CA2381171A1 - Brins de fibres de verre impregnes et produits comprenant ces derniers - Google Patents
Brins de fibres de verre impregnes et produits comprenant ces derniers Download PDFInfo
- Publication number
- CA2381171A1 CA2381171A1 CA002381171A CA2381171A CA2381171A1 CA 2381171 A1 CA2381171 A1 CA 2381171A1 CA 002381171 A CA002381171 A CA 002381171A CA 2381171 A CA2381171 A CA 2381171A CA 2381171 A1 CA2381171 A1 CA 2381171A1
- Authority
- CA
- Canada
- Prior art keywords
- particles
- materials
- glass fiber
- fabric
- glass
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C25/00—Surface treatment of fibres or filaments made from glass, minerals or slags
- C03C25/10—Coating
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C25/00—Surface treatment of fibres or filaments made from glass, minerals or slags
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C25/00—Surface treatment of fibres or filaments made from glass, minerals or slags
- C03C25/10—Coating
- C03C25/465—Coatings containing composite materials
- C03C25/47—Coatings containing composite materials containing particles, fibres or flakes, e.g. in a continuous phase
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C25/00—Surface treatment of fibres or filaments made from glass, minerals or slags
- C03C25/10—Coating
- C03C25/48—Coating with two or more coatings having different compositions
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/04—Reinforcing macromolecular compounds with loose or coherent fibrous material
- C08J5/06—Reinforcing macromolecular compounds with loose or coherent fibrous material using pretreated fibrous materials
- C08J5/08—Reinforcing macromolecular compounds with loose or coherent fibrous material using pretreated fibrous materials glass fibres
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0166—Polymeric layer used for special processing, e.g. resist for etching insulating material or photoresist used as a mask during plasma etching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0175—Inorganic, non-metallic layer, e.g. resist or dielectric for printed capacitor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0209—Inorganic, non-metallic particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0212—Resin particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0239—Coupling agent for particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0242—Shape of an individual particle
- H05K2201/0245—Flakes, flat particles or lamellar particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0242—Shape of an individual particle
- H05K2201/0254—Microballoons or hollow filler particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0275—Fibers and reinforcement materials
- H05K2201/029—Woven fibrous reinforcement or textile
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/12—Using specific substances
- H05K2203/127—Lubricants, e.g. during drilling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
Landscapes
- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- General Life Sciences & Earth Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Composite Materials (AREA)
- Manufacturing & Machinery (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Reinforced Plastic Materials (AREA)
- Treatments For Attaching Organic Compounds To Fibrous Goods (AREA)
- Laminated Bodies (AREA)
- Chemical Or Physical Treatment Of Fibers (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Surface Treatment Of Glass Fibres Or Filaments (AREA)
- Woven Fabrics (AREA)
Abstract
La présente invention concerne un brin de fibre au moins partiellement recouvert. Ce brin comprend plusieurs fibres de verre recouvertes d'une composition de revêtement compatible avec les résines sur au moins une partie de leur surface. La composition de revêtement compatible avec les résines comprend (a) une pluralité de particules inorganiques lamellaires et (b) au moins un matériau polymère. La présente invention traite également d'une composition de revêtement compatible avec les résines qui comprend (a) une pluralité de particules discrètes formées à partir de matériaux sélectionnés parmi des matériaux organiques ne se dilatant pas à la chaleur, des matériaux polymères inorganiques, des matériaux composites ne se dilatant pas à la chaleur et des mélanges de ces derniers. Les particules présentent une granulométrie moyenne suffisante pour permettre l'imprégnation totale du brin. Cette composition comprend également (b) au moins un matériau lubrifiant différent des particules discrètes et (c) au moins un matériau formant film. La présente invention a également pour objet une composition de revêtement compatible avec les résines qui comprend : (a) plusieurs particules organiques, creuses et ne se dilatant pas à la chaleur, et (b) au moins un matériau lubrifiant différent d'au moins une particule organique creuse.
Applications Claiming Priority (21)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US14660599P | 1999-07-30 | 1999-07-30 | |
US14633799P | 1999-07-30 | 1999-07-30 | |
US60/146,605 | 1999-07-30 | ||
US60/146,337 | 1999-07-30 | ||
US14686299P | 1999-08-03 | 1999-08-03 | |
US60/146,862 | 1999-08-03 | ||
USUS99/21443 | 1999-10-08 | ||
PCT/US1999/021443 WO2000021900A1 (fr) | 1998-10-13 | 1999-10-08 | Plaquettes de circuits electroniques, stratifies et feuilles preimpregnees renforces par fibres de verre, et procede d'assemblage d'un tissu |
USUS99/21442 | 1999-10-08 | ||
PCT/US1999/021442 WO2000021899A1 (fr) | 1998-10-13 | 1999-10-08 | Brins de fibre de verre impregnes et produits les contenant |
US18356200P | 2000-02-18 | 2000-02-18 | |
US60/183,562 | 2000-02-18 | ||
US52703400A | 2000-03-16 | 2000-03-16 | |
US09/527,034 | 2000-03-16 | ||
US54837900A | 2000-04-12 | 2000-04-12 | |
US09/548,379 | 2000-04-12 | ||
US56891600A | 2000-05-11 | 2000-05-11 | |
US09/568,916 | 2000-05-11 | ||
US62052300A | 2000-07-20 | 2000-07-20 | |
US09/620,523 | 2000-07-20 | ||
PCT/US2000/020523 WO2001012702A1 (fr) | 1999-07-30 | 2000-07-28 | Brins de fibres de verre impregnes et produits comprenant ces derniers |
Publications (1)
Publication Number | Publication Date |
---|---|
CA2381171A1 true CA2381171A1 (fr) | 2001-02-22 |
Family
ID=27574950
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CA002382188A Abandoned CA2382188A1 (fr) | 1999-07-30 | 2000-07-28 | Filaments de fibre de verre impregnes et produits les comprenant |
CA002381171A Abandoned CA2381171A1 (fr) | 1999-07-30 | 2000-07-28 | Brins de fibres de verre impregnes et produits comprenant ces derniers |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CA002382188A Abandoned CA2382188A1 (fr) | 1999-07-30 | 2000-07-28 | Filaments de fibre de verre impregnes et produits les comprenant |
Country Status (10)
Country | Link |
---|---|
EP (2) | EP1204697A1 (fr) |
JP (2) | JP2004513976A (fr) |
KR (2) | KR20020026956A (fr) |
CN (2) | CN1402753A (fr) |
AU (2) | AU6383100A (fr) |
BR (3) | BR0012872A (fr) |
CA (2) | CA2382188A1 (fr) |
HK (1) | HK1046701A1 (fr) |
MX (3) | MXPA01003660A (fr) |
WO (2) | WO2001012702A1 (fr) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5181221B2 (ja) * | 2008-01-15 | 2013-04-10 | 日立化成株式会社 | 低熱膨張性低誘電損失プリプレグ及びその応用品 |
KR100879284B1 (ko) * | 2008-02-12 | 2009-01-16 | (주)상아프론테크 | 인쇄회로기판 천공용 윤활시트 및 상기 윤활시트 형성용조성물 |
US8133929B2 (en) * | 2008-04-15 | 2012-03-13 | Sika Technology Ag | Method for incorporating long glass fibers into epoxy-based reinforcing resins |
US20110014467A1 (en) * | 2009-07-16 | 2011-01-20 | Brown Nancy E | Extrusion coated non-twisted yarn |
CN101880964A (zh) * | 2010-06-04 | 2010-11-10 | 上海宏和电子材料有限公司 | 一种环保绿色电子级玻璃纤维布二次浆料 |
CN102352089B (zh) * | 2011-07-01 | 2013-03-20 | 中航复合材料有限责任公司 | 一种植物纤维增强生物质树脂薄层材料及其制备方法 |
US20190022896A1 (en) | 2017-07-24 | 2019-01-24 | Aerlyte, Inc. | Fiber-reinforced molding compounds and methods of forming and using the same |
DE102017126447A1 (de) * | 2017-11-10 | 2019-05-16 | CHT Germany GmbH | Beschichtung von Faserprodukten mit wässrigen Polymerdispersionen |
CN113480199B (zh) * | 2021-08-02 | 2022-11-01 | 四川文理学院 | 一种增强型玄武岩纤维浸润剂及其制备方法 |
CN115806395B (zh) * | 2022-12-16 | 2024-05-14 | 常州爱特恩新材料科技有限公司 | 一种玻璃纤维的表面改性系统 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3312569A (en) * | 1965-05-07 | 1967-04-04 | Owens Corning Fiberglass Corp | Compatible fibrous glass reinforcements of superior bonding and wetting characteristics |
US5217778A (en) * | 1982-10-21 | 1993-06-08 | Raymark Industries, Inc. | Composite fiber friction facing |
DE3826522A1 (de) * | 1988-08-04 | 1990-02-08 | Teldix Gmbh | Leiterplatte |
JP2545957B2 (ja) * | 1988-12-15 | 1996-10-23 | 日東紡績株式会社 | プリント配線基板及び同基板用織物 |
JPH0818853B2 (ja) * | 1989-11-15 | 1996-02-28 | 日東紡績株式会社 | ガラスクロスの製造方法 |
JP3520604B2 (ja) * | 1995-05-23 | 2004-04-19 | 日立化成工業株式会社 | コンポジット積層板 |
US5773146A (en) * | 1995-06-05 | 1998-06-30 | Ppg Industries, Inc. | Forming size compositions, glass fibers coated with the same and fabrics woven from such coated fibers |
JPH0977937A (ja) * | 1995-09-12 | 1997-03-25 | Idemitsu Petrochem Co Ltd | プリント配線板用プリプレグ及びプリント配線用基板 |
JP3151397B2 (ja) * | 1995-10-26 | 2001-04-03 | 松下電工株式会社 | プリプレグ及び金属箔張り積層板 |
KR100397899B1 (ko) * | 1998-03-03 | 2003-09-13 | 피피지 인더스트리즈 오하이오 인코포레이티드 | 무기 입자 피복된 유리 섬유 스트랜드 및 이를 포함하는제품 |
CN1291963A (zh) * | 1998-03-03 | 2001-04-18 | Ppg工业俄亥俄公司 | 玻璃纤维补强的层压件、电路板以及装配织物的方法 |
AU2787499A (en) * | 1998-03-03 | 1999-09-20 | Ppg Industries Ohio, Inc. | Methods for inhibiting abrasive wear of glass fiber strands |
JP2002527333A (ja) * | 1998-10-13 | 2002-08-27 | ピーピージー インダストリーズ オハイオ, インコーポレイテッド | 含浸ガラス繊維ストランドおよびこれを含む製品 |
EP1124770A1 (fr) * | 1998-10-13 | 2001-08-22 | PPG Industries Ohio, Inc. | Plaquettes de circuits electroniques, stratifies et feuilles preimpregnees renforces par fibres de verre, et procede d'assemblage d'un tissu |
-
1999
- 1999-10-08 MX MXPA01003660 patent/MXPA01003660A/es not_active Application Discontinuation
-
2000
- 2000-07-28 MX MXPA02001092A patent/MXPA02001092A/es unknown
- 2000-07-28 BR BR0012872-4A patent/BR0012872A/pt not_active IP Right Cessation
- 2000-07-28 BR BR0012885-6A patent/BR0012885A/pt not_active IP Right Cessation
- 2000-07-28 JP JP2001517592A patent/JP2004513976A/ja not_active Withdrawn
- 2000-07-28 CA CA002382188A patent/CA2382188A1/fr not_active Abandoned
- 2000-07-28 WO PCT/US2000/020523 patent/WO2001012702A1/fr active Search and Examination
- 2000-07-28 KR KR1020027001324A patent/KR20020026956A/ko not_active Application Discontinuation
- 2000-07-28 CN CN00813542A patent/CN1402753A/zh active Pending
- 2000-07-28 EP EP00950805A patent/EP1204697A1/fr not_active Withdrawn
- 2000-07-28 MX MXPA02001100A patent/MXPA02001100A/es unknown
- 2000-07-28 EP EP00950780A patent/EP1204696A1/fr not_active Withdrawn
- 2000-07-28 AU AU63831/00A patent/AU6383100A/en not_active Abandoned
- 2000-07-28 CA CA002381171A patent/CA2381171A1/fr not_active Abandoned
- 2000-07-28 WO PCT/US2000/020457 patent/WO2001012701A1/fr not_active Application Discontinuation
- 2000-07-28 AU AU63851/00A patent/AU6385100A/en not_active Abandoned
- 2000-07-28 BR BR0012887-2A patent/BR0012887A/pt not_active IP Right Cessation
- 2000-07-28 CN CNB008136874A patent/CN100387642C/zh not_active Expired - Fee Related
- 2000-07-28 JP JP2001517593A patent/JP2004513858A/ja not_active Withdrawn
- 2000-07-28 KR KR1020027001327A patent/KR20020026958A/ko not_active Application Discontinuation
-
2002
- 2002-11-13 HK HK02108230.1A patent/HK1046701A1/zh unknown
Also Published As
Publication number | Publication date |
---|---|
JP2004513976A (ja) | 2004-05-13 |
WO2001012701A1 (fr) | 2001-02-22 |
MXPA02001092A (es) | 2003-07-21 |
CN1420905A (zh) | 2003-05-28 |
BR0012872A (pt) | 2002-07-23 |
EP1204697A1 (fr) | 2002-05-15 |
WO2001012702A1 (fr) | 2001-02-22 |
MXPA01003660A (es) | 2001-07-01 |
HK1046701A1 (zh) | 2003-01-24 |
KR20020026958A (ko) | 2002-04-12 |
CN100387642C (zh) | 2008-05-14 |
CA2382188A1 (fr) | 2001-02-22 |
MXPA02001100A (es) | 2003-07-21 |
JP2004513858A (ja) | 2004-05-13 |
EP1204696A1 (fr) | 2002-05-15 |
CN1402753A (zh) | 2003-03-12 |
BR0012885A (pt) | 2002-07-16 |
BR0012887A (pt) | 2002-07-23 |
AU6383100A (en) | 2001-03-13 |
KR20020026956A (ko) | 2002-04-12 |
AU6385100A (en) | 2001-03-13 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
FZDE | Discontinued | ||
FZDE | Discontinued |
Effective date: 20050728 |