BR112013014566A2 - fonte de evaporação linear, câmara de evaporação e método para revestir substratos - Google Patents
fonte de evaporação linear, câmara de evaporação e método para revestir substratosInfo
- Publication number
- BR112013014566A2 BR112013014566A2 BR112013014566A BR112013014566A BR112013014566A2 BR 112013014566 A2 BR112013014566 A2 BR 112013014566A2 BR 112013014566 A BR112013014566 A BR 112013014566A BR 112013014566 A BR112013014566 A BR 112013014566A BR 112013014566 A2 BR112013014566 A2 BR 112013014566A2
- Authority
- BR
- Brazil
- Prior art keywords
- coating substrates
- evaporation
- linear
- evaporation source
- chamber
- Prior art date
Links
- 230000008020 evaporation Effects 0.000 title 2
- 238000001704 evaporation Methods 0.000 title 2
- 239000011248 coating agent Substances 0.000 title 1
- 238000000576 coating method Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
- 239000000758 substrate Substances 0.000 title 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B1/00—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means
- B05B1/005—Nozzles or other outlets specially adapted for discharging one or more gases
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/243—Crucibles for source material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
- H01L31/036—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes
- H01L31/0392—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes including thin films deposited on metallic or insulating substrates ; characterised by specific substrate materials or substrate features or by the presence of intermediate layers, e.g. barrier layers, on the substrate
- H01L31/03923—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes including thin films deposited on metallic or insulating substrates ; characterised by specific substrate materials or substrate features or by the presence of intermediate layers, e.g. barrier layers, on the substrate including AIBIIICVI compound materials, e.g. CIS, CIGS
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/541—CuInSe2 material PV cells
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physical Vapour Deposition (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102010055285.2 | 2010-12-21 | ||
DE102010055285A DE102010055285A1 (de) | 2010-12-21 | 2010-12-21 | Verdampferquelle, Verdampferkammer und Beschichtungsverfahren |
PCT/EP2011/006383 WO2012084165A1 (de) | 2010-12-21 | 2011-12-16 | Verdampferquelle, verdampferkammer, beschichtungsverfahren und düsenplatte |
Publications (2)
Publication Number | Publication Date |
---|---|
BR112013014566A2 true BR112013014566A2 (pt) | 2016-09-20 |
BR112013014566B1 BR112013014566B1 (pt) | 2020-11-03 |
Family
ID=45440480
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
BR112013014566-8A BR112013014566B1 (pt) | 2010-12-21 | 2011-12-16 | fonte de evaporação linear e método para revestir substratos |
Country Status (6)
Country | Link |
---|---|
US (1) | US20130337174A1 (pt) |
EP (1) | EP2655686B1 (pt) |
CN (1) | CN103261468B (pt) |
BR (1) | BR112013014566B1 (pt) |
DE (1) | DE102010055285A1 (pt) |
WO (1) | WO2012084165A1 (pt) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101084234B1 (ko) * | 2009-11-30 | 2011-11-16 | 삼성모바일디스플레이주식회사 | 증착원, 이를 구비하는 증착 장치 및 박막 형성 방법 |
CN103866236A (zh) * | 2012-12-18 | 2014-06-18 | 北京汉能创昱科技有限公司 | 一种铜铟镓硒薄膜电池共蒸发线性源的布置方法 |
CN103898450B (zh) * | 2012-12-25 | 2017-06-13 | 北京创昱科技有限公司 | 一种铜铟镓硒共蒸发线性源装置及其使用方法 |
CN104099571A (zh) * | 2013-04-01 | 2014-10-15 | 上海和辉光电有限公司 | 蒸发源组件和薄膜沉积装置和薄膜沉积方法 |
EP3234213A1 (en) * | 2014-12-17 | 2017-10-25 | Applied Materials, Inc. | Material deposition arrangement, a vacuum deposition system and method for depositing material |
CN105088147B (zh) * | 2015-09-11 | 2017-09-26 | 京东方科技集团股份有限公司 | 坩埚结构 |
US10760155B2 (en) * | 2015-09-24 | 2020-09-01 | Sharp Kabushiki Kaisha | Vapor deposition source and vapor deposition device for producing vapor deposition film with high material usage efficiency |
CN105401125B (zh) | 2015-12-15 | 2018-09-04 | 深圳市华星光电技术有限公司 | 用于有机电激光显示的基板的蒸镀方法和蒸镀装置 |
JP6765237B2 (ja) * | 2016-07-05 | 2020-10-07 | キヤノントッキ株式会社 | 蒸着装置及び蒸発源 |
CN107299321B (zh) * | 2017-07-28 | 2019-07-26 | 武汉华星光电半导体显示技术有限公司 | 蒸发源装置及蒸镀机 |
CN109746142B (zh) * | 2017-11-06 | 2021-04-02 | 张家港康得新光电材料有限公司 | 镀膜装置 |
JP2020521039A (ja) * | 2018-05-04 | 2020-07-16 | アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated | 蒸発した材料を堆積させるための蒸発源、真空堆積システム、及び蒸発した材料を堆積させるための方法 |
CN109666898A (zh) * | 2019-01-03 | 2019-04-23 | 福建华佳彩有限公司 | 一种用于点蒸发源的坩埚 |
CN111850478A (zh) * | 2019-04-30 | 2020-10-30 | 北京铂阳顶荣光伏科技有限公司 | 点蒸发源及蒸镀设备 |
Family Cites Families (31)
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US3281517A (en) * | 1963-11-19 | 1966-10-25 | Melpar Inc | Vacuum furnace |
US3446936A (en) * | 1966-01-03 | 1969-05-27 | Sperry Rand Corp | Evaporant source |
US3554512A (en) * | 1969-03-24 | 1971-01-12 | George H Elliott | Crucible for holding molten semiconductor materials |
DE2449225C3 (de) * | 1974-10-16 | 1980-06-04 | Leybold-Heraeus Gmbh, 5000 Koeln | Verdampfungstiegel für Vakuumbedampfungs anlagen |
DE2822130A1 (de) * | 1978-05-20 | 1979-11-22 | Leybold Heraeus Gmbh & Co Kg | Aus metallblech geformtes verdampferschiffchen mit perforiertem deckel |
US5150375A (en) | 1989-06-14 | 1992-09-22 | Mitsubishi Denki Kabushiki Kaisha | Substance vaporizing apparatus |
JP2619068B2 (ja) * | 1989-09-08 | 1997-06-11 | 三菱電機株式会社 | 薄膜形成装置 |
DE4225169C2 (de) * | 1992-07-30 | 1994-09-22 | Juergen Dipl Phys Dr Gspann | Vorrichtung und Verfahren zur Erzeugung von Agglomeratstrahlen |
US5803976A (en) * | 1993-11-09 | 1998-09-08 | Imperial Chemical Industries Plc | Vacuum web coating |
DE4408052C1 (de) * | 1994-03-10 | 1995-04-20 | Kernforschungsz Karlsruhe | Verwendung einer Apparatur zur Clusterstrahlerzeugung und zur Oberflächenbeschichtung eines Substrats |
DE4422697C1 (de) | 1994-06-29 | 1996-01-25 | Zsw | Verdampferquelle für eine Aufdampfanlage und ihre Verwendung |
US20030111014A1 (en) * | 2001-12-18 | 2003-06-19 | Donatucci Matthew B. | Vaporizer/delivery vessel for volatile/thermally sensitive solid and liquid compounds |
KR100467805B1 (ko) * | 2002-01-22 | 2005-01-24 | 학교법인연세대학교 | 박막두께분포를 조절 가능한 선형 및 평면형 증발원 |
JP3754380B2 (ja) * | 2002-02-06 | 2006-03-08 | 株式会社エイコー・エンジニアリング | 薄膜堆積用分子線源セルと薄膜堆積方法 |
DE60305246T2 (de) * | 2002-07-19 | 2006-09-14 | Lg Electronics Inc. | Quelle zur thermischen PVD-Beschichtung für organische elektrolumineszente Schichten |
JP4380319B2 (ja) * | 2002-12-19 | 2009-12-09 | ソニー株式会社 | 蒸着装置および有機エレクトロルミネッセンス素子の製造方法 |
JP4493926B2 (ja) * | 2003-04-25 | 2010-06-30 | 株式会社半導体エネルギー研究所 | 製造装置 |
JP4447256B2 (ja) * | 2003-06-27 | 2010-04-07 | 株式会社半導体エネルギー研究所 | 発光装置の作製方法 |
US6837939B1 (en) * | 2003-07-22 | 2005-01-04 | Eastman Kodak Company | Thermal physical vapor deposition source using pellets of organic material for making OLED displays |
EP2369035B9 (en) * | 2003-08-04 | 2014-05-21 | LG Display Co., Ltd. | Evaporation source |
JP4476019B2 (ja) * | 2004-05-20 | 2010-06-09 | 東北パイオニア株式会社 | 成膜源、真空成膜装置、有機el素子の製造方法 |
JP2006225757A (ja) * | 2005-01-21 | 2006-08-31 | Mitsubishi Heavy Ind Ltd | 真空蒸着装置 |
WO2008004792A1 (en) | 2006-07-03 | 2008-01-10 | Yas Co., Ltd. | Multiple nozzle evaporator for vacuum thermal evaporation |
JP2008019477A (ja) * | 2006-07-13 | 2008-01-31 | Canon Inc | 真空蒸着装置 |
JP4768584B2 (ja) | 2006-11-16 | 2011-09-07 | 財団法人山形県産業技術振興機構 | 蒸発源およびこれを用いた真空蒸着装置 |
EP1967604A1 (en) * | 2007-03-08 | 2008-09-10 | Applied Materials, Inc. | Evaporation crucible and evaporation apparatus with directional evaporation |
DE102007012370A1 (de) * | 2007-03-14 | 2008-09-18 | Createc Fischer & Co. Gmbh | Bedampfungseinrichtung und Bedampfungsverfahren zur Molekularstrahlbedampfung und Molekularstrahlepitaxie |
NL2001289C2 (nl) * | 2008-02-15 | 2009-08-18 | Otb Groep B V | Dampdepositiebron. |
US20100189929A1 (en) * | 2009-01-28 | 2010-07-29 | Neal James W | Coating device and deposition apparatus |
JP4831841B2 (ja) * | 2009-07-10 | 2011-12-07 | 三菱重工業株式会社 | 真空蒸着装置及び方法 |
KR101094299B1 (ko) * | 2009-12-17 | 2011-12-19 | 삼성모바일디스플레이주식회사 | 선형 증발원 및 이를 포함하는 증착 장치 |
-
2010
- 2010-12-21 DE DE102010055285A patent/DE102010055285A1/de not_active Withdrawn
-
2011
- 2011-12-16 WO PCT/EP2011/006383 patent/WO2012084165A1/de active Application Filing
- 2011-12-16 EP EP11802863.8A patent/EP2655686B1/de active Active
- 2011-12-16 BR BR112013014566-8A patent/BR112013014566B1/pt active IP Right Grant
- 2011-12-16 CN CN201180060285.2A patent/CN103261468B/zh active Active
-
2013
- 2013-05-17 US US13/897,339 patent/US20130337174A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
CN103261468A (zh) | 2013-08-21 |
DE102010055285A1 (de) | 2012-06-21 |
BR112013014566B1 (pt) | 2020-11-03 |
WO2012084165A1 (de) | 2012-06-28 |
EP2655686B1 (de) | 2017-11-22 |
CN103261468B (zh) | 2015-10-21 |
US20130337174A1 (en) | 2013-12-19 |
EP2655686A1 (de) | 2013-10-30 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
B25G | Requested change of headquarter approved |
Owner name: SOLARION AG PHOTOVOLTAIK (DE) |
|
B06F | Objections, documents and/or translations needed after an examination request according [chapter 6.6 patent gazette] | ||
B06T | Formal requirements before examination [chapter 6.20 patent gazette] | ||
B09A | Decision: intention to grant [chapter 9.1 patent gazette] | ||
B16A | Patent or certificate of addition of invention granted |
Free format text: PRAZO DE VALIDADE: 20 (VINTE) ANOS CONTADOS A PARTIR DE 16/12/2011, OBSERVADAS AS CONDICOES LEGAIS. |