BR112016018580A2 - - Google Patents

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Publication number
BR112016018580A2
BR112016018580A2 BR112016018580A BR112016018580A BR112016018580A2 BR 112016018580 A2 BR112016018580 A2 BR 112016018580A2 BR 112016018580 A BR112016018580 A BR 112016018580A BR 112016018580 A BR112016018580 A BR 112016018580A BR 112016018580 A2 BR112016018580 A2 BR 112016018580A2
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BR
Brazil
Application number
BR112016018580A
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BR112016018580B1 (pt
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Publication of BR112016018580A2 publication Critical patent/BR112016018580A2/pt
Publication of BR112016018580B1 publication Critical patent/BR112016018580B1/pt

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    • H01L25/0652—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00 the devices being arranged next and on each other, i.e. mixed assemblies
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    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H01L2924/143—Digital devices
    • H01L2924/1434—Memory
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H01L2924/1815—Shape
    • H01L2924/1816—Exposing the passive side of the semiconductor or solid-state body
    • H01L2924/18161—Exposing the passive side of the semiconductor or solid-state body of a flip chip
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H01L2924/1815—Shape
    • H01L2924/1816—Exposing the passive side of the semiconductor or solid-state body
    • H01L2924/18162—Exposing the passive side of the semiconductor or solid-state body of a chip with build-up interconnect

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
BR112016018580-3A 2014-02-14 2015-02-12 Dispositivo integrado compreendendo matrizes empilhadas nas camadas de redistribuição BR112016018580B1 (pt)

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US14/181,371 US9583460B2 (en) 2014-02-14 2014-02-14 Integrated device comprising stacked dies on redistribution layers
US14/181,371 2014-02-14
PCT/US2015/015639 WO2015123426A2 (en) 2014-02-14 2015-02-12 Integrated device comprising stacked dies on redistribution layers

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CA2937552A1 (en) 2015-08-20
US20150235988A1 (en) 2015-08-20
WO2015123426A3 (en) 2015-10-08
KR20160122769A (ko) 2016-10-24
BR112016018580B1 (pt) 2022-09-20
CN110060974A (zh) 2019-07-26
EP3105789B1 (en) 2022-03-23
CN106133897A (zh) 2016-11-16
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US9583460B2 (en) 2017-02-28
CA2937552C (en) 2019-09-10
WO2015123426A2 (en) 2015-08-20
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