BE547698A - - Google Patents
Info
- Publication number
- BE547698A BE547698A BE547698DA BE547698A BE 547698 A BE547698 A BE 547698A BE 547698D A BE547698D A BE 547698DA BE 547698 A BE547698 A BE 547698A
- Authority
- BE
- Belgium
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/12—Semiconductors
- C25D7/123—Semiconductors first coated with a seed layer or a conductive layer
-
- H10W99/00—
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
- B23K35/3006—Ag as the principal constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C5/00—Alloys based on noble metals
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D99/00—Subject matter not provided for in other groups of this subclass
-
- H10P95/00—
-
- H10W40/22—
-
- H10W70/24—
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Electrochemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrodes Of Semiconductors (AREA)
- Ceramic Products (AREA)
- Die Bonding (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Contacts (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US507312A US2763822A (en) | 1955-05-10 | 1955-05-10 | Silicon semiconductor devices |
| US525595A US2801375A (en) | 1955-08-01 | 1955-08-01 | Silicon semiconductor devices and processes for making them |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| BE547698A true BE547698A (online.php) | 1900-01-01 |
Family
ID=27055794
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| BE547698D BE547698A (online.php) | 1955-05-10 | ||
| BE550001A BE550001A (fr) | 1955-05-10 | 1956-08-01 | Semiconducteurs au silicium et procedes pour leur fabrication |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| BE550001A BE550001A (fr) | 1955-05-10 | 1956-08-01 | Semiconducteurs au silicium et procedes pour leur fabrication |
Country Status (6)
| Country | Link |
|---|---|
| BE (2) | BE550001A (online.php) |
| CH (2) | CH350720A (online.php) |
| DE (2) | DE1050450B (online.php) |
| FR (2) | FR1153475A (online.php) |
| GB (2) | GB832067A (online.php) |
| NL (2) | NL208617A (online.php) |
Families Citing this family (27)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1285068B (de) * | 1957-01-11 | 1968-12-12 | Siemens Ag | Legierungskontakt auf mit einer Goldschicht versehenen Halbleiterkristallen |
| NL243222A (online.php) * | 1958-09-10 | 1900-01-01 | ||
| NL242265A (online.php) * | 1958-09-30 | 1900-01-01 | ||
| NL102017C (online.php) * | 1959-05-12 | |||
| DE1233949B (de) * | 1959-07-13 | 1967-02-09 | Siemens Ag | Verfahren zur Herstellung einer Halbleiter-gleichrichteranordnung mit einem einkristallinen Halbleiterkoerper |
| NL249694A (online.php) * | 1959-12-30 | |||
| DE1113519B (de) * | 1960-02-25 | 1961-09-07 | Bosch Gmbh Robert | Siliziumgleichrichter fuer hohe Stromstaerken |
| NL260951A (online.php) * | 1960-03-07 | |||
| DE1153461B (de) * | 1960-06-23 | 1963-08-29 | Siemens Ag | Halbleiteranordnung |
| DE1141029B (de) * | 1960-06-23 | 1962-12-13 | Siemens Ag | Halbleiteranordnung und Verfahren zu ihrer Herstellung |
| NL269346A (online.php) * | 1960-09-20 | |||
| DE1133834B (de) * | 1960-09-21 | 1962-07-26 | Siemens Ag | Siliziumgleichrichter und Verfahren zu dessen Herstellung |
| NL270339A (online.php) * | 1960-10-20 | |||
| DE1240187B (de) * | 1961-08-10 | 1967-05-11 | Siemens Ag | Verfahren zur Herstellung eines sperrfreien Kontaktes durch Auflegieren von Aluminium |
| DE1229649B (de) * | 1961-08-10 | 1966-12-01 | Siemens Ag | Verfahren zum Herstellen eines Halbleiter-elementes und Halbleiteranordnung mit einem nach diesem Verfahren hergestellten Halbleiterelement |
| DE1246129B (de) * | 1961-12-28 | 1967-08-03 | Westinghouse Electric Corp | Verfahren zum Herstellen eines Halbleiterbauelementes |
| DE1185731B (de) * | 1962-03-28 | 1965-01-21 | Siemens Ag | Halbleiterelement mit pn-UEbergang |
| DE1295697B (de) * | 1962-05-23 | 1969-05-22 | Walter Brandt Gmbh | Halbleiterbauelement und Verfahren zu seiner Herstellung |
| US3368120A (en) * | 1965-03-22 | 1968-02-06 | Gen Electric | Multilayer contact system for semiconductor devices |
| DE1483298B1 (de) * | 1965-06-11 | 1971-01-28 | Siemens Ag | Elektrische Kontaktanordnung zwischen einem Germanium-Silizium-Halbleiterkoerper und einem Kontaktstueck und Verfahren zur Herstellung derselben |
| FR2046593A5 (online.php) * | 1970-04-30 | 1971-03-05 | Silec Semi Conducteurs | |
| GB2031223A (en) * | 1978-09-22 | 1980-04-16 | Gen Instrument Corp | Method for bonding a refractory metal contact member to a semiconductor body |
| SE9203533L (sv) * | 1992-11-24 | 1994-05-24 | Asea Brown Boveri | Anordning för kylning av skivformiga kraftelektronikelement jämte skivformigt kraftelektronikelement avsett att monteras i sådan kylanordning |
| JP6079375B2 (ja) * | 2013-03-29 | 2017-02-15 | 三菱マテリアル株式会社 | ハンダ粉末及びその製造方法並びにこの粉末を用いたハンダ用ペースト |
| DE102015108056A1 (de) * | 2015-05-21 | 2016-11-24 | Osram Opto Semiconductors Gmbh | Optoelektronisches Halbleiterbauteil, optoelektronische Anordnung und Verfahren zur Herstellung eines optoelektronischen Halbleiterbauteils |
| CN112186044B (zh) * | 2020-09-30 | 2024-11-19 | 中国振华集团永光电子有限公司（国营第八七三厂） | 一种玻璃钝化实体封装低压二极管及其制造方法 |
| CN116275342A (zh) * | 2023-03-20 | 2023-06-23 | 山东天工岩土工程设备有限公司 | 一种真空感应钎焊装置及方法 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2220961A (en) * | 1937-11-06 | 1940-11-12 | Bell Telephone Labor Inc | Soldering alloy |
| US2555001A (en) * | 1947-02-04 | 1951-05-29 | Bell Telephone Labor Inc | Bonded article and method of bonding |
| US2567970A (en) * | 1947-12-24 | 1951-09-18 | Bell Telephone Labor Inc | Semiconductor comprising silicon and method of making it |
| DE872602C (de) * | 1951-03-20 | 1953-04-02 | Siemens Ag | Verfahren zur Befestigung von Halbleitern |
| BE522837A (online.php) * | 1952-09-16 | |||
| NL104654C (online.php) * | 1952-12-31 | 1900-01-01 | ||
| GB8817261D0 (en) * | 1988-07-20 | 1988-08-24 | Sperry Sun Inc | Down-hole bearing assemblies for maintaining survey instrument assembly & core barrel orientation |
-
0
- NL NL109558D patent/NL109558C/xx active
- BE BE547698D patent/BE547698A/xx unknown
- NL NL208617D patent/NL208617A/xx unknown
-
1956
- 1956-04-30 DE DEW18965A patent/DE1050450B/de active Pending
- 1956-05-04 GB GB13826/56A patent/GB832067A/en not_active Expired
- 1956-05-09 FR FR1153475D patent/FR1153475A/fr not_active Expired
- 1956-05-09 CH CH350720D patent/CH350720A/de unknown
- 1956-07-11 DE DEW19399A patent/DE1292260B/de active Pending
- 1956-07-27 GB GB23230/56A patent/GB823559A/en not_active Expired
- 1956-07-30 FR FR1157057D patent/FR1157057A/fr not_active Expired
- 1956-07-31 CH CH3604156A patent/CH367896A/de unknown
- 1956-08-01 BE BE550001A patent/BE550001A/fr unknown
Also Published As
| Publication number | Publication date |
|---|---|
| FR1157057A (fr) | 1958-05-27 |
| NL208617A (online.php) | 1900-01-01 |
| BE550001A (fr) | 1956-08-31 |
| NL109558C (online.php) | 1900-01-01 |
| DE1050450B (de) | 1959-02-12 |
| FR1153475A (fr) | 1958-03-11 |
| GB832067A (en) | 1960-04-06 |
| CH350720A (de) | 1960-12-15 |
| DE1292260B (de) | 1969-04-10 |
| CH367896A (de) | 1963-03-15 |
| GB823559A (en) | 1959-11-11 |