BR8705231A - Estrutura e celula de capacitor em trincheira de semicondutor com construcao de fusao de isolamento e de trincheira de no,matriz feita com tais celulas e metodo de producao de dita estrutura - Google Patents
Estrutura e celula de capacitor em trincheira de semicondutor com construcao de fusao de isolamento e de trincheira de no,matriz feita com tais celulas e metodo de producao de dita estruturaInfo
- Publication number
- BR8705231A BR8705231A BR8705231A BR8705231A BR8705231A BR 8705231 A BR8705231 A BR 8705231A BR 8705231 A BR8705231 A BR 8705231A BR 8705231 A BR8705231 A BR 8705231A BR 8705231 A BR8705231 A BR 8705231A
- Authority
- BR
- Brazil
- Prior art keywords
- trusch
- truck
- insulation
- cells
- semiconductor
- Prior art date
Links
- 239000003990 capacitor Substances 0.000 title 1
- 238000010276 construction Methods 0.000 title 1
- 238000009413 insulation Methods 0.000 title 1
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000011159 matrix material Substances 0.000 title 1
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66083—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by variation of the electric current supplied or the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched, e.g. two-terminal devices
- H01L29/66181—Conductor-insulator-semiconductor capacitors, e.g. trench capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/86—Types of semiconductor device ; Multistep manufacturing processes therefor controllable only by variation of the electric current supplied, or only the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched
- H01L29/92—Capacitors having potential barriers
- H01L29/94—Metal-insulator-semiconductors, e.g. MOS
- H01L29/945—Trench capacitors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B12/00—Dynamic random access memory [DRAM] devices
- H10B12/30—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells
- H10B12/37—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells the capacitor being at least partially in a trench in the substrate
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Semiconductor Memories (AREA)
- Semiconductor Integrated Circuits (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US06/925,570 US4801988A (en) | 1986-10-31 | 1986-10-31 | Semiconductor trench capacitor cell with merged isolation and node trench construction |
Publications (1)
Publication Number | Publication Date |
---|---|
BR8705231A true BR8705231A (pt) | 1988-05-24 |
Family
ID=25451925
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
BR8705231A BR8705231A (pt) | 1986-10-31 | 1987-10-02 | Estrutura e celula de capacitor em trincheira de semicondutor com construcao de fusao de isolamento e de trincheira de no,matriz feita com tais celulas e metodo de producao de dita estrutura |
Country Status (5)
Country | Link |
---|---|
US (1) | US4801988A (pt) |
EP (1) | EP0265616B1 (pt) |
JP (1) | JPH06105767B2 (pt) |
BR (1) | BR8705231A (pt) |
DE (1) | DE3788499T2 (pt) |
Families Citing this family (66)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR900003262B1 (ko) * | 1987-04-30 | 1990-05-12 | 삼성전자 주식회사 | 반도체 장치의 제조방법 |
US4912535A (en) * | 1987-08-08 | 1990-03-27 | Mitsubishi Denki Kabushiki Kaisha | Trench type semiconductor memory device having side wall contact |
JPH0821685B2 (ja) * | 1988-02-26 | 1996-03-04 | 株式会社東芝 | 半導体メモリの製造方法 |
US5105245A (en) * | 1988-06-28 | 1992-04-14 | Texas Instruments Incorporated | Trench capacitor DRAM cell with diffused bit lines adjacent to a trench |
US5225363A (en) * | 1988-06-28 | 1993-07-06 | Texas Instruments Incorporated | Trench capacitor DRAM cell and method of manufacture |
KR910007181B1 (ko) * | 1988-09-22 | 1991-09-19 | 현대전자산업 주식회사 | Sdtas구조로 이루어진 dram셀 및 그 제조방법 |
US5134616A (en) * | 1990-02-13 | 1992-07-28 | International Business Machines Corporation | Dynamic ram with on-chip ecc and optimized bit and word redundancy |
US5307356A (en) * | 1990-04-16 | 1994-04-26 | International Business Machines Corporation | Interlocked on-chip ECC system |
US5064777A (en) * | 1990-06-28 | 1991-11-12 | International Business Machines Corporation | Fabrication method for a double trench memory cell device |
US5034787A (en) * | 1990-06-28 | 1991-07-23 | International Business Machines Corporation | Structure and fabrication method for a double trench memory cell device |
JP3128834B2 (ja) * | 1991-01-28 | 2001-01-29 | 日本電気株式会社 | 半導体装置 |
JP2819520B2 (ja) * | 1991-05-07 | 1998-10-30 | インターナショナル・ビジネス・マシーンズ・コーポレイション | Dramセル |
JPH05225798A (ja) * | 1991-08-14 | 1993-09-03 | Internatl Business Mach Corp <Ibm> | メモリシステム |
JP2994110B2 (ja) * | 1991-09-09 | 1999-12-27 | 株式会社東芝 | 半導体記憶装置 |
US5255224A (en) * | 1991-12-18 | 1993-10-19 | International Business Machines Corporation | Boosted drive system for master/local word line memory architecture |
US5264716A (en) * | 1992-01-09 | 1993-11-23 | International Business Machines Corporation | Diffused buried plate trench dram cell array |
JPH07112049B2 (ja) * | 1992-01-09 | 1995-11-29 | インターナショナル・ビジネス・マシーンズ・コーポレイション | ダイナミック・ランダム・アクセス・メモリ・デバイスおよび製造方法 |
US5250829A (en) * | 1992-01-09 | 1993-10-05 | International Business Machines Corporation | Double well substrate plate trench DRAM cell array |
US5528062A (en) * | 1992-06-17 | 1996-06-18 | International Business Machines Corporation | High-density DRAM structure on soi |
JPH0799771B2 (ja) * | 1992-06-26 | 1995-10-25 | インターナショナル・ビジネス・マシーンズ・コーポレイション | 皮膜中の応力を制御する方法 |
US5365097A (en) * | 1992-10-05 | 1994-11-15 | International Business Machines Corporation | Vertical epitaxial SOI transistor, memory cell and fabrication methods |
US5434109A (en) * | 1993-04-27 | 1995-07-18 | International Business Machines Corporation | Oxidation of silicon nitride in semiconductor devices |
US5422294A (en) * | 1993-05-03 | 1995-06-06 | Noble, Jr.; Wendell P. | Method of making a trench capacitor field shield with sidewall contact |
JP3480745B2 (ja) * | 1993-09-16 | 2003-12-22 | 株式会社東芝 | 半導体装置の製造方法 |
US5360758A (en) * | 1993-12-03 | 1994-11-01 | International Business Machines Corporation | Self-aligned buried strap for trench type DRAM cells |
US5448090A (en) * | 1994-08-03 | 1995-09-05 | International Business Machines Corporation | Structure for reducing parasitic leakage in a memory array with merged isolation and node trench construction |
US5627092A (en) * | 1994-09-26 | 1997-05-06 | Siemens Aktiengesellschaft | Deep trench dram process on SOI for low leakage DRAM cell |
US5508542A (en) * | 1994-10-28 | 1996-04-16 | International Business Machines Corporation | Porous silicon trench and capacitor structures |
US5936271A (en) * | 1994-11-15 | 1999-08-10 | Siemens Aktiengesellschaft | Unit cell layout and transfer gate design for high density DRAMs having a trench capacitor with signal electrode composed of three differently doped polysilicon layers |
US5895255A (en) * | 1994-11-30 | 1999-04-20 | Kabushiki Kaisha Toshiba | Shallow trench isolation formation with deep trench cap |
US5545581A (en) * | 1994-12-06 | 1996-08-13 | International Business Machines Corporation | Plug strap process utilizing selective nitride and oxide etches |
US5641694A (en) * | 1994-12-22 | 1997-06-24 | International Business Machines Corporation | Method of fabricating vertical epitaxial SOI transistor |
US6252267B1 (en) | 1994-12-28 | 2001-06-26 | International Business Machines Corporation | Five square folded-bitline DRAM cell |
US5576566A (en) * | 1995-04-13 | 1996-11-19 | International Business Machines Corporation | Semiconductor trench capacitor cell having a buried strap |
US5545583A (en) * | 1995-04-13 | 1996-08-13 | International Business Machines Corporation | Method of making semiconductor trench capacitor cell having a buried strap |
US5885425A (en) * | 1995-06-06 | 1999-03-23 | International Business Machines Corporation | Method for selective material deposition on one side of raised or recessed features |
US5731941A (en) * | 1995-09-08 | 1998-03-24 | International Business Machines Corporation | Electrostatic discharge suppression circuit employing trench capacitor |
US5908310A (en) | 1995-12-27 | 1999-06-01 | International Business Machines Corporation | Method to form a buried implanted plate for DRAM trench storage capacitors |
US5684313A (en) * | 1996-02-20 | 1997-11-04 | Kenney; Donald M. | Vertical precharge structure for DRAM |
US5656535A (en) * | 1996-03-04 | 1997-08-12 | Siemens Aktiengesellschaft | Storage node process for deep trench-based DRAM |
US5684314A (en) * | 1996-03-18 | 1997-11-04 | Kenney; Donald M. | Trench capacitor precharge structure and leakage shield |
US5748547A (en) * | 1996-05-24 | 1998-05-05 | Shau; Jeng-Jye | High performance semiconductor memory devices having multiple dimension bit lines |
US20050036363A1 (en) * | 1996-05-24 | 2005-02-17 | Jeng-Jye Shau | High performance embedded semiconductor memory devices with multiple dimension first-level bit-lines |
US5923971A (en) * | 1996-10-22 | 1999-07-13 | International Business Machines Corporation | Reliable low resistance strap for trench storage DRAM cell using selective epitaxy |
US5953607A (en) * | 1997-06-06 | 1999-09-14 | International Business Machines Corporation | Buried strap for trench storage capacitors in dram trench cells |
JP3132435B2 (ja) * | 1997-09-22 | 2001-02-05 | 日本電気株式会社 | 半導体装置の製造方法 |
US5990511A (en) * | 1997-10-16 | 1999-11-23 | International Business Machines Corporation | Memory cell with transfer device node in selective polysilicon |
DE19752968C1 (de) * | 1997-11-28 | 1999-06-24 | Siemens Ag | Speicherzellenanordnung und Verfahren zu deren Herstellung |
US6236079B1 (en) | 1997-12-02 | 2001-05-22 | Kabushiki Kaisha Toshiba | Dynamic semiconductor memory device having a trench capacitor |
US6699794B1 (en) * | 1998-03-09 | 2004-03-02 | Siemens Aktiengesellschaft | Self aligned buried plate |
KR100289749B1 (ko) * | 1998-05-12 | 2001-05-15 | 윤종용 | 도전패드형성방법 |
US5949700A (en) * | 1998-05-26 | 1999-09-07 | International Business Machines Corporation | Five square vertical dynamic random access memory cell |
US6107133A (en) * | 1998-05-28 | 2000-08-22 | International Business Machines Corporation | Method for making a five square vertical DRAM cell |
US6225158B1 (en) | 1998-05-28 | 2001-05-01 | International Business Machines Corporation | Trench storage dynamic random access memory cell with vertical transfer device |
US6121651A (en) * | 1998-07-30 | 2000-09-19 | International Business Machines Corporation | Dram cell with three-sided-gate transfer device |
US6110792A (en) * | 1998-08-19 | 2000-08-29 | International Business Machines Corporation | Method for making DRAM capacitor strap |
JP3580719B2 (ja) * | 1999-03-03 | 2004-10-27 | 株式会社東芝 | 半導体記憶装置及びその製造方法 |
US6380575B1 (en) | 1999-08-31 | 2002-04-30 | International Business Machines Corporation | DRAM trench cell |
DE19944011B4 (de) * | 1999-09-14 | 2007-10-18 | Infineon Technologies Ag | Verfahren zur Bildung mindestens zweier Speicherzellen eines Halbleiterspeichers |
AU7565400A (en) * | 1999-09-17 | 2001-04-17 | Telefonaktiebolaget Lm Ericsson (Publ) | A self-aligned method for forming deep trenches in shallow trenches for isolation of semiconductor devices |
TW552669B (en) * | 2000-06-19 | 2003-09-11 | Infineon Technologies Corp | Process for etching polysilicon gate stacks with raised shallow trench isolation structures |
KR100930336B1 (ko) * | 2002-12-27 | 2009-12-08 | 후지쯔 마이크로일렉트로닉스 가부시키가이샤 | 반도체 장치, dram 집적 회로 장치 및 그 제조 방법 |
US6987044B2 (en) * | 2003-09-25 | 2006-01-17 | Promos Technologies Inc. | Volatile memory structure and method for forming the same |
US7341765B2 (en) * | 2004-01-27 | 2008-03-11 | Battelle Energy Alliance, Llc | Metallic coatings on silicon substrates, and methods of forming metallic coatings on silicon substrates |
US8557657B1 (en) * | 2012-05-18 | 2013-10-15 | International Business Machines Corporation | Retrograde substrate for deep trench capacitors |
US9443857B2 (en) * | 2014-12-05 | 2016-09-13 | Globalfoundries Inc. | Vertical fin eDRAM |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4238278A (en) * | 1979-06-14 | 1980-12-09 | International Business Machines Corporation | Polycrystalline silicon oxidation method for making shallow and deep isolation trenches |
US4376983A (en) * | 1980-03-21 | 1983-03-15 | Texas Instruments Incorporated | High density dynamic memory cell |
US4397075A (en) * | 1980-07-03 | 1983-08-09 | International Business Machines Corporation | FET Memory cell structure and process |
US4661832A (en) * | 1982-06-30 | 1987-04-28 | International Business Machines Corporation | Total dielectric isolation for integrated circuits |
JPS5919366A (ja) * | 1982-07-23 | 1984-01-31 | Hitachi Ltd | 半導体記憶装置 |
US4688069A (en) * | 1984-03-22 | 1987-08-18 | International Business Machines Corporation | Isolation for high density integrated circuits |
US4688063A (en) * | 1984-06-29 | 1987-08-18 | International Business Machines Corporation | Dynamic ram cell with MOS trench capacitor in CMOS |
JPH0722184B2 (ja) * | 1984-07-03 | 1995-03-08 | テキサス インスツルメンツ インコ−ポレイテツド | ダイナミック・メモリ・セルの製造法 |
JPS6132466A (ja) * | 1984-07-25 | 1986-02-15 | Hitachi Ltd | 半導体集積回路装置 |
US4651184A (en) * | 1984-08-31 | 1987-03-17 | Texas Instruments Incorporated | Dram cell and array |
JPS6190395A (ja) * | 1984-10-09 | 1986-05-08 | Fujitsu Ltd | 半導体記憶装置 |
JPS61108163A (ja) * | 1984-11-01 | 1986-05-26 | Nec Corp | 半導体記憶装置の製造方法 |
DE3681490D1 (de) * | 1985-04-01 | 1991-10-24 | Nec Corp | Dynamische speicheranordnung mit wahlfreiem zugriff mit einer vielzahl von eintransistorspeicherzellen. |
-
1986
- 1986-10-31 US US06/925,570 patent/US4801988A/en not_active Expired - Lifetime
-
1987
- 1987-08-06 JP JP62195437A patent/JPH06105767B2/ja not_active Expired - Lifetime
- 1987-08-18 DE DE3788499T patent/DE3788499T2/de not_active Expired - Lifetime
- 1987-08-18 EP EP87111966A patent/EP0265616B1/en not_active Expired - Lifetime
- 1987-10-02 BR BR8705231A patent/BR8705231A/pt not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
JPS63122162A (ja) | 1988-05-26 |
DE3788499D1 (de) | 1994-01-27 |
JPH06105767B2 (ja) | 1994-12-21 |
EP0265616A2 (en) | 1988-05-04 |
DE3788499T2 (de) | 1994-06-30 |
EP0265616B1 (en) | 1993-12-15 |
EP0265616A3 (en) | 1989-08-30 |
US4801988A (en) | 1989-01-31 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
B21A | Patent or certificate of addition expired [chapter 21.1 patent gazette] |
Free format text: PATENTE EXTINTA EM 02/10/2002 |
|
B15K | Others concerning applications: alteration of classification |
Ipc: H01L 29/66 (2006.01), H01L 27/108 (2006.0 |