HK1046701A1 - 浸漬玻璃纖維束以及包括它的產品 - Google Patents

浸漬玻璃纖維束以及包括它的產品

Info

Publication number
HK1046701A1
HK1046701A1 HK02108230.1A HK02108230A HK1046701A1 HK 1046701 A1 HK1046701 A1 HK 1046701A1 HK 02108230 A HK02108230 A HK 02108230A HK 1046701 A1 HK1046701 A1 HK 1046701A1
Authority
HK
Hong Kong
Prior art keywords
same
glass fiber
products including
fiber strands
impregnated glass
Prior art date
Application number
HK02108230.1A
Other languages
English (en)
Inventor
E Novich Bruce
Lammon-Hilinski Kami
J Robertson Walter
Wu Xiang
Velpari Vedagiri
L Lawton Ernest
B Rice William
Original Assignee
Ppg Ind Ohio Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from PCT/US1999/021442 external-priority patent/WO2000021899A1/en
Priority claimed from PCT/US1999/021443 external-priority patent/WO2000021900A1/en
Application filed by Ppg Ind Ohio Inc filed Critical Ppg Ind Ohio Inc
Publication of HK1046701A1 publication Critical patent/HK1046701A1/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C25/00—Surface treatment of fibres or filaments made from glass, minerals or slags
    • C03C25/10—Coating
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C25/00—Surface treatment of fibres or filaments made from glass, minerals or slags
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C25/00—Surface treatment of fibres or filaments made from glass, minerals or slags
    • C03C25/10—Coating
    • C03C25/465—Coatings containing composite materials
    • C03C25/47—Coatings containing composite materials containing particles, fibres or flakes, e.g. in a continuous phase
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C25/00—Surface treatment of fibres or filaments made from glass, minerals or slags
    • C03C25/10—Coating
    • C03C25/48—Coating with two or more coatings having different compositions
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/04—Reinforcing macromolecular compounds with loose or coherent fibrous material
    • C08J5/06—Reinforcing macromolecular compounds with loose or coherent fibrous material using pretreated fibrous materials
    • C08J5/08—Reinforcing macromolecular compounds with loose or coherent fibrous material using pretreated fibrous materials glass fibres
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0166—Polymeric layer used for special processing, e.g. resist for etching insulating material or photoresist used as a mask during plasma etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0175—Inorganic, non-metallic layer, e.g. resist or dielectric for printed capacitor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0212—Resin particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0239—Coupling agent for particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0242—Shape of an individual particle
    • H05K2201/0245—Flakes, flat particles or lamellar particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0242—Shape of an individual particle
    • H05K2201/0254—Microballoons or hollow filler particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0275—Fibers and reinforcement materials
    • H05K2201/029—Woven fibrous reinforcement or textile
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/127—Lubricants, e.g. during drilling of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0047—Drilling of holes

Landscapes

  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • General Life Sciences & Earth Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Health & Medical Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Composite Materials (AREA)
  • Reinforced Plastic Materials (AREA)
  • Treatments For Attaching Organic Compounds To Fibrous Goods (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Chemical Or Physical Treatment Of Fibers (AREA)
  • Woven Fabrics (AREA)
  • Surface Treatment Of Glass Fibres Or Filaments (AREA)
HK02108230.1A 1999-07-30 2002-11-13 浸漬玻璃纖維束以及包括它的產品 HK1046701A1 (zh)

Applications Claiming Priority (11)

Application Number Priority Date Filing Date Title
US14633799P 1999-07-30 1999-07-30
US14660599P 1999-07-30 1999-07-30
US14686299P 1999-08-03 1999-08-03
PCT/US1999/021442 WO2000021899A1 (en) 1998-10-13 1999-10-08 Impregnated glass fiber strands and products including the same
PCT/US1999/021443 WO2000021900A1 (en) 1998-10-13 1999-10-08 Glass fiber-reinforced prepregs, laminates, electronic circuit boards and methods for assembling a fabric
US18356200P 2000-02-18 2000-02-18
US52703400A 2000-03-16 2000-03-16
US54837900A 2000-04-12 2000-04-12
US56891600A 2000-05-11 2000-05-11
US62052300A 2000-07-20 2000-07-20
PCT/US2000/020457 WO2001012701A1 (en) 1999-07-30 2000-07-28 Impregnated glass fiber strands and products including the same

Publications (1)

Publication Number Publication Date
HK1046701A1 true HK1046701A1 (zh) 2003-01-24

Family

ID=27574950

Family Applications (1)

Application Number Title Priority Date Filing Date
HK02108230.1A HK1046701A1 (zh) 1999-07-30 2002-11-13 浸漬玻璃纖維束以及包括它的產品

Country Status (10)

Country Link
EP (2) EP1204696A1 (zh)
JP (2) JP2004513858A (zh)
KR (2) KR20020026958A (zh)
CN (2) CN100387642C (zh)
AU (2) AU6385100A (zh)
BR (3) BR0012885A (zh)
CA (2) CA2382188A1 (zh)
HK (1) HK1046701A1 (zh)
MX (3) MXPA01003660A (zh)
WO (2) WO2001012701A1 (zh)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5181221B2 (ja) * 2008-01-15 2013-04-10 日立化成株式会社 低熱膨張性低誘電損失プリプレグ及びその応用品
KR100879284B1 (ko) * 2008-02-12 2009-01-16 (주)상아프론테크 인쇄회로기판 천공용 윤활시트 및 상기 윤활시트 형성용조성물
US8133929B2 (en) 2008-04-15 2012-03-13 Sika Technology Ag Method for incorporating long glass fibers into epoxy-based reinforcing resins
US20110014467A1 (en) * 2009-07-16 2011-01-20 Brown Nancy E Extrusion coated non-twisted yarn
CN101880964A (zh) * 2010-06-04 2010-11-10 上海宏和电子材料有限公司 一种环保绿色电子级玻璃纤维布二次浆料
CN102352089B (zh) * 2011-07-01 2013-03-20 中航复合材料有限责任公司 一种植物纤维增强生物质树脂薄层材料及其制备方法
US20190022896A1 (en) 2017-07-24 2019-01-24 Aerlyte, Inc. Fiber-reinforced molding compounds and methods of forming and using the same
DE102017126447A1 (de) * 2017-11-10 2019-05-16 CHT Germany GmbH Beschichtung von Faserprodukten mit wässrigen Polymerdispersionen
CN113480199B (zh) * 2021-08-02 2022-11-01 四川文理学院 一种增强型玄武岩纤维浸润剂及其制备方法
CN115806395B (zh) * 2022-12-16 2024-05-14 常州爱特恩新材料科技有限公司 一种玻璃纤维的表面改性系统

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3312569A (en) * 1965-05-07 1967-04-04 Owens Corning Fiberglass Corp Compatible fibrous glass reinforcements of superior bonding and wetting characteristics
US5217778A (en) * 1982-10-21 1993-06-08 Raymark Industries, Inc. Composite fiber friction facing
DE3826522A1 (de) * 1988-08-04 1990-02-08 Teldix Gmbh Leiterplatte
JP2545957B2 (ja) * 1988-12-15 1996-10-23 日東紡績株式会社 プリント配線基板及び同基板用織物
JPH0818853B2 (ja) * 1989-11-15 1996-02-28 日東紡績株式会社 ガラスクロスの製造方法
JP3520604B2 (ja) * 1995-05-23 2004-04-19 日立化成工業株式会社 コンポジット積層板
US5773146A (en) * 1995-06-05 1998-06-30 Ppg Industries, Inc. Forming size compositions, glass fibers coated with the same and fabrics woven from such coated fibers
JPH0977937A (ja) * 1995-09-12 1997-03-25 Idemitsu Petrochem Co Ltd プリント配線板用プリプレグ及びプリント配線用基板
JP3151397B2 (ja) * 1995-10-26 2001-04-03 松下電工株式会社 プリプレグ及び金属箔張り積層板
AU2787499A (en) * 1998-03-03 1999-09-20 Ppg Industries Ohio, Inc. Methods for inhibiting abrasive wear of glass fiber strands
WO1999044959A1 (en) * 1998-03-03 1999-09-10 Ppg Industries Ohio, Inc. Glass fiber-reinforced laminates, electronic circuit boards and methods for assembling a fabric
EP1066224B1 (en) * 1998-03-03 2001-12-12 PPG Industries Ohio, Inc. Inorganic particle-coated glass fiber strands and products including the same
EP1124769A1 (en) * 1998-10-13 2001-08-22 PPG Industries Ohio, Inc. Impregnated glass fiber strands and products including the same
CN101117275B (zh) * 1998-10-13 2012-10-24 Ppg工业俄亥俄公司 玻璃纤维补强的预浸渍片、层压件、电路板以及装配织物的方法

Also Published As

Publication number Publication date
BR0012872A (pt) 2002-07-23
EP1204696A1 (en) 2002-05-15
BR0012887A (pt) 2002-07-23
CN1420905A (zh) 2003-05-28
MXPA02001092A (es) 2003-07-21
BR0012885A (pt) 2002-07-16
CN100387642C (zh) 2008-05-14
AU6383100A (en) 2001-03-13
KR20020026956A (ko) 2002-04-12
JP2004513976A (ja) 2004-05-13
CN1402753A (zh) 2003-03-12
CA2381171A1 (en) 2001-02-22
JP2004513858A (ja) 2004-05-13
EP1204697A1 (en) 2002-05-15
MXPA01003660A (es) 2001-07-01
AU6385100A (en) 2001-03-13
KR20020026958A (ko) 2002-04-12
MXPA02001100A (es) 2003-07-21
WO2001012702A1 (en) 2001-02-22
WO2001012701A1 (en) 2001-02-22
CA2382188A1 (en) 2001-02-22

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