BR0012885A - Filamentos de fibra de vidro impregnadas e produtos que incluem os mesmos - Google Patents
Filamentos de fibra de vidro impregnadas e produtos que incluem os mesmosInfo
- Publication number
- BR0012885A BR0012885A BR0012885-6A BR0012885A BR0012885A BR 0012885 A BR0012885 A BR 0012885A BR 0012885 A BR0012885 A BR 0012885A BR 0012885 A BR0012885 A BR 0012885A
- Authority
- BR
- Brazil
- Prior art keywords
- fibers
- resin
- compatible
- particles
- glass fibers
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C25/00—Surface treatment of fibres or filaments made from glass, minerals or slags
- C03C25/10—Coating
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C25/00—Surface treatment of fibres or filaments made from glass, minerals or slags
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C25/00—Surface treatment of fibres or filaments made from glass, minerals or slags
- C03C25/10—Coating
- C03C25/465—Coatings containing composite materials
- C03C25/47—Coatings containing composite materials containing particles, fibres or flakes, e.g. in a continuous phase
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C25/00—Surface treatment of fibres or filaments made from glass, minerals or slags
- C03C25/10—Coating
- C03C25/48—Coating with two or more coatings having different compositions
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/04—Reinforcing macromolecular compounds with loose or coherent fibrous material
- C08J5/06—Reinforcing macromolecular compounds with loose or coherent fibrous material using pretreated fibrous materials
- C08J5/08—Reinforcing macromolecular compounds with loose or coherent fibrous material using pretreated fibrous materials glass fibres
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0166—Polymeric layer used for special processing, e.g. resist for etching insulating material or photoresist used as a mask during plasma etching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0175—Inorganic, non-metallic layer, e.g. resist or dielectric for printed capacitor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0209—Inorganic, non-metallic particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0212—Resin particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0239—Coupling agent for particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0242—Shape of an individual particle
- H05K2201/0245—Flakes, flat particles or lamellar particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0242—Shape of an individual particle
- H05K2201/0254—Microballoons or hollow filler particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0275—Fibers and reinforcement materials
- H05K2201/029—Woven fibrous reinforcement or textile
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/12—Using specific substances
- H05K2203/127—Lubricants, e.g. during drilling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
Landscapes
- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- General Life Sciences & Earth Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Composite Materials (AREA)
- Manufacturing & Machinery (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Reinforced Plastic Materials (AREA)
- Treatments For Attaching Organic Compounds To Fibrous Goods (AREA)
- Laminated Bodies (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Chemical Or Physical Treatment Of Fibers (AREA)
- Woven Fabrics (AREA)
- Surface Treatment Of Glass Fibres Or Filaments (AREA)
Applications Claiming Priority (10)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US14660599P | 1999-07-30 | 1999-07-30 | |
US14633799P | 1999-07-30 | 1999-07-30 | |
US14686299P | 1999-08-03 | 1999-08-03 | |
PCT/US1999/021442 WO2000021899A1 (fr) | 1998-10-13 | 1999-10-08 | Brins de fibre de verre impregnes et produits les contenant |
US18356200P | 2000-02-18 | 2000-02-18 | |
US52703400A | 2000-03-16 | 2000-03-16 | |
US54837900A | 2000-04-12 | 2000-04-12 | |
US56891600A | 2000-05-11 | 2000-05-11 | |
US62052300A | 2000-07-20 | 2000-07-20 | |
PCT/US2000/020459 WO2001009054A1 (fr) | 1999-07-30 | 2000-07-28 | Torons de fibres de verre impregnees et produits contenant de tels torons |
Publications (1)
Publication Number | Publication Date |
---|---|
BR0012885A true BR0012885A (pt) | 2002-07-16 |
Family
ID=27574950
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
BR0012885-6A BR0012885A (pt) | 1999-07-30 | 2000-07-28 | Filamentos de fibra de vidro impregnadas e produtos que incluem os mesmos |
BR0012887-2A BR0012887A (pt) | 1999-07-30 | 2000-07-28 | Cordões de fibras impregnadas e produtos incluindo os mesmos |
BR0012872-4A BR0012872A (pt) | 1999-07-30 | 2000-07-28 | Filamentos de fibra de vidro impregnados e produtos incluindo os mesmos |
Family Applications After (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
BR0012887-2A BR0012887A (pt) | 1999-07-30 | 2000-07-28 | Cordões de fibras impregnadas e produtos incluindo os mesmos |
BR0012872-4A BR0012872A (pt) | 1999-07-30 | 2000-07-28 | Filamentos de fibra de vidro impregnados e produtos incluindo os mesmos |
Country Status (10)
Country | Link |
---|---|
EP (2) | EP1204697A1 (fr) |
JP (2) | JP2004513858A (fr) |
KR (2) | KR20020026958A (fr) |
CN (2) | CN100387642C (fr) |
AU (2) | AU6383100A (fr) |
BR (3) | BR0012885A (fr) |
CA (2) | CA2382188A1 (fr) |
HK (1) | HK1046701A1 (fr) |
MX (3) | MXPA01003660A (fr) |
WO (2) | WO2001012702A1 (fr) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5181221B2 (ja) * | 2008-01-15 | 2013-04-10 | 日立化成株式会社 | 低熱膨張性低誘電損失プリプレグ及びその応用品 |
KR100879284B1 (ko) * | 2008-02-12 | 2009-01-16 | (주)상아프론테크 | 인쇄회로기판 천공용 윤활시트 및 상기 윤활시트 형성용조성물 |
US8133929B2 (en) | 2008-04-15 | 2012-03-13 | Sika Technology Ag | Method for incorporating long glass fibers into epoxy-based reinforcing resins |
US20110014467A1 (en) * | 2009-07-16 | 2011-01-20 | Brown Nancy E | Extrusion coated non-twisted yarn |
CN101880964A (zh) * | 2010-06-04 | 2010-11-10 | 上海宏和电子材料有限公司 | 一种环保绿色电子级玻璃纤维布二次浆料 |
CN102352089B (zh) * | 2011-07-01 | 2013-03-20 | 中航复合材料有限责任公司 | 一种植物纤维增强生物质树脂薄层材料及其制备方法 |
US20190022897A1 (en) | 2017-07-24 | 2019-01-24 | Aerlyte, Inc. | Fiber-reinforced molding compounds and methods of forming and using the same |
DE102017126447A1 (de) * | 2017-11-10 | 2019-05-16 | CHT Germany GmbH | Beschichtung von Faserprodukten mit wässrigen Polymerdispersionen |
CN113480199B (zh) * | 2021-08-02 | 2022-11-01 | 四川文理学院 | 一种增强型玄武岩纤维浸润剂及其制备方法 |
CN115806395B (zh) * | 2022-12-16 | 2024-05-14 | 常州爱特恩新材料科技有限公司 | 一种玻璃纤维的表面改性系统 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3312569A (en) * | 1965-05-07 | 1967-04-04 | Owens Corning Fiberglass Corp | Compatible fibrous glass reinforcements of superior bonding and wetting characteristics |
US5217778A (en) * | 1982-10-21 | 1993-06-08 | Raymark Industries, Inc. | Composite fiber friction facing |
DE3826522A1 (de) * | 1988-08-04 | 1990-02-08 | Teldix Gmbh | Leiterplatte |
JP2545957B2 (ja) * | 1988-12-15 | 1996-10-23 | 日東紡績株式会社 | プリント配線基板及び同基板用織物 |
JPH0818853B2 (ja) * | 1989-11-15 | 1996-02-28 | 日東紡績株式会社 | ガラスクロスの製造方法 |
JP3520604B2 (ja) * | 1995-05-23 | 2004-04-19 | 日立化成工業株式会社 | コンポジット積層板 |
US5773146A (en) * | 1995-06-05 | 1998-06-30 | Ppg Industries, Inc. | Forming size compositions, glass fibers coated with the same and fabrics woven from such coated fibers |
JPH0977937A (ja) * | 1995-09-12 | 1997-03-25 | Idemitsu Petrochem Co Ltd | プリント配線板用プリプレグ及びプリント配線用基板 |
JP3151397B2 (ja) * | 1995-10-26 | 2001-04-03 | 松下電工株式会社 | プリプレグ及び金属箔張り積層板 |
AU2876599A (en) * | 1998-03-03 | 1999-09-20 | Ppg Industries Ohio, Inc. | Inorganic particle-coated glass fiber strands and products including the same |
JP2002505388A (ja) * | 1998-03-03 | 2002-02-19 | ピーピージー インダストリーズ オハイオ, インコーポレイテッド | ガラス繊維ストランドの摩損の抑制方法 |
ID26528A (id) * | 1998-03-03 | 2001-01-11 | Ppg Ind Ohio Inc | Laminasi serat gelas-yang diperkuat, papan sirkuit elektronik dan metode penyusunan suatu struktur jalinan |
JP2002527333A (ja) * | 1998-10-13 | 2002-08-27 | ピーピージー インダストリーズ オハイオ, インコーポレイテッド | 含浸ガラス繊維ストランドおよびこれを含む製品 |
CN101117275B (zh) * | 1998-10-13 | 2012-10-24 | Ppg工业俄亥俄公司 | 玻璃纤维补强的预浸渍片、层压件、电路板以及装配织物的方法 |
-
1999
- 1999-10-08 MX MXPA01003660 patent/MXPA01003660A/es not_active Application Discontinuation
-
2000
- 2000-07-28 BR BR0012885-6A patent/BR0012885A/pt not_active IP Right Cessation
- 2000-07-28 CA CA002382188A patent/CA2382188A1/fr not_active Abandoned
- 2000-07-28 EP EP00950805A patent/EP1204697A1/fr not_active Withdrawn
- 2000-07-28 WO PCT/US2000/020523 patent/WO2001012702A1/fr active Search and Examination
- 2000-07-28 AU AU63831/00A patent/AU6383100A/en not_active Abandoned
- 2000-07-28 EP EP00950780A patent/EP1204696A1/fr not_active Withdrawn
- 2000-07-28 WO PCT/US2000/020457 patent/WO2001012701A1/fr not_active Application Discontinuation
- 2000-07-28 CN CNB008136874A patent/CN100387642C/zh not_active Expired - Fee Related
- 2000-07-28 MX MXPA02001100A patent/MXPA02001100A/es unknown
- 2000-07-28 CA CA002381171A patent/CA2381171A1/fr not_active Abandoned
- 2000-07-28 JP JP2001517593A patent/JP2004513858A/ja not_active Withdrawn
- 2000-07-28 JP JP2001517592A patent/JP2004513976A/ja not_active Withdrawn
- 2000-07-28 AU AU63851/00A patent/AU6385100A/en not_active Abandoned
- 2000-07-28 KR KR1020027001327A patent/KR20020026958A/ko not_active Application Discontinuation
- 2000-07-28 BR BR0012887-2A patent/BR0012887A/pt not_active IP Right Cessation
- 2000-07-28 KR KR1020027001324A patent/KR20020026956A/ko not_active Application Discontinuation
- 2000-07-28 BR BR0012872-4A patent/BR0012872A/pt not_active IP Right Cessation
- 2000-07-28 CN CN00813542A patent/CN1402753A/zh active Pending
- 2000-07-28 MX MXPA02001092A patent/MXPA02001092A/es unknown
-
2002
- 2002-11-13 HK HK02108230.1A patent/HK1046701A1/zh unknown
Also Published As
Publication number | Publication date |
---|---|
JP2004513858A (ja) | 2004-05-13 |
AU6383100A (en) | 2001-03-13 |
MXPA02001092A (es) | 2003-07-21 |
JP2004513976A (ja) | 2004-05-13 |
EP1204697A1 (fr) | 2002-05-15 |
CN1402753A (zh) | 2003-03-12 |
CN100387642C (zh) | 2008-05-14 |
AU6385100A (en) | 2001-03-13 |
CA2381171A1 (fr) | 2001-02-22 |
BR0012872A (pt) | 2002-07-23 |
KR20020026956A (ko) | 2002-04-12 |
HK1046701A1 (zh) | 2003-01-24 |
CN1420905A (zh) | 2003-05-28 |
KR20020026958A (ko) | 2002-04-12 |
WO2001012702A1 (fr) | 2001-02-22 |
BR0012887A (pt) | 2002-07-23 |
MXPA01003660A (es) | 2001-07-01 |
EP1204696A1 (fr) | 2002-05-15 |
MXPA02001100A (es) | 2003-07-21 |
WO2001012701A1 (fr) | 2001-02-22 |
CA2382188A1 (fr) | 2001-02-22 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
B08F | Application fees: application dismissed [chapter 8.6 patent gazette] |
Free format text: REFERENTE AS 5A,6A E 7A ANUIDADES |
|
B08K | Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette] |
Free format text: REFERENTE AO DESPACHO 8.6 PUBLICADO NA RPI 1926 DE 04/12/2007. |