BR0012872A - Filamentos de fibra de vidro impregnados e produtos incluindo os mesmos - Google Patents
Filamentos de fibra de vidro impregnados e produtos incluindo os mesmosInfo
- Publication number
- BR0012872A BR0012872A BR0012872-4A BR0012872A BR0012872A BR 0012872 A BR0012872 A BR 0012872A BR 0012872 A BR0012872 A BR 0012872A BR 0012872 A BR0012872 A BR 0012872A
- Authority
- BR
- Brazil
- Prior art keywords
- resin
- coating composition
- particles
- thermally expandable
- materials
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C25/00—Surface treatment of fibres or filaments made from glass, minerals or slags
- C03C25/10—Coating
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C25/00—Surface treatment of fibres or filaments made from glass, minerals or slags
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C25/00—Surface treatment of fibres or filaments made from glass, minerals or slags
- C03C25/10—Coating
- C03C25/465—Coatings containing composite materials
- C03C25/47—Coatings containing composite materials containing particles, fibres or flakes, e.g. in a continuous phase
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C25/00—Surface treatment of fibres or filaments made from glass, minerals or slags
- C03C25/10—Coating
- C03C25/48—Coating with two or more coatings having different compositions
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/04—Reinforcing macromolecular compounds with loose or coherent fibrous material
- C08J5/06—Reinforcing macromolecular compounds with loose or coherent fibrous material using pretreated fibrous materials
- C08J5/08—Reinforcing macromolecular compounds with loose or coherent fibrous material using pretreated fibrous materials glass fibres
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0166—Polymeric layer used for special processing, e.g. resist for etching insulating material or photoresist used as a mask during plasma etching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0175—Inorganic, non-metallic layer, e.g. resist or dielectric for printed capacitor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0209—Inorganic, non-metallic particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0212—Resin particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0239—Coupling agent for particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0242—Shape of an individual particle
- H05K2201/0245—Flakes, flat particles or lamellar particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0242—Shape of an individual particle
- H05K2201/0254—Microballoons or hollow filler particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0275—Fibers and reinforcement materials
- H05K2201/029—Woven fibrous reinforcement or textile
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/12—Using specific substances
- H05K2203/127—Lubricants, e.g. during drilling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
Landscapes
- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- General Life Sciences & Earth Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Composite Materials (AREA)
- Manufacturing & Machinery (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Reinforced Plastic Materials (AREA)
- Treatments For Attaching Organic Compounds To Fibrous Goods (AREA)
- Laminated Bodies (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Chemical Or Physical Treatment Of Fibers (AREA)
- Surface Treatment Of Glass Fibres Or Filaments (AREA)
- Woven Fabrics (AREA)
Abstract
"FILAMENTOS DE FIBRA DE VIDRO IMPREGNADOS E PRODUTOS INCLUINDO OS MESMOS". A presente invenção proporciona um filamento de fibra pelo menos parcialmente revestido, compreendendo uma pluralidade de fibras de vidro tendo uma composição de revestimento compatível com resina sobre pelo menos uma parte de uma superfície de pelo menos uma das ditas fibras, a composição de revestimento compatível com resina compreendendo: (a) uma pluralidade de partículas inorgânicas lamelares tendo um valor de dureza Mohs que não excede o valor de dureza Mohs das ditas fibras de vidro; e (b) pelo menos um material polimérico. A presente invenção proporciona ainda o uso de uma composição de revestimento compatível com resina compreendendo: (a) uma pluralidade de partículas distintas formadas de materiais selecionados de materiais orgânicos não expansíveis termicamente, materiais poliméricos inorgânicos, materiais compostos não expansíveis termicamente e as suas misturas, as partículas tendo um tamanho de partícula médio suficiente para permitir o molhamento do filamento; (b) pelo menos um material lúbrico diferente da dita pluralidade de partículas distintas; e (c) pelo menos um material formador de filme. A composição de revestimento compatível com resina também pode compreender: (a) uma pluralidade de partículas orgânicas não expansíveis termicamente, ocas; e (b) pelo menos um material lúbrico diferente da pelo menos uma partícula orgânica oca.
Applications Claiming Priority (10)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US14633799P | 1999-07-30 | 1999-07-30 | |
US14660599P | 1999-07-30 | 1999-07-30 | |
US14686299P | 1999-08-03 | 1999-08-03 | |
PCT/US1999/021442 WO2000021899A1 (en) | 1998-10-13 | 1999-10-08 | Impregnated glass fiber strands and products including the same |
US18356200P | 2000-02-18 | 2000-02-18 | |
US52703400A | 2000-03-16 | 2000-03-16 | |
US54837900A | 2000-04-12 | 2000-04-12 | |
US56891600A | 2000-05-11 | 2000-05-11 | |
US62052300A | 2000-07-20 | 2000-07-20 | |
PCT/US2000/020457 WO2001012701A1 (en) | 1999-07-30 | 2000-07-28 | Impregnated glass fiber strands and products including the same |
Publications (1)
Publication Number | Publication Date |
---|---|
BR0012872A true BR0012872A (pt) | 2002-07-23 |
Family
ID=27574950
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
BR0012885-6A BR0012885A (pt) | 1999-07-30 | 2000-07-28 | Filamentos de fibra de vidro impregnadas e produtos que incluem os mesmos |
BR0012872-4A BR0012872A (pt) | 1999-07-30 | 2000-07-28 | Filamentos de fibra de vidro impregnados e produtos incluindo os mesmos |
BR0012887-2A BR0012887A (pt) | 1999-07-30 | 2000-07-28 | Cordões de fibras impregnadas e produtos incluindo os mesmos |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
BR0012885-6A BR0012885A (pt) | 1999-07-30 | 2000-07-28 | Filamentos de fibra de vidro impregnadas e produtos que incluem os mesmos |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
BR0012887-2A BR0012887A (pt) | 1999-07-30 | 2000-07-28 | Cordões de fibras impregnadas e produtos incluindo os mesmos |
Country Status (10)
Country | Link |
---|---|
EP (2) | EP1204697A1 (pt) |
JP (2) | JP2004513858A (pt) |
KR (2) | KR20020026956A (pt) |
CN (2) | CN100387642C (pt) |
AU (2) | AU6383100A (pt) |
BR (3) | BR0012885A (pt) |
CA (2) | CA2381171A1 (pt) |
HK (1) | HK1046701A1 (pt) |
MX (3) | MXPA01003660A (pt) |
WO (2) | WO2001012702A1 (pt) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5181221B2 (ja) * | 2008-01-15 | 2013-04-10 | 日立化成株式会社 | 低熱膨張性低誘電損失プリプレグ及びその応用品 |
KR100879284B1 (ko) * | 2008-02-12 | 2009-01-16 | (주)상아프론테크 | 인쇄회로기판 천공용 윤활시트 및 상기 윤활시트 형성용조성물 |
US8133929B2 (en) * | 2008-04-15 | 2012-03-13 | Sika Technology Ag | Method for incorporating long glass fibers into epoxy-based reinforcing resins |
US20110014467A1 (en) * | 2009-07-16 | 2011-01-20 | Brown Nancy E | Extrusion coated non-twisted yarn |
CN101880964A (zh) * | 2010-06-04 | 2010-11-10 | 上海宏和电子材料有限公司 | 一种环保绿色电子级玻璃纤维布二次浆料 |
CN102352089B (zh) * | 2011-07-01 | 2013-03-20 | 中航复合材料有限责任公司 | 一种植物纤维增强生物质树脂薄层材料及其制备方法 |
US10011048B1 (en) | 2017-07-24 | 2018-07-03 | Aerlyte, Inc. | Fiber-reinforced molding compounds and methods of forming and using the same |
DE102017126447A1 (de) * | 2017-11-10 | 2019-05-16 | CHT Germany GmbH | Beschichtung von Faserprodukten mit wässrigen Polymerdispersionen |
CN113480199B (zh) * | 2021-08-02 | 2022-11-01 | 四川文理学院 | 一种增强型玄武岩纤维浸润剂及其制备方法 |
CN115806395B (zh) * | 2022-12-16 | 2024-05-14 | 常州爱特恩新材料科技有限公司 | 一种玻璃纤维的表面改性系统 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3312569A (en) * | 1965-05-07 | 1967-04-04 | Owens Corning Fiberglass Corp | Compatible fibrous glass reinforcements of superior bonding and wetting characteristics |
US5217778A (en) * | 1982-10-21 | 1993-06-08 | Raymark Industries, Inc. | Composite fiber friction facing |
DE3826522A1 (de) * | 1988-08-04 | 1990-02-08 | Teldix Gmbh | Leiterplatte |
JP2545957B2 (ja) * | 1988-12-15 | 1996-10-23 | 日東紡績株式会社 | プリント配線基板及び同基板用織物 |
JPH0818853B2 (ja) * | 1989-11-15 | 1996-02-28 | 日東紡績株式会社 | ガラスクロスの製造方法 |
JP3520604B2 (ja) * | 1995-05-23 | 2004-04-19 | 日立化成工業株式会社 | コンポジット積層板 |
US5773146A (en) * | 1995-06-05 | 1998-06-30 | Ppg Industries, Inc. | Forming size compositions, glass fibers coated with the same and fabrics woven from such coated fibers |
JPH0977937A (ja) * | 1995-09-12 | 1997-03-25 | Idemitsu Petrochem Co Ltd | プリント配線板用プリプレグ及びプリント配線用基板 |
JP3151397B2 (ja) * | 1995-10-26 | 2001-04-03 | 松下電工株式会社 | プリプレグ及び金属箔張り積層板 |
HUP0101382A3 (en) * | 1998-03-03 | 2002-10-28 | Ppg Ind Ohio Inc Cleveland | Glass fiber-reinforced laminates, electronic circuit boards and methods for assembling a fabric |
WO1999044956A1 (en) * | 1998-03-03 | 1999-09-10 | Ppg Industries Ohio, Inc. | Inorganic particle-coated glass fiber strands and products including the same |
MX216199B (en) * | 1998-03-03 | 2003-09-03 | Ppg Ind Ohio Inc | Methods for inhibiting abrasive wear of glass fiber strands |
CA2346111A1 (en) * | 1998-10-13 | 2000-04-20 | Ernest L. Lawton | Glass fiber-reinforced prepregs, laminates, electronic circuit boards and methods for assembling a fabric |
EP1124769A1 (en) * | 1998-10-13 | 2001-08-22 | PPG Industries Ohio, Inc. | Impregnated glass fiber strands and products including the same |
-
1999
- 1999-10-08 MX MXPA01003660 patent/MXPA01003660A/es not_active Application Discontinuation
-
2000
- 2000-07-28 WO PCT/US2000/020523 patent/WO2001012702A1/en active Search and Examination
- 2000-07-28 EP EP00950805A patent/EP1204697A1/en not_active Withdrawn
- 2000-07-28 KR KR1020027001324A patent/KR20020026956A/ko not_active Application Discontinuation
- 2000-07-28 BR BR0012885-6A patent/BR0012885A/pt not_active IP Right Cessation
- 2000-07-28 BR BR0012872-4A patent/BR0012872A/pt not_active IP Right Cessation
- 2000-07-28 KR KR1020027001327A patent/KR20020026958A/ko not_active Application Discontinuation
- 2000-07-28 MX MXPA02001092A patent/MXPA02001092A/es unknown
- 2000-07-28 CA CA002381171A patent/CA2381171A1/en not_active Abandoned
- 2000-07-28 AU AU63831/00A patent/AU6383100A/en not_active Abandoned
- 2000-07-28 AU AU63851/00A patent/AU6385100A/en not_active Abandoned
- 2000-07-28 WO PCT/US2000/020457 patent/WO2001012701A1/en not_active Application Discontinuation
- 2000-07-28 CN CNB008136874A patent/CN100387642C/zh not_active Expired - Fee Related
- 2000-07-28 JP JP2001517593A patent/JP2004513858A/ja not_active Withdrawn
- 2000-07-28 BR BR0012887-2A patent/BR0012887A/pt not_active IP Right Cessation
- 2000-07-28 JP JP2001517592A patent/JP2004513976A/ja not_active Withdrawn
- 2000-07-28 EP EP00950780A patent/EP1204696A1/en not_active Withdrawn
- 2000-07-28 CN CN00813542A patent/CN1402753A/zh active Pending
- 2000-07-28 CA CA002382188A patent/CA2382188A1/en not_active Abandoned
- 2000-07-28 MX MXPA02001100A patent/MXPA02001100A/es unknown
-
2002
- 2002-11-13 HK HK02108230.1A patent/HK1046701A1/zh unknown
Also Published As
Publication number | Publication date |
---|---|
CN100387642C (zh) | 2008-05-14 |
KR20020026956A (ko) | 2002-04-12 |
AU6385100A (en) | 2001-03-13 |
MXPA02001100A (es) | 2003-07-21 |
WO2001012701A1 (en) | 2001-02-22 |
AU6383100A (en) | 2001-03-13 |
CA2381171A1 (en) | 2001-02-22 |
MXPA02001092A (es) | 2003-07-21 |
BR0012885A (pt) | 2002-07-16 |
BR0012887A (pt) | 2002-07-23 |
CA2382188A1 (en) | 2001-02-22 |
WO2001012702A1 (en) | 2001-02-22 |
KR20020026958A (ko) | 2002-04-12 |
CN1402753A (zh) | 2003-03-12 |
EP1204697A1 (en) | 2002-05-15 |
CN1420905A (zh) | 2003-05-28 |
JP2004513858A (ja) | 2004-05-13 |
EP1204696A1 (en) | 2002-05-15 |
HK1046701A1 (zh) | 2003-01-24 |
MXPA01003660A (es) | 2001-07-01 |
JP2004513976A (ja) | 2004-05-13 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
B08F | Application fees: application dismissed [chapter 8.6 patent gazette] |
Free format text: REFERENTE A 5A, 6A, E 7A ANUIDADES. |
|
B08K | Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette] |
Free format text: REFERENTE AO DESPACHO 8.6 PUBLICADO NA RPI 1929 DE 26/12/2007. |