Pump arrangement in a selective soldering apparatus
US7918383B2 (en) * 2004-09-01 2011-04-05 Micron Technology, Inc. Methods for placing substrates in contact with molten solder
TW200610122A (en) * 2004-09-14 2006-03-16 P Kay Metal Inc Soldering process
DE102005046563B3 (de) * 2005-09-28 2007-02-08 Messer Group Gmbh Lötvorrichtung zum Löten von Flachbaugruppen
DE102005052076B4 (de) * 2005-10-28 2007-09-20 Messer Group Gmbh Lötvorrichtung mit Gasverteilung
JP3942623B2 (ja) * 2005-12-12 2007-07-11 富士通テン株式会社 フラットディップ装置およびフラットディップ装置のはんだ付け方法
DE502007006711D1 (de) * 2006-05-23 2011-04-28 Linde Ag Vorrichtung und Verfahren zum Wellenlöten
DE102006024192A1 (de) * 2006-05-23 2007-11-29 Linde Ag Vorrichtung und Verfahren zum Wellenlöten
JP2007073994A (ja) * 2006-12-01 2007-03-22 Nihon Dennetsu Keiki Co Ltd 水蒸気雰囲気によるプリント配線板のはんだ付け方法
DE102007002777A1 (de) * 2007-01-18 2008-07-24 Linde Ag Vorrichtung und Verfahren zum Selektivlöten
US8104662B2 (en) * 2009-07-24 2012-01-31 Flextronics Ap Llc Inert environment enclosure
US20110139855A1 (en) * 2009-12-16 2011-06-16 Ristolainen Tero Residual oxygen measurement and control in wave soldering process
SG174695A1 (en) * 2010-03-12 2011-10-28 Air Prod & Chem Apparatus and method for providing an inerting gas during soldering
US8220699B2 (en) 2010-03-12 2012-07-17 Air Products And Chemicals, Inc. Apparatus and method for providing an inerting gas during soldering
US8579182B2 (en) * 2011-06-17 2013-11-12 Air Products And Chemicals, Inc. Method for providing an inerting gas during soldering
CN102601478B (zh) * 2012-03-15 2014-10-22 哈尔滨工业大学 针灸用不锈钢管与内部铜丝的钎焊方法
US9198300B2 (en) 2014-01-23 2015-11-24 Illinois Tool Works Inc. Flux management system and method for a wave solder machine
US9161459B2 (en) * 2014-02-25 2015-10-13 Illinois Tool Works Inc. Pre-heater latch and seal mechanism for wave solder machine and related method
DE102014018165B3 (de) * 2014-12-09 2016-01-07 Messer Austria Gmbh Lötvorrichtung mit Gasverteilung
JP6666071B2 (ja) * 2015-04-03 2020-03-13 セイテック株式会社 局所半田付け方法
DE102015212960B4 (de) * 2015-07-10 2019-01-31 Robert Bosch Gmbh Verfahren zum Betreiben einer Pumpe
CN104999150A (zh) * 2015-07-15 2015-10-28 深圳市创荣发电子有限公司 一种波峰焊锡炉的节能装置及其节能方法
CN106881517A (zh) * 2017-03-30 2017-06-23 北京康普锡威科技有限公司 二氧化碳气体保护的电子产品焊接方法
JP7249215B2 (ja) * 2019-06-19 2023-03-30 株式会社デンソーテン はんだ付け装置およびはんだ付け装置の制御方法
CN112139620B (zh) * 2020-09-26 2022-04-01 黄山学院 一种全自动控制选择性波峰焊接的装置及方法
CN113634845A (zh) * 2021-07-29 2021-11-12 泗洪红芯半导体有限公司 一种二极管免清洗的甲酸焊接装置
CN115791466B (zh) * 2023-02-02 2023-05-09 扬州市赛思检测设备有限公司 一种万能材料检测疲劳试验机

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Publication number Priority date Publication date Assignee Title
US2082622A (en) * 1933-02-25 1937-06-01 Colin G Fink Daluminum coated metal and process for producing the same
JPS542243A (en) * 1977-06-09 1979-01-09 Asahi Glass Co Ltd Ultrasonic wave soldering apparatus
CA1129728A (en) * 1978-01-30 1982-08-17 Toshio Fukuzuka Process for one-side hot-dip coating
US4451000A (en) * 1982-06-11 1984-05-29 Hollis Engineering, Inc. Soldering apparatus exhaust system
DE3309648A1 (de) * 1983-03-15 1984-09-20 Siemens AG, 1000 Berlin und 8000 München Verfahren zum loeten plattenfoermiger schaltungstraeger innerhalb einer schutzgasloeteinrichtung
US4538757A (en) * 1983-08-01 1985-09-03 Motorola, Inc. Wave soldering in a reducing atmosphere
US4610391A (en) * 1984-12-18 1986-09-09 Union Carbide Corporation Process for wave soldering
JPS6224859A (ja) * 1985-07-24 1987-02-02 Kenji Kondo はんだ付け装置
DE3737563A1 (de) * 1987-11-05 1989-05-18 Ernst Hohnerlein Loetmaschine
US4821947A (en) * 1988-02-08 1989-04-18 Union Carbide Corporation Fluxless application of a metal-comprising coating
DE3813931C2 (de) * 1988-04-25 1995-05-04 Resma Gmbh Fuegetechnik Indust Schutzgaslötverfahren und Vorrichtung zur Ausführung dieses Verfahrens
US5044542A (en) * 1989-11-22 1991-09-03 Electrovert Ltd. Shield gas wave soldering
US5048746A (en) * 1989-12-08 1991-09-17 Electrovert Ltd. Tunnel for fluxless soldering

Also Published As

Publication number Publication date
KR0139096B1 (ko) 1998-06-15
CA2061646C (en) 1996-09-24
US5176307A (en) 1993-01-05
DE69209693T2 (de) 1996-10-02
EP0500135A3 (en) 1993-01-07
EP0500135B1 (en) 1996-04-10
ES2085504T5 (es) 2003-02-16
JPH0577038A (ja) 1993-03-30
CN1037227C (zh) 1998-01-28
KR920017527A (ko) 1992-09-26
EP0500135B2 (en) 2002-10-23
DE69209693T3 (de) 2003-05-22
ES2085504T3 (es) 1996-06-01
MX9200746A (es) 1992-09-01
CN1065373A (zh) 1992-10-14
DE69209693D1 (de) 1996-05-15
EP0500135A2 (en) 1992-08-26
CA2061646A1 (en) 1992-08-23

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Legal Events

Date Code Title Description
FF Decision: intention to grant
FG9A Patent or certificate of addition granted
B24C Patent annual fee: request for for restoration

Free format text: REFERENTE A 13A , 14A , 15A , 16A , 17A , 18A E 19A ANUIDADES.

B24H Lapse because of non-payment of annual fees (definitively: art 78 iv lpi)
B24F Patent annual fee: publication cancelled

Free format text: ANULADA A PUBLICACAO CODIGO 24.8 NA RPI NO 2277 DE 26/08/2014 POR TER SIDO INDEVIDA.

B21F Lapse acc. art. 78, item iv - on non-payment of the annual fees in time

Free format text: REFERENTE AS 13A, 14A, 15A, 16A, 17A, 18A E 19A ANUIDADES.

B24J Lapse because of non-payment of annual fees (definitively: art 78 iv lpi, resolution 113/2013 art. 12)

Free format text: EM VIRTUDE DA EXTINCAO PUBLICADA NA RPI 2606 DE 15-12-2020 E CONSIDERANDO AUSENCIA DE MANIFESTACAO DENTRO DOS PRAZOS LEGAIS, INFORMO QUE CABE SER MANTIDA A EXTINCAO DA PATENTE E SEUS CERTIFICADOS, CONFORME O DISPOSTO NO ARTIGO 12, DA RESOLUCAO 113/2013.