BR0012887A - Cordões de fibras impregnadas e produtos incluindo os mesmos - Google Patents

Cordões de fibras impregnadas e produtos incluindo os mesmos

Info

Publication number
BR0012887A
BR0012887A BR0012887-2A BR0012887A BR0012887A BR 0012887 A BR0012887 A BR 0012887A BR 0012887 A BR0012887 A BR 0012887A BR 0012887 A BR0012887 A BR 0012887A
Authority
BR
Brazil
Prior art keywords
resin
coating composition
particles
compatible coating
heat
Prior art date
Application number
BR0012887-2A
Other languages
English (en)
Inventor
Bruce E Novich
Kami Lammon-Hilinski
Walter J Robertson
Xiang Wu
Vedagiri Velpari
Ernest L Lawton
William B Rice
Original Assignee
Ppg Ind Ohio Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from PCT/US1999/021442 external-priority patent/WO2000021899A1/en
Priority claimed from PCT/US1999/021443 external-priority patent/WO2000021900A1/en
Application filed by Ppg Ind Ohio Inc filed Critical Ppg Ind Ohio Inc
Publication of BR0012887A publication Critical patent/BR0012887A/pt

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C25/00—Surface treatment of fibres or filaments made from glass, minerals or slags
    • C03C25/10—Coating
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C25/00—Surface treatment of fibres or filaments made from glass, minerals or slags
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C25/00—Surface treatment of fibres or filaments made from glass, minerals or slags
    • C03C25/10—Coating
    • C03C25/465—Coatings containing composite materials
    • C03C25/47—Coatings containing composite materials containing particles, fibres or flakes, e.g. in a continuous phase
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C25/00—Surface treatment of fibres or filaments made from glass, minerals or slags
    • C03C25/10—Coating
    • C03C25/48—Coating with two or more coatings having different compositions
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/04—Reinforcing macromolecular compounds with loose or coherent fibrous material
    • C08J5/06—Reinforcing macromolecular compounds with loose or coherent fibrous material using pretreated fibrous materials
    • C08J5/08—Reinforcing macromolecular compounds with loose or coherent fibrous material using pretreated fibrous materials glass fibres
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0166—Polymeric layer used for special processing, e.g. resist for etching insulating material or photoresist used as a mask during plasma etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0175—Inorganic, non-metallic layer, e.g. resist or dielectric for printed capacitor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0212—Resin particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0239—Coupling agent for particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0242—Shape of an individual particle
    • H05K2201/0245—Flakes, flat particles or lamellar particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0242—Shape of an individual particle
    • H05K2201/0254—Microballoons or hollow filler particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0275—Fibers and reinforcement materials
    • H05K2201/029—Woven fibrous reinforcement or textile
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/127—Lubricants, e.g. during drilling of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0047—Drilling of holes

Landscapes

  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • General Life Sciences & Earth Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Composite Materials (AREA)
  • Manufacturing & Machinery (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Reinforced Plastic Materials (AREA)
  • Treatments For Attaching Organic Compounds To Fibrous Goods (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Chemical Or Physical Treatment Of Fibers (AREA)
  • Woven Fabrics (AREA)
  • Surface Treatment Of Glass Fibres Or Filaments (AREA)
  • Curing Cements, Concrete, And Artificial Stone (AREA)

Abstract

"CORDõES DE FIBRAS DE VIDRO IMPREGNADAS E PRODUTOS INCLUINDO OS MESMOS". A presente invenção proporciona um cordão de fibras pelo menos parcialmente revestidas compreendendo uma pluralidade de fibras de vidro tendo uma composição de revestimento compatível com resina em pelo menos uma porção de uma superfície de pelo menos uma das ditas fibras de vidro, a composição de revestimento compatível com resina compreendendo: (a) uma pluralidade de partículas inorgânicas lamelares e (b) pelo menos um material polimérico. A presente invenção proporciona adicionalmente que a composição de revestimento compatível com resina compreenda (a) uma pluralidade de partículas discretas formadas por materiais selecionados entre materiais orgânicos, materiais poliméricos inorgânicos não expansíveis por calor, materiais compósitos não expansíveis por calor e misturas dos mesmos, as partículas tendo um tamanho médio de partículas suficiente para permitir que o cordão desumedeça; (b) pelo menos um material lubrificante diferente da dita pluralidade de partículas discretas; e (c) pelo menos um material formador de película. A presente invenção proporciona adicionalmente que a composição de revestimento compatível com resina compreenda (a) uma pluralidade de partículas orgânicas ocas, não expansíveis por calor; e (b) pelo menos um material lubrificante diferente da pelo menos uma partícula orgânica oca.
BR0012887-2A 1999-07-30 2000-07-28 Cordões de fibras impregnadas e produtos incluindo os mesmos BR0012887A (pt)

Applications Claiming Priority (11)

Application Number Priority Date Filing Date Title
US14633799P 1999-07-30 1999-07-30
US14660599P 1999-07-30 1999-07-30
US14686299P 1999-08-03 1999-08-03
PCT/US1999/021442 WO2000021899A1 (en) 1998-10-13 1999-10-08 Impregnated glass fiber strands and products including the same
PCT/US1999/021443 WO2000021900A1 (en) 1998-10-13 1999-10-08 Glass fiber-reinforced prepregs, laminates, electronic circuit boards and methods for assembling a fabric
US18356200P 2000-02-18 2000-02-18
US52703400A 2000-03-16 2000-03-16
US54837900A 2000-04-12 2000-04-12
US56891600A 2000-05-11 2000-05-11
US62052300A 2000-07-20 2000-07-20
PCT/US2000/020523 WO2001012702A1 (en) 1999-07-30 2000-07-28 Impregnated glass fiber strands and products including the same

Publications (1)

Publication Number Publication Date
BR0012887A true BR0012887A (pt) 2002-07-23

Family

ID=27574950

Family Applications (3)

Application Number Title Priority Date Filing Date
BR0012872-4A BR0012872A (pt) 1999-07-30 2000-07-28 Filamentos de fibra de vidro impregnados e produtos incluindo os mesmos
BR0012887-2A BR0012887A (pt) 1999-07-30 2000-07-28 Cordões de fibras impregnadas e produtos incluindo os mesmos
BR0012885-6A BR0012885A (pt) 1999-07-30 2000-07-28 Filamentos de fibra de vidro impregnadas e produtos que incluem os mesmos

Family Applications Before (1)

Application Number Title Priority Date Filing Date
BR0012872-4A BR0012872A (pt) 1999-07-30 2000-07-28 Filamentos de fibra de vidro impregnados e produtos incluindo os mesmos

Family Applications After (1)

Application Number Title Priority Date Filing Date
BR0012885-6A BR0012885A (pt) 1999-07-30 2000-07-28 Filamentos de fibra de vidro impregnadas e produtos que incluem os mesmos

Country Status (10)

Country Link
EP (2) EP1204696A1 (pt)
JP (2) JP2004513976A (pt)
KR (2) KR20020026956A (pt)
CN (2) CN100387642C (pt)
AU (2) AU6385100A (pt)
BR (3) BR0012872A (pt)
CA (2) CA2382188A1 (pt)
HK (1) HK1046701A1 (pt)
MX (3) MXPA01003660A (pt)
WO (2) WO2001012701A1 (pt)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5181221B2 (ja) * 2008-01-15 2013-04-10 日立化成株式会社 低熱膨張性低誘電損失プリプレグ及びその応用品
KR100879284B1 (ko) * 2008-02-12 2009-01-16 (주)상아프론테크 인쇄회로기판 천공용 윤활시트 및 상기 윤활시트 형성용조성물
US8133929B2 (en) 2008-04-15 2012-03-13 Sika Technology Ag Method for incorporating long glass fibers into epoxy-based reinforcing resins
US20110014467A1 (en) * 2009-07-16 2011-01-20 Brown Nancy E Extrusion coated non-twisted yarn
CN101880964A (zh) * 2010-06-04 2010-11-10 上海宏和电子材料有限公司 一种环保绿色电子级玻璃纤维布二次浆料
CN102352089B (zh) * 2011-07-01 2013-03-20 中航复合材料有限责任公司 一种植物纤维增强生物质树脂薄层材料及其制备方法
US10011049B1 (en) 2017-07-24 2018-07-03 Aerlyte, Inc. Fiber-reinforced molding compounds and methods of forming and using the same
DE102017126447A1 (de) * 2017-11-10 2019-05-16 CHT Germany GmbH Beschichtung von Faserprodukten mit wässrigen Polymerdispersionen
CN113480199B (zh) * 2021-08-02 2022-11-01 四川文理学院 一种增强型玄武岩纤维浸润剂及其制备方法
CN115806395B (zh) * 2022-12-16 2024-05-14 常州爱特恩新材料科技有限公司 一种玻璃纤维的表面改性系统

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3312569A (en) * 1965-05-07 1967-04-04 Owens Corning Fiberglass Corp Compatible fibrous glass reinforcements of superior bonding and wetting characteristics
US5217778A (en) * 1982-10-21 1993-06-08 Raymark Industries, Inc. Composite fiber friction facing
DE3826522A1 (de) * 1988-08-04 1990-02-08 Teldix Gmbh Leiterplatte
JP2545957B2 (ja) * 1988-12-15 1996-10-23 日東紡績株式会社 プリント配線基板及び同基板用織物
JPH0818853B2 (ja) * 1989-11-15 1996-02-28 日東紡績株式会社 ガラスクロスの製造方法
JP3520604B2 (ja) * 1995-05-23 2004-04-19 日立化成工業株式会社 コンポジット積層板
US5773146A (en) * 1995-06-05 1998-06-30 Ppg Industries, Inc. Forming size compositions, glass fibers coated with the same and fabrics woven from such coated fibers
JPH0977937A (ja) * 1995-09-12 1997-03-25 Idemitsu Petrochem Co Ltd プリント配線板用プリプレグ及びプリント配線用基板
JP3151397B2 (ja) * 1995-10-26 2001-04-03 松下電工株式会社 プリプレグ及び金属箔張り積層板
WO1999044956A1 (en) * 1998-03-03 1999-09-10 Ppg Industries Ohio, Inc. Inorganic particle-coated glass fiber strands and products including the same
JP2002505216A (ja) * 1998-03-03 2002-02-19 ピーピージー インダストリーズ オハイオ， インコーポレイテッド ガラス繊維−強化積層板、電子回路基板およびファブリックの組み立て方法
WO1999044958A1 (en) * 1998-03-03 1999-09-10 Ppg Industries Ohio, Inc. Methods for inhibiting abrasive wear of glass fiber strands
CA2346111A1 (en) * 1998-10-13 2000-04-20 Ernest L. Lawton Glass fiber-reinforced prepregs, laminates, electronic circuit boards and methods for assembling a fabric
CA2346027A1 (en) * 1998-10-13 2000-04-20 Ernest L. Lawton Impregnated glass fiber strands and products including the same

Also Published As

Publication number Publication date
CN100387642C (zh) 2008-05-14
CA2381171A1 (en) 2001-02-22
KR20020026956A (ko) 2002-04-12
AU6383100A (en) 2001-03-13
CN1402753A (zh) 2003-03-12
EP1204696A1 (en) 2002-05-15
CA2382188A1 (en) 2001-02-22
BR0012872A (pt) 2002-07-23
BR0012885A (pt) 2002-07-16
HK1046701A1 (zh) 2003-01-24
CN1420905A (zh) 2003-05-28
JP2004513976A (ja) 2004-05-13
WO2001012702A1 (en) 2001-02-22
EP1204697A1 (en) 2002-05-15
AU6385100A (en) 2001-03-13
MXPA02001092A (es) 2003-07-21
MXPA02001100A (es) 2003-07-21
MXPA01003660A (es) 2001-07-01
WO2001012701A1 (en) 2001-02-22
KR20020026958A (ko) 2002-04-12
JP2004513858A (ja) 2004-05-13

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Legal Events

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B08F Application fees: application dismissed [chapter 8.6 patent gazette]

Free format text: REFERENTE A 5A, 6A, E 7A ANUIDADES.

B08K Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette]

Free format text: REFERENTE AO DESPACHO 8.6 PUBLICADO NA RPI 1929 DE 26/12/2007.