BR112017024277A2 - dispositivo de pacote sobre pacote (pop) compreendendo resfriador termoelétrico bidirecional - Google Patents

dispositivo de pacote sobre pacote (pop) compreendendo resfriador termoelétrico bidirecional

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Publication number
BR112017024277A2
BR112017024277A2 BR112017024277A BR112017024277A BR112017024277A2 BR 112017024277 A2 BR112017024277 A2 BR 112017024277A2 BR 112017024277 A BR112017024277 A BR 112017024277A BR 112017024277 A BR112017024277 A BR 112017024277A BR 112017024277 A2 BR112017024277 A2 BR 112017024277A2
Authority
BR
Brazil
Prior art keywords
matrix
package
packet
tec
substrate
Prior art date
Application number
BR112017024277A
Other languages
English (en)
Other versions
BR112017024277B1 (pt
Inventor
Mittal Arpit
Jun Park Hee
Saeidi Mehdi
Wang Peng
Mittal Rajat
Original Assignee
Qualcomm Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Qualcomm Inc filed Critical Qualcomm Inc
Publication of BR112017024277A2 publication Critical patent/BR112017024277A2/pt
Publication of BR112017024277B1 publication Critical patent/BR112017024277B1/pt

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/206—Cooling means comprising thermal management
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
    • G01K7/02—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using thermoelectric elements, e.g. thermocouples
    • G01K7/04—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using thermoelectric elements, e.g. thermocouples the object to be measured not forming one of the thermoelectric materials
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D23/00—Control of temperature
    • G05D23/19—Control of temperature characterised by the use of electric means
    • G05D23/1906—Control of temperature characterised by the use of electric means using an analogue comparing device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/38—Cooling arrangements using the Peltier effect
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L25/0657—Stacked arrangements of devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/105—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L27/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N19/00—Integrated devices, or assemblies of multiple devices, comprising at least one thermoelectric or thermomagnetic element covered by groups H10N10/00 - H10N15/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32135—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/32145—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73253—Bump and layer connectors
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    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
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    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
    • H01L2225/10—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers
    • H01L2225/1005—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/1011—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement
    • H01L2225/1094—Thermal management, e.g. cooling
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
    • H—ELECTRICITY
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1517—Multilayer substrate
    • H01L2924/15172—Fan-out arrangement of the internal vias
    • H01L2924/15174—Fan-out arrangement of the internal vias in different layers of the multilayer substrate
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    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Theoretical Computer Science (AREA)
  • Automation & Control Theory (AREA)
  • Human Computer Interaction (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Devices That Are Associated With Refrigeration Equipment (AREA)

Abstract

um dispositivo de pacote sobre pacote (pop) inclui um primeiro pacote, um segundo pacote e um resfriador termoelétrico bidirecional (tec). o primeiro pacote inclui um primeiro substrato e uma primeira matriz acoplada ao primeiro substrato. o segundo pacote é acoplado ao primeiro pacote. o segundo pacote inclui um segundo substrato e uma segunda matriz é acoplada ao segundo substrato. o tec está localizado entre a primeira matriz e o segundo substrato. o tec é adaptado para dissipar dinamicamente o calor para frente e para trás entre o primeiro pacote e o segundo pacote. o tec é adaptado para dissipar o calor a partir da primeira matriz para a segunda matriz em um primeiro período de tempo. o tec é adaptado ainda para dissipar o calor a partir da segunda matriz para a primeira matriz em um segundo período de tempo. o tec é adaptado para dissipar o calor a partir da primeira matriz para a segunda matriz através do segundo substrato.
BR112017024277-0A 2015-05-11 2016-05-10 Dispositivo de pacote sobre pacote (pop) compreendendo resfriador termoelétrico bidirecional BR112017024277B1 (pt)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US14/709,276 US9746889B2 (en) 2015-05-11 2015-05-11 Package-on-package (PoP) device comprising bi-directional thermal electric cooler
US14/709,276 2015-05-11
PCT/US2016/031671 WO2016183099A1 (en) 2015-05-11 2016-05-10 Package-on-package (pop) device comprising bi-directional thermal electric cooler

Publications (2)

Publication Number Publication Date
BR112017024277A2 true BR112017024277A2 (pt) 2018-07-24
BR112017024277B1 BR112017024277B1 (pt) 2022-12-13

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Application Number Title Priority Date Filing Date
BR112017024277-0A BR112017024277B1 (pt) 2015-05-11 2016-05-10 Dispositivo de pacote sobre pacote (pop) compreendendo resfriador termoelétrico bidirecional

Country Status (9)

Country Link
US (1) US9746889B2 (pt)
EP (1) EP3295481A1 (pt)
JP (1) JP6783798B2 (pt)
KR (1) KR102513960B1 (pt)
CN (1) CN107534038B (pt)
BR (1) BR112017024277B1 (pt)
CA (1) CA2981824A1 (pt)
TW (1) TWI662665B (pt)
WO (1) WO2016183099A1 (pt)

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9418926B1 (en) * 2015-05-18 2016-08-16 Micron Technology, Inc. Package-on-package semiconductor assemblies and methods of manufacturing the same
US9735131B2 (en) * 2015-11-10 2017-08-15 Taiwan Semiconductor Manufacturing Company, Ltd. Multi-stack package-on-package structures
US10177131B2 (en) 2016-03-02 2019-01-08 Samsung Electronics Co., Ltd. Semiconductor packages and methods of manufacturing the same
US9659911B1 (en) * 2016-04-20 2017-05-23 Powertech Technology Inc. Package structure and manufacturing method thereof
CN107579061B (zh) 2016-07-04 2020-01-07 晟碟信息科技（上海）有限公司 包含互连的叠加封装体的半导体装置
US10424559B2 (en) 2016-12-22 2019-09-24 Intel Corporation Thermal management of molded packages
CN108695284A (zh) * 2017-04-07 2018-10-23 晟碟信息科技（上海）有限公司 包括纵向集成半导体封装体组的半导体设备
CN109148397B (zh) * 2017-06-16 2023-02-28 日月光半导体制造股份有限公司 半导体装置封装
US10438930B2 (en) * 2017-06-30 2019-10-08 Intel Corporation Package on package thermal transfer systems and methods
CN111052368A (zh) * 2017-09-28 2020-04-21 英特尔公司 有源硅上封装半导体封装
US10692793B2 (en) * 2018-03-02 2020-06-23 Micron Technology, Inc. Electronic device with a package-level thermal regulator mechanism and associated systems, devices, and methods
US10834853B2 (en) 2018-03-02 2020-11-10 Micron Technology, Inc. Electronic device with a card-level thermal regulator mechanism and associated systems, devices, and methods
US11152279B2 (en) * 2018-03-26 2021-10-19 Raytheon Company Monolithic microwave integrated circuit (MMIC) cooling structure
US10916488B2 (en) * 2018-06-29 2021-02-09 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor package having thermal conductive pattern surrounding the semiconductor die
US11137809B2 (en) * 2018-12-20 2021-10-05 Advanced Micro Devices, Inc. Runtime localized cooling of high-performance processors
US11658095B2 (en) * 2019-03-29 2023-05-23 Intel Corporation Bump integrated thermoelectric cooler
US11830787B2 (en) 2019-08-06 2023-11-28 Intel Corporation Thermal management in integrated circuit packages
US11784108B2 (en) 2019-08-06 2023-10-10 Intel Corporation Thermal management in integrated circuit packages
US20210043543A1 (en) * 2019-08-06 2021-02-11 Intel Corporation Thermal management in integrated circuit packages
EP3772750A1 (en) * 2019-08-07 2021-02-10 Infineon Technologies AG Semiconductor module arrangement
US20210066273A1 (en) * 2019-08-30 2021-03-04 Intel Corporation Laser ablation-based surface property modification and contamination removal
US20210320085A1 (en) * 2020-04-09 2021-10-14 Nanya Technology Corporation Semiconductor package
KR20220017022A (ko) * 2020-08-03 2022-02-11 삼성전자주식회사 반도체 패키지
US11765862B2 (en) * 2020-09-29 2023-09-19 Baidu Usa Llc Thermal management system for electronic components with thermoelectric element
KR20220071399A (ko) 2020-11-24 2022-05-31 삼성전자주식회사 반도체 모듈
KR20220151442A (ko) * 2021-05-06 2022-11-15 삼성전자주식회사 반도체 패키지
WO2023047407A1 (en) * 2021-09-24 2023-03-30 Pandiyarasan Veluswamy Smart jacket for all weather conditions
US20230376221A1 (en) * 2022-05-17 2023-11-23 Western Digital Technologies, Inc. Accelerated Cooling in Storage Devices

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4817543B2 (ja) * 2001-07-02 2011-11-16 富士通セミコンダクター株式会社 積層型マルチチップ半導体装置
TW549573U (en) 2002-11-27 2003-08-21 Via Tech Inc IC package for a multi-chip module
US7034394B2 (en) 2003-10-08 2006-04-25 Intel Corporation Microelectronic assembly having thermoelectric elements to cool a die and a method of making the same
KR100629679B1 (ko) * 2004-07-01 2006-09-29 삼성전자주식회사 열전 냉각 소자를 갖는 반도체 칩 패키지
JP2006295119A (ja) * 2005-03-17 2006-10-26 Matsushita Electric Ind Co Ltd 積層型半導体装置
US20060243315A1 (en) * 2005-04-29 2006-11-02 Chrysler Gregory M Gap-filling in electronic assemblies including a TEC structure
JP2007115812A (ja) * 2005-10-19 2007-05-10 Seiko Epson Corp ペルチェモジュール及び電子機器
US20090071525A1 (en) 2007-09-17 2009-03-19 Lucent Technologies, Inc. Cooling Hot-Spots by Lateral Active Heat Transport
US8598700B2 (en) * 2008-06-27 2013-12-03 Qualcomm Incorporated Active thermal control for stacked IC devices
US9070662B2 (en) * 2009-03-05 2015-06-30 Volterra Semiconductor Corporation Chip-scale packaging with protective heat spreader
FR2951871B1 (fr) 2009-10-23 2011-12-16 St Microelectronics Sa Plaque d'interface entre circuits integres
TWI441305B (zh) 2010-12-21 2014-06-11 Ind Tech Res Inst 半導體裝置
KR101928005B1 (ko) * 2011-12-01 2019-03-13 삼성전자주식회사 열전 냉각 패키지 및 이의 열관리 방법
US9006956B2 (en) * 2012-05-09 2015-04-14 Qualcomm Incorporated Piezoelectric active cooling device
US9625186B2 (en) * 2013-08-29 2017-04-18 Taiwan Semiconductor Manufacturing Co., Ltd. Cooling system for 3D IC
KR20150027583A (ko) * 2013-09-04 2015-03-12 삼성전자주식회사 열전 소자를 갖는 반도체 소자

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US9746889B2 (en) 2017-08-29
KR20180005179A (ko) 2018-01-15
TW201642409A (zh) 2016-12-01
CN107534038A (zh) 2018-01-02
WO2016183099A1 (en) 2016-11-17
JP2018514951A (ja) 2018-06-07
US20160334845A1 (en) 2016-11-17
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BR112017024277B1 (pt) 2022-12-13

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