ES2085504T5 - Soldadura por ola en un recinto con atmosfera protectora sobre un crisol para aleacion para soldar. - Google Patents
Soldadura por ola en un recinto con atmosfera protectora sobre un crisol para aleacion para soldar.Info
- Publication number
- ES2085504T5 ES2085504T5 ES92102979T ES92102979T ES2085504T5 ES 2085504 T5 ES2085504 T5 ES 2085504T5 ES 92102979 T ES92102979 T ES 92102979T ES 92102979 T ES92102979 T ES 92102979T ES 2085504 T5 ES2085504 T5 ES 2085504T5
- Authority
- ES
- Spain
- Prior art keywords
- welding
- protective atmosphere
- crisol
- weld
- alloy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/08—Soldering by means of dipping in molten solder
- B23K1/085—Wave soldering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/38—Selection of media, e.g. special atmospheres for surrounding the working area
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3468—Applying molten solder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/08—Treatments involving gases
- H05K2203/086—Using an inert gas
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3489—Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S118/00—Coating apparatus
- Y10S118/07—Hoods
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Molten Solder (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Gas-Insulated Switchgears (AREA)
Abstract
UNA PEQUEÑA CUBIERTA PARA CERCAR Y PROPORCIONAR UNA ATMOSFERA PROTECTORA SOBRE NO MAS QUE LA RED DE SOLDADURA DE UNA MAQUINA PARA LA SOLDADURA DE ONDAS DE PANELES DE CIRCUITOS ESTAMPADOS. OTRAS AREAS OPERATIVAS DE LA MAQUINA ESTAN EXPUESTAS AL AIRE. LAS APERTURAS DE ENTRADA Y DE SALIDA A LA CUBIERTA PARA LOS PANELES DE CIRCUITO SON CUBIERTAS POR CORTINAS CONDUCTIVAS ELECTRICAMENTE DE UN MATERIAL DELGADO CORTADO EN FRANJAS VERTICALES. EL PROCESO EMPLEA UNA CAPA DELGADA DE UN FUNDENTE NO PURO Y PERMITE UN 5% DE OXIGENO O MAS, EN LA ATMOSFERA PROTECTORA.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/660,415 US5176307A (en) | 1991-02-22 | 1991-02-22 | Wave soldering in a protective atmosphere enclosure over a solder pot |
Publications (2)
Publication Number | Publication Date |
---|---|
ES2085504T3 ES2085504T3 (es) | 1996-06-01 |
ES2085504T5 true ES2085504T5 (es) | 2003-02-16 |
Family
ID=24649455
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES92102979T Expired - Lifetime ES2085504T5 (es) | 1991-02-22 | 1992-02-21 | Soldadura por ola en un recinto con atmosfera protectora sobre un crisol para aleacion para soldar. |
Country Status (10)
Country | Link |
---|---|
US (1) | US5176307A (es) |
EP (1) | EP0500135B2 (es) |
JP (1) | JPH0577038A (es) |
KR (1) | KR0139096B1 (es) |
CN (1) | CN1037227C (es) |
BR (1) | BR9200581A (es) |
CA (1) | CA2061646C (es) |
DE (1) | DE69209693T3 (es) |
ES (1) | ES2085504T5 (es) |
MX (1) | MX9200746A (es) |
Families Citing this family (46)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5397049A (en) * | 1991-12-06 | 1995-03-14 | Electrovert Ltd. | Gas shrouded solder wave with reduced solder splatter |
US5292055A (en) * | 1991-12-06 | 1994-03-08 | Electrovert Ltd. | Gas shrouded wave improvement |
US5333776A (en) * | 1993-09-30 | 1994-08-02 | Air Products And Chemicals, Inc. | Atmospheres for brazing aluminum and aluminum alloys |
NL9301935A (nl) * | 1993-11-08 | 1995-06-01 | Soltec Bv | Soldeermachine met aangepaste soldeertoren. |
JPH07212028A (ja) * | 1994-01-13 | 1995-08-11 | Matsushita Electric Ind Co Ltd | リフロー装置 |
JP3120695B2 (ja) * | 1995-05-19 | 2000-12-25 | 株式会社日立製作所 | 電子回路の製造方法 |
DE19749185A1 (de) * | 1997-11-07 | 1999-05-12 | Messer Griesheim Gmbh | Mit einer Gasversorgung verbindbare Gasverteilung |
DE19749184B4 (de) * | 1997-11-07 | 2007-03-01 | Air Liquide Deutschland Gmbh | Lötvorrichtung |
DE19749186A1 (de) * | 1997-11-07 | 1999-06-10 | Messer Griesheim Gmbh | Anordnung einer Ummantelung zur Aufnahme einer Schutzgasatmosphäre zum Löten von Flachbaugruppen |
US6168065B1 (en) * | 1998-02-17 | 2001-01-02 | Soltec B.V. | Movable selective debridging apparatus for debridging soldered joints on printed circuit boards |
DE19903957B4 (de) * | 1999-01-25 | 2008-05-21 | Finetech Gmbh & Co.Kg | Verfahren und Vorrichtung zum Entfernen von Lot |
US6382522B2 (en) * | 1999-03-08 | 2002-05-07 | S. C. Johnson & Son, Inc. | Attachment method for piezoelectric elements |
DE19912718C1 (de) * | 1999-03-20 | 2000-02-03 | Messer Griesheim Gmbh | Lötvorrichtung |
US6367677B1 (en) | 1999-09-28 | 2002-04-09 | Hill-Rom Services, Inc. | Wave solder apparatus and method |
DE10024458B4 (de) * | 2000-05-18 | 2005-08-18 | Air Liquide Deutschland Gmbh | Lötvorrichtung und Verfahren zum Löten von Flachbaugruppen |
TW570856B (en) * | 2001-01-18 | 2004-01-11 | Fujitsu Ltd | Solder jointing system, solder jointing method, semiconductor device manufacturing method, and semiconductor device manufacturing system |
DE10125552C2 (de) * | 2001-05-23 | 2003-05-28 | Messer Griesheim Gmbh | Lötvorrichtung zum Löten von Flachbaugruppen |
JP2003290913A (ja) * | 2002-03-29 | 2003-10-14 | Tohoku Tsushin Kk | 局部半田付け装置の噴流ノズル構造 |
US7861915B2 (en) * | 2004-04-16 | 2011-01-04 | Ms2 Technologies, Llc | Soldering process |
GB0411666D0 (en) * | 2004-05-25 | 2004-06-30 | Pillarhouse Int Ltd | Pump arrangement in a selective soldering apparatus |
US7918383B2 (en) * | 2004-09-01 | 2011-04-05 | Micron Technology, Inc. | Methods for placing substrates in contact with molten solder |
TW200610122A (en) * | 2004-09-14 | 2006-03-16 | P Kay Metal Inc | Soldering process |
DE102005046563B3 (de) * | 2005-09-28 | 2007-02-08 | Messer Group Gmbh | Lötvorrichtung zum Löten von Flachbaugruppen |
DE102005052076B4 (de) * | 2005-10-28 | 2007-09-20 | Messer Group Gmbh | Lötvorrichtung mit Gasverteilung |
JP3942623B2 (ja) * | 2005-12-12 | 2007-07-11 | 富士通テン株式会社 | フラットディップ装置およびフラットディップ装置のはんだ付け方法 |
DE502007006711D1 (de) * | 2006-05-23 | 2011-04-28 | Linde Ag | Vorrichtung und Verfahren zum Wellenlöten |
DE102006024192A1 (de) * | 2006-05-23 | 2007-11-29 | Linde Ag | Vorrichtung und Verfahren zum Wellenlöten |
JP2007073994A (ja) * | 2006-12-01 | 2007-03-22 | Nihon Dennetsu Keiki Co Ltd | 水蒸気雰囲気によるプリント配線板のはんだ付け方法 |
DE102007002777A1 (de) * | 2007-01-18 | 2008-07-24 | Linde Ag | Vorrichtung und Verfahren zum Selektivlöten |
US8104662B2 (en) * | 2009-07-24 | 2012-01-31 | Flextronics Ap Llc | Inert environment enclosure |
US20110139855A1 (en) * | 2009-12-16 | 2011-06-16 | Ristolainen Tero | Residual oxygen measurement and control in wave soldering process |
TWI401131B (zh) * | 2010-03-12 | 2013-07-11 | Air Prod & Chem | 於軟焊時提供惰性化氣體的設備及方法 |
US8220699B2 (en) | 2010-03-12 | 2012-07-17 | Air Products And Chemicals, Inc. | Apparatus and method for providing an inerting gas during soldering |
US8579182B2 (en) * | 2011-06-17 | 2013-11-12 | Air Products And Chemicals, Inc. | Method for providing an inerting gas during soldering |
CN102601478B (zh) * | 2012-03-15 | 2014-10-22 | 哈尔滨工业大学 | 针灸用不锈钢管与内部铜丝的钎焊方法 |
US9198300B2 (en) | 2014-01-23 | 2015-11-24 | Illinois Tool Works Inc. | Flux management system and method for a wave solder machine |
US9161459B2 (en) * | 2014-02-25 | 2015-10-13 | Illinois Tool Works Inc. | Pre-heater latch and seal mechanism for wave solder machine and related method |
DE102014018165B3 (de) * | 2014-12-09 | 2016-01-07 | Messer Austria Gmbh | Lötvorrichtung mit Gasverteilung |
JP6666071B2 (ja) * | 2015-04-03 | 2020-03-13 | セイテック株式会社 | 局所半田付け方法 |
DE102015212960B4 (de) * | 2015-07-10 | 2019-01-31 | Robert Bosch Gmbh | Verfahren zum Betreiben einer Pumpe |
CN104999150A (zh) * | 2015-07-15 | 2015-10-28 | 深圳市创荣发电子有限公司 | 一种波峰焊锡炉的节能装置及其节能方法 |
CN106881517A (zh) * | 2017-03-30 | 2017-06-23 | 北京康普锡威科技有限公司 | 二氧化碳气体保护的电子产品焊接方法 |
JP7249215B2 (ja) * | 2019-06-19 | 2023-03-30 | 株式会社デンソーテン | はんだ付け装置およびはんだ付け装置の制御方法 |
CN112139620B (zh) * | 2020-09-26 | 2022-04-01 | 黄山学院 | 一种全自动控制选择性波峰焊接的装置及方法 |
CN113634845A (zh) * | 2021-07-29 | 2021-11-12 | 泗洪红芯半导体有限公司 | 一种二极管免清洗的甲酸焊接装置 |
CN115791466B (zh) * | 2023-02-02 | 2023-05-09 | 扬州市赛思检测设备有限公司 | 一种万能材料检测疲劳试验机 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2082622A (en) * | 1933-02-25 | 1937-06-01 | Colin G Fink | Daluminum coated metal and process for producing the same |
JPS542243A (en) * | 1977-06-09 | 1979-01-09 | Asahi Glass Co Ltd | Ultrasonic wave soldering apparatus |
CA1129728A (en) * | 1978-01-30 | 1982-08-17 | Toshio Fukuzuka | Process for one-side hot-dip coating |
US4451000A (en) * | 1982-06-11 | 1984-05-29 | Hollis Engineering, Inc. | Soldering apparatus exhaust system |
DE3309648A1 (de) * | 1983-03-15 | 1984-09-20 | Siemens AG, 1000 Berlin und 8000 München | Verfahren zum loeten plattenfoermiger schaltungstraeger innerhalb einer schutzgasloeteinrichtung |
US4538757A (en) * | 1983-08-01 | 1985-09-03 | Motorola, Inc. | Wave soldering in a reducing atmosphere |
US4610391A (en) * | 1984-12-18 | 1986-09-09 | Union Carbide Corporation | Process for wave soldering |
JPS6224859A (ja) * | 1985-07-24 | 1987-02-02 | Kenji Kondo | はんだ付け装置 |
DE3737563A1 (de) * | 1987-11-05 | 1989-05-18 | Ernst Hohnerlein | Loetmaschine |
US4821947A (en) * | 1988-02-08 | 1989-04-18 | Union Carbide Corporation | Fluxless application of a metal-comprising coating |
DE3813931C2 (de) * | 1988-04-25 | 1995-05-04 | Resma Gmbh Fuegetechnik Indust | Schutzgaslötverfahren und Vorrichtung zur Ausführung dieses Verfahrens |
US5044542A (en) * | 1989-11-22 | 1991-09-03 | Electrovert Ltd. | Shield gas wave soldering |
US5048746A (en) * | 1989-12-08 | 1991-09-17 | Electrovert Ltd. | Tunnel for fluxless soldering |
-
1991
- 1991-02-22 US US07/660,415 patent/US5176307A/en not_active Expired - Lifetime
-
1992
- 1992-02-21 DE DE69209693T patent/DE69209693T3/de not_active Expired - Fee Related
- 1992-02-21 KR KR1019920002600A patent/KR0139096B1/ko not_active IP Right Cessation
- 1992-02-21 MX MX9200746A patent/MX9200746A/es not_active IP Right Cessation
- 1992-02-21 JP JP4070025A patent/JPH0577038A/ja not_active Withdrawn
- 1992-02-21 BR BR929200581A patent/BR9200581A/pt not_active IP Right Cessation
- 1992-02-21 CA CA002061646A patent/CA2061646C/en not_active Expired - Fee Related
- 1992-02-21 ES ES92102979T patent/ES2085504T5/es not_active Expired - Lifetime
- 1992-02-21 CN CN92101677A patent/CN1037227C/zh not_active Expired - Fee Related
- 1992-02-21 EP EP92102979A patent/EP0500135B2/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP0500135B2 (en) | 2002-10-23 |
MX9200746A (es) | 1992-09-01 |
CN1037227C (zh) | 1998-01-28 |
US5176307A (en) | 1993-01-05 |
CN1065373A (zh) | 1992-10-14 |
KR920017527A (ko) | 1992-09-26 |
EP0500135A2 (en) | 1992-08-26 |
CA2061646C (en) | 1996-09-24 |
JPH0577038A (ja) | 1993-03-30 |
EP0500135B1 (en) | 1996-04-10 |
ES2085504T3 (es) | 1996-06-01 |
DE69209693T3 (de) | 2003-05-22 |
KR0139096B1 (ko) | 1998-06-15 |
BR9200581A (pt) | 1992-10-27 |
DE69209693T2 (de) | 1996-10-02 |
EP0500135A3 (en) | 1993-01-07 |
CA2061646A1 (en) | 1992-08-23 |
DE69209693D1 (de) | 1996-05-15 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
FG2A | Definitive protection |
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