BE704674A - - Google Patents

Info

Publication number
BE704674A
BE704674A BE704674DA BE704674A BE 704674 A BE704674 A BE 704674A BE 704674D A BE704674D A BE 704674DA BE 704674 A BE704674 A BE 704674A
Authority
BE
Belgium
Application number
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of BE704674A publication Critical patent/BE704674A/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components
    • H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
    • H01L21/76202—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using a local oxidation of silicon, e.g. LOCOS, SWAMI, SILO
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/32—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers using masks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components
    • H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
    • H01L21/76202—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using a local oxidation of silicon, e.g. LOCOS, SWAMI, SILO
    • H01L21/76205—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using a local oxidation of silicon, e.g. LOCOS, SWAMI, SILO in a region being recessed from the surface, e.g. in a recess, groove, tub or trench region
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components
    • H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
    • H01L21/76202—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using a local oxidation of silicon, e.g. LOCOS, SWAMI, SILO
    • H01L21/76213—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using a local oxidation of silicon, e.g. LOCOS, SWAMI, SILO introducing electrical inactive or active impurities in the local oxidation region, e.g. to alter LOCOS oxide growth characteristics or for additional isolation purpose
    • H01L21/76216—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using a local oxidation of silicon, e.g. LOCOS, SWAMI, SILO introducing electrical inactive or active impurities in the local oxidation region, e.g. to alter LOCOS oxide growth characteristics or for additional isolation purpose introducing electrical active impurities in the local oxidation region for the sole purpose of creating channel stoppers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
    • H01L27/06—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration
    • H01L27/0611—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration integrated circuits having a two-dimensional layout of components without a common active region
    • H01L27/0617—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration integrated circuits having a two-dimensional layout of components without a common active region comprising components of the field-effect type
    • H01L27/0635—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration integrated circuits having a two-dimensional layout of components without a common active region comprising components of the field-effect type in combination with bipolar transistors and diodes, or resistors, or capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Local Oxidation Of Silicon (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Element Separation (AREA)
  • Bipolar Transistors (AREA)
  • Formation Of Insulating Films (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Junction Field-Effect Transistors (AREA)
  • Weting (AREA)
  • Level Indicators Using A Float (AREA)
BE704674D 1966-10-05 1967-10-04 BE704674A (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL666614016A NL153374B (nl) 1966-10-05 1966-10-05 Werkwijze ter vervaardiging van een halfgeleiderinrichting voorzien van een oxydelaag en halfgeleiderinrichting vervaardigd volgens de werkwijze.

Publications (1)

Publication Number Publication Date
BE704674A true BE704674A (es) 1968-04-04

Family

ID=19797850

Family Applications (1)

Application Number Title Priority Date Filing Date
BE704674D BE704674A (es) 1966-10-05 1967-10-04

Country Status (13)

Country Link
US (1) US3970486A (es)
JP (8) JPS5631893B1 (es)
AT (1) AT280349B (es)
BE (1) BE704674A (es)
CH (1) CH469358A (es)
DE (1) DE1614283C3 (es)
DK (1) DK121913B (es)
ES (1) ES345702A1 (es)
FR (1) FR1549386A (es)
GB (1) GB1208574A (es)
NL (1) NL153374B (es)
NO (1) NO125653B (es)
SE (1) SE335177B (es)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1952636A1 (de) * 1969-10-18 1971-04-29 Licentia Gmbh Halbleiteranordnung
DE2105178A1 (de) * 1966-10-05 1971-09-02 Philips Nv Verfahren zur Herstellung einer Halbleiteranordnung
DE2133980A1 (de) * 1966-10-05 1972-01-13 Philips Nv Verfahren zur Herstellung einer Halbleiteranordnung und durch dieses Verfahren hergestellte Halbleiteran Ordnung
USRE28653E (en) * 1968-04-23 1975-12-16 Method of fabricating semiconductor devices
USRE31580E (en) * 1967-06-08 1984-05-01 U.S. Philips Corporation Insulated gate field-effect transistor comprising a mesa channel and a thicker surrounding oxide
US6093620A (en) * 1971-02-02 2000-07-25 National Semiconductor Corporation Method of fabricating integrated circuits with oxidized isolation

Families Citing this family (47)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6979877B1 (en) 1965-09-28 2005-12-27 Li Chou H Solid-state device
US5696402A (en) * 1965-09-28 1997-12-09 Li; Chou H. Integrated circuit device
US6849918B1 (en) * 1965-09-28 2005-02-01 Chou H. Li Miniaturized dielectrically isolated solid state device
US7038290B1 (en) 1965-09-28 2006-05-02 Li Chou H Integrated circuit device
BE753245A (fr) * 1969-08-04 1970-12-16 Rca Corp Procede pour la fabrication de dispositifs semiconducteurs
FR2058385A1 (en) * 1969-08-20 1971-05-28 Ibm Diode with schottky barrier
GB1332931A (en) * 1970-01-15 1973-10-10 Mullard Ltd Methods of manufacturing a semiconductor device
US3698966A (en) * 1970-02-26 1972-10-17 North American Rockwell Processes using a masking layer for producing field effect devices having oxide isolation
GB1360996A (en) * 1970-06-15 1974-07-24 Hitachi Ltd Semiconductor device and method for manufacture
NL170902C (nl) * 1970-07-10 1983-01-03 Philips Nv Halfgeleiderinrichting, in het bijzonder monolithische geintegreerde halfgeleiderschakeling.
FR2098325B1 (es) * 1970-07-10 1977-04-22 Philips Nv
JPS514756B1 (es) * 1970-10-05 1976-02-14
JPS498183A (es) * 1972-05-10 1974-01-24
FR2188304B1 (es) * 1972-06-15 1977-07-22 Commissariat Energie Atomique
DE2318912A1 (de) * 1972-06-30 1974-01-17 Ibm Integrierte halbleiteranordnung
JPS4960684A (es) * 1972-10-12 1974-06-12
JPS5617734B2 (es) * 1973-07-19 1981-04-24
JPS5159853U (es) * 1974-11-06 1976-05-11
JPS5938741B2 (ja) * 1976-07-31 1984-09-19 ティーディーケイ株式会社 半導体装置およびその作製方法
EP0002107A3 (en) * 1977-11-17 1979-09-05 Rca Corporation Method of making a planar semiconductor device
GB2042801B (en) * 1979-02-13 1983-12-14 Standard Telephones Cables Ltd Contacting semicnductor devices
US4441941A (en) * 1980-03-06 1984-04-10 Tokyo Shibaura Denki Kabushiki Kaisha Method for manufacturing a semiconductor device employing element isolation using insulating materials
US4274909A (en) * 1980-03-17 1981-06-23 International Business Machines Corporation Method for forming ultra fine deep dielectric isolation
US4317690A (en) * 1980-06-18 1982-03-02 Signetics Corporation Self-aligned double polysilicon MOS fabrication
US4506435A (en) * 1981-07-27 1985-03-26 International Business Machines Corporation Method for forming recessed isolated regions
US4454646A (en) * 1981-08-27 1984-06-19 International Business Machines Corporation Isolation for high density integrated circuits
US4454647A (en) * 1981-08-27 1984-06-19 International Business Machines Corporation Isolation for high density integrated circuits
JPS5873163A (ja) * 1981-10-27 1983-05-02 Toshiba Corp Ｍｏｓ型半導体装置
US4508757A (en) * 1982-12-20 1985-04-02 International Business Machines Corporation Method of manufacturing a minimum bird's beak recessed oxide isolation structure
GB2151844A (en) * 1983-12-20 1985-07-24 Philips Electronic Associated Semiconductor devices
JPS60115416U (ja) * 1984-01-12 1985-08-05 三菱電機株式会社 フラツトキ−型操作ボ−ド
JPS6133323U (ja) * 1984-07-31 1986-02-28 武夫 大坪 キ−ボ−ド表示板
JPS61126696U (es) * 1985-01-28 1986-08-08
US4630356A (en) * 1985-09-19 1986-12-23 International Business Machines Corporation Method of forming recessed oxide isolation with reduced steepness of the birds' neck
US5019526A (en) * 1988-09-26 1991-05-28 Nippondenso Co., Ltd. Method of manufacturing a semiconductor device having a plurality of elements
US5077235A (en) * 1989-01-24 1991-12-31 Ricoh Comany, Ltd. Method of manufacturing a semiconductor integrated circuit device having SOI structure
US4968641A (en) * 1989-06-22 1990-11-06 Alexander Kalnitsky Method for formation of an isolating oxide layer
US4987099A (en) * 1989-12-29 1991-01-22 North American Philips Corp. Method for selectively filling contacts or vias or various depths with CVD tungsten
JP3111500B2 (ja) * 1991-05-09 2000-11-20 富士電機株式会社 誘電体分離ウエハの製造方法
JPH05283710A (ja) * 1991-12-06 1993-10-29 Intel Corp 高電圧ｍｏｓトランジスタ及びその製造方法
US5418176A (en) * 1994-02-17 1995-05-23 United Microelectronics Corporation Process for producing memory devices having narrow buried N+ lines
US5661053A (en) * 1994-05-25 1997-08-26 Sandisk Corporation Method of making dense flash EEPROM cell array and peripheral supporting circuits formed in deposited field oxide with the use of spacers
US5756385A (en) * 1994-03-30 1998-05-26 Sandisk Corporation Dense flash EEPROM cell array and peripheral supporting circuits formed in deposited field oxide with the use of spacers
US5814875A (en) * 1995-01-31 1998-09-29 Nippon Steel Corporation Semiconductor device and method of manufacturing the same apparatus and method for providing semiconductor devices having a field shield element between devices
US20040144999A1 (en) * 1995-06-07 2004-07-29 Li Chou H. Integrated circuit device
US5747357A (en) 1995-09-27 1998-05-05 Mosel Vitelic, Inc. Modified poly-buffered isolation
US5883566A (en) * 1997-02-24 1999-03-16 International Business Machines Corporation Noise-isolated buried resistor

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2981877A (en) * 1959-07-30 1961-04-25 Fairchild Semiconductor Semiconductor device-and-lead structure
US3212162A (en) * 1962-01-05 1965-10-19 Fairchild Camera Instr Co Fabricating semiconductor devices
US3165430A (en) * 1963-01-21 1965-01-12 Siliconix Inc Method of ultra-fine semiconductor manufacture
US3279963A (en) * 1963-07-23 1966-10-18 Ibm Fabrication of semiconductor devices
DE1439737B2 (de) * 1964-10-31 1970-05-06 Telefunken Patentverwertungsgesellschaft Mbh, 7900 Ulm Verfahren zum Herstellen einer Halblei teranordnung
US3484313A (en) * 1965-03-25 1969-12-16 Hitachi Ltd Method of manufacturing semiconductor devices
US3442011A (en) * 1965-06-30 1969-05-06 Texas Instruments Inc Method for isolating individual devices in an integrated circuit monolithic bar
US3479237A (en) * 1966-04-08 1969-11-18 Bell Telephone Labor Inc Etch masks on semiconductor surfaces
US3649386A (en) * 1968-04-23 1972-03-14 Bell Telephone Labor Inc Method of fabricating semiconductor devices
US3550292A (en) * 1968-08-23 1970-12-29 Nippon Electric Co Semiconductor device and method of manufacturing the same
JPS4917069A (es) * 1972-06-10 1974-02-15
JPS5232803B2 (es) * 1972-08-15 1977-08-24

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2105178A1 (de) * 1966-10-05 1971-09-02 Philips Nv Verfahren zur Herstellung einer Halbleiteranordnung
DE2133980A1 (de) * 1966-10-05 1972-01-13 Philips Nv Verfahren zur Herstellung einer Halbleiteranordnung und durch dieses Verfahren hergestellte Halbleiteran Ordnung
USRE31580E (en) * 1967-06-08 1984-05-01 U.S. Philips Corporation Insulated gate field-effect transistor comprising a mesa channel and a thicker surrounding oxide
USRE28653E (en) * 1968-04-23 1975-12-16 Method of fabricating semiconductor devices
DE1952636A1 (de) * 1969-10-18 1971-04-29 Licentia Gmbh Halbleiteranordnung
US6093620A (en) * 1971-02-02 2000-07-25 National Semiconductor Corporation Method of fabricating integrated circuits with oxidized isolation

Also Published As

Publication number Publication date
JPS5631893B1 (es) 1981-07-24
DE1614283C3 (de) 1983-03-10
US3970486A (en) 1976-07-20
CH469358A (de) 1969-02-28
JPS5134274B1 (es) 1976-09-25
JPS5435071B1 (es) 1979-10-31
JPS5838937B1 (es) 1983-08-26
JPS5434596B1 (es) 1979-10-27
NL153374B (nl) 1977-05-16
AT280349B (de) 1970-04-10
ES345702A1 (es) 1969-02-01
JPS4923071B1 (es) 1974-06-13
NL6614016A (es) 1968-04-08
SE335177B (es) 1971-05-17
JPS4939308B1 (es) 1974-10-24
DK121913B (da) 1971-12-20
FR1549386A (es) 1968-12-13
DE1614283B2 (de) 1975-06-05
DE1614283A1 (de) 1970-05-27
JPS4939309B1 (es) 1974-10-24
GB1208574A (en) 1970-10-14
NO125653B (es) 1972-10-09

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Legal Events

Date Code Title Description
RE20 Patent expired

Owner name: N.V. PHILIPS GLOEILAMPENFABRIEKEN

Effective date: 19871004