AU780174B2 - An energy enhanced process for treating a conductive surface and products formed thereby - Google Patents
An energy enhanced process for treating a conductive surface and products formed thereby Download PDFInfo
- Publication number
- AU780174B2 AU780174B2 AU52948/01A AU5294801A AU780174B2 AU 780174 B2 AU780174 B2 AU 780174B2 AU 52948/01 A AU52948/01 A AU 52948/01A AU 5294801 A AU5294801 A AU 5294801A AU 780174 B2 AU780174 B2 AU 780174B2
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- Prior art keywords
- silicate
- medium
- substrate
- solution
- coating
- Prior art date
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- 238000000034 method Methods 0.000 title claims description 233
- 230000008569 process Effects 0.000 title description 157
- 230000007797 corrosion Effects 0.000 claims description 136
- 238000005260 corrosion Methods 0.000 claims description 136
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 116
- 238000000576 coating method Methods 0.000 claims description 114
- 229910052751 metal Inorganic materials 0.000 claims description 95
- 239000002184 metal Substances 0.000 claims description 95
- 239000000758 substrate Substances 0.000 claims description 88
- 239000011701 zinc Substances 0.000 claims description 87
- 239000011248 coating agent Substances 0.000 claims description 84
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 claims description 83
- 238000011282 treatment Methods 0.000 claims description 77
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 73
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- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 66
- 239000000377 silicon dioxide Substances 0.000 claims description 55
- 229910001868 water Inorganic materials 0.000 claims description 44
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 38
- 239000004593 Epoxy Substances 0.000 claims description 32
- 239000004115 Sodium Silicate Substances 0.000 claims description 31
- ZCDOYSPFYFSLEW-UHFFFAOYSA-N chromate(2-) Chemical compound [O-][Cr]([O-])(=O)=O ZCDOYSPFYFSLEW-UHFFFAOYSA-N 0.000 claims description 31
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 claims description 30
- 229910052911 sodium silicate Inorganic materials 0.000 claims description 30
- 238000004140 cleaning Methods 0.000 claims description 25
- -1 ammonium fluorosilicate Chemical compound 0.000 claims description 24
- 229910052697 platinum Inorganic materials 0.000 claims description 16
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 14
- 150000004756 silanes Chemical class 0.000 claims description 14
- CSNNHWWHGAXBCP-UHFFFAOYSA-L Magnesium sulfate Chemical compound [Mg+2].[O-][S+2]([O-])([O-])[O-] CSNNHWWHGAXBCP-UHFFFAOYSA-L 0.000 claims description 12
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 claims description 12
- 150000001875 compounds Chemical class 0.000 claims description 12
- PMZURENOXWZQFD-UHFFFAOYSA-L Sodium Sulfate Chemical compound [Na+].[Na+].[O-]S([O-])(=O)=O PMZURENOXWZQFD-UHFFFAOYSA-L 0.000 claims description 9
- 125000003700 epoxy group Chemical group 0.000 claims description 9
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- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 claims description 6
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- 235000019341 magnesium sulphate Nutrition 0.000 claims description 6
- 229920003229 poly(methyl methacrylate) Polymers 0.000 claims description 6
- BNGXYYYYKUGPPF-UHFFFAOYSA-M (3-methylphenyl)methyl-triphenylphosphanium;chloride Chemical compound [Cl-].CC1=CC=CC(C[P+](C=2C=CC=CC=2)(C=2C=CC=CC=2)C=2C=CC=CC=2)=C1 BNGXYYYYKUGPPF-UHFFFAOYSA-M 0.000 claims description 5
- DUFCMRCMPHIFTR-UHFFFAOYSA-N 5-(dimethylsulfamoyl)-2-methylfuran-3-carboxylic acid Chemical compound CN(C)S(=O)(=O)C1=CC(C(O)=O)=C(C)O1 DUFCMRCMPHIFTR-UHFFFAOYSA-N 0.000 claims description 5
- WUKWITHWXAAZEY-UHFFFAOYSA-L calcium difluoride Chemical compound [F-].[F-].[Ca+2] WUKWITHWXAAZEY-UHFFFAOYSA-L 0.000 claims description 5
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- ISXSCDLOGDJUNJ-UHFFFAOYSA-N tert-butyl prop-2-enoate Chemical compound CC(C)(C)OC(=O)C=C ISXSCDLOGDJUNJ-UHFFFAOYSA-N 0.000 claims description 5
- HPGGPRDJHPYFRM-UHFFFAOYSA-J tin(iv) chloride Chemical compound Cl[Sn](Cl)(Cl)Cl HPGGPRDJHPYFRM-UHFFFAOYSA-J 0.000 claims description 5
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- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 claims description 4
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- XJDNKRIXUMDJCW-UHFFFAOYSA-J titanium tetrachloride Chemical compound Cl[Ti](Cl)(Cl)Cl XJDNKRIXUMDJCW-UHFFFAOYSA-J 0.000 claims description 4
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- XIXADJRWDQXREU-UHFFFAOYSA-M lithium acetate Chemical compound [Li+].CC([O-])=O XIXADJRWDQXREU-UHFFFAOYSA-M 0.000 claims description 3
- 229940071264 lithium citrate Drugs 0.000 claims description 3
- WJSIUCDMWSDDCE-UHFFFAOYSA-K lithium citrate (anhydrous) Chemical compound [Li+].[Li+].[Li+].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O WJSIUCDMWSDDCE-UHFFFAOYSA-K 0.000 claims description 3
- HZRMTWQRDMYLNW-UHFFFAOYSA-N lithium metaborate Chemical compound [Li+].[O-]B=O HZRMTWQRDMYLNW-UHFFFAOYSA-N 0.000 claims description 3
- PBYZMCDFOULPGH-UHFFFAOYSA-N tungstate Chemical compound [O-][W]([O-])(=O)=O PBYZMCDFOULPGH-UHFFFAOYSA-N 0.000 claims description 3
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- JLDSOYXADOWAKB-UHFFFAOYSA-N aluminium nitrate Chemical compound [Al+3].[O-][N+]([O-])=O.[O-][N+]([O-])=O.[O-][N+]([O-])=O JLDSOYXADOWAKB-UHFFFAOYSA-N 0.000 claims 2
- KRKNYBCHXYNGOX-UHFFFAOYSA-K Citrate Chemical compound [O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O KRKNYBCHXYNGOX-UHFFFAOYSA-K 0.000 claims 1
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- 239000004922 lacquer Substances 0.000 description 1
- 239000004310 lactic acid Chemical class 0.000 description 1
- 235000014655 lactic acid Nutrition 0.000 description 1
- RVPVRDXYQKGNMQ-UHFFFAOYSA-N lead(2+) Chemical compound [Pb+2] RVPVRDXYQKGNMQ-UHFFFAOYSA-N 0.000 description 1
- 150000007517 lewis acids Chemical class 0.000 description 1
- 230000000670 limiting effect Effects 0.000 description 1
- 235000021388 linseed oil Nutrition 0.000 description 1
- 239000000944 linseed oil Substances 0.000 description 1
- XGZVUEUWXADBQD-UHFFFAOYSA-L lithium carbonate Chemical compound [Li+].[Li+].[O-]C([O-])=O XGZVUEUWXADBQD-UHFFFAOYSA-L 0.000 description 1
- 229910052808 lithium carbonate Inorganic materials 0.000 description 1
- 150000002642 lithium compounds Chemical class 0.000 description 1
- PAZHGORSDKKUPI-UHFFFAOYSA-N lithium metasilicate Chemical compound [Li+].[Li+].[O-][Si]([O-])=O PAZHGORSDKKUPI-UHFFFAOYSA-N 0.000 description 1
- 229910052912 lithium silicate Inorganic materials 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 239000001630 malic acid Chemical class 0.000 description 1
- 235000011090 malic acid Nutrition 0.000 description 1
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 108010033145 microsomal ethanol-oxidizing system Proteins 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000003607 modifier Substances 0.000 description 1
- 238000013008 moisture curing Methods 0.000 description 1
- 239000006060 molten glass Substances 0.000 description 1
- MEFBJEMVZONFCJ-UHFFFAOYSA-N molybdate Chemical compound [O-][Mo]([O-])(=O)=O MEFBJEMVZONFCJ-UHFFFAOYSA-N 0.000 description 1
- VLAPMBHFAWRUQP-UHFFFAOYSA-L molybdic acid Chemical group O[Mo](O)(=O)=O VLAPMBHFAWRUQP-UHFFFAOYSA-L 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 239000004238 monoammonium glutamate Substances 0.000 description 1
- QELJHCBNGDEXLD-UHFFFAOYSA-N nickel zinc Chemical compound [Ni].[Zn] QELJHCBNGDEXLD-UHFFFAOYSA-N 0.000 description 1
- 150000002823 nitrates Chemical class 0.000 description 1
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 1
- 239000000615 nonconductor Substances 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 125000000962 organic group Chemical group 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 239000007800 oxidant agent Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000013034 phenoxy resin Substances 0.000 description 1
- 229920006287 phenoxy resin Polymers 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 238000005554 pickling Methods 0.000 description 1
- 229920001084 poly(chloroprene) Polymers 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 229920000767 polyaniline Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 239000011527 polyurethane coating Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 239000011736 potassium bicarbonate Substances 0.000 description 1
- 235000015497 potassium bicarbonate Nutrition 0.000 description 1
- 229910000028 potassium bicarbonate Inorganic materials 0.000 description 1
- 229910000027 potassium carbonate Inorganic materials 0.000 description 1
- 235000011181 potassium carbonates Nutrition 0.000 description 1
- TYJJADVDDVDEDZ-UHFFFAOYSA-M potassium hydrogencarbonate Chemical compound [K+].OC([O-])=O TYJJADVDDVDEDZ-UHFFFAOYSA-M 0.000 description 1
- NNHHDJVEYQHLHG-UHFFFAOYSA-N potassium silicate Chemical compound [K+].[K+].[O-][Si]([O-])=O NNHHDJVEYQHLHG-UHFFFAOYSA-N 0.000 description 1
- 229910052913 potassium silicate Inorganic materials 0.000 description 1
- 235000019353 potassium silicate Nutrition 0.000 description 1
- 238000010433 powder painting Methods 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 229910052611 pyroxene Inorganic materials 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 229910001404 rare earth metal oxide Inorganic materials 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 238000009877 rendering Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- 229910052701 rubidium Inorganic materials 0.000 description 1
- IGLNJRXAVVLDKE-UHFFFAOYSA-N rubidium atom Chemical compound [Rb] IGLNJRXAVVLDKE-UHFFFAOYSA-N 0.000 description 1
- WPFGFHJALYCVMO-UHFFFAOYSA-L rubidium carbonate Chemical compound [Rb+].[Rb+].[O-]C([O-])=O WPFGFHJALYCVMO-UHFFFAOYSA-L 0.000 description 1
- 229910000026 rubidium carbonate Inorganic materials 0.000 description 1
- 239000012266 salt solution Substances 0.000 description 1
- 238000005488 sandblasting Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 230000008313 sensitization Effects 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- ZLGIYFNHBLSMPS-ATJNOEHPSA-N shellac Chemical compound OCCCCCC(O)C(O)CCCCCCCC(O)=O.C1C23[C@H](C(O)=O)CCC2[C@](C)(CO)[C@@H]1C(C(O)=O)=C[C@@H]3O ZLGIYFNHBLSMPS-ATJNOEHPSA-N 0.000 description 1
- 239000004208 shellac Substances 0.000 description 1
- 229940113147 shellac Drugs 0.000 description 1
- 235000013874 shellac Nutrition 0.000 description 1
- LOQKVDFAJZBDGI-UHFFFAOYSA-N silane zinc Chemical compound [SiH4].[Zn] LOQKVDFAJZBDGI-UHFFFAOYSA-N 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 235000019351 sodium silicates Nutrition 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 229920003048 styrene butadiene rubber Polymers 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 239000011975 tartaric acid Chemical class 0.000 description 1
- 235000002906 tartaric acid Nutrition 0.000 description 1
- 229910052714 tellurium Inorganic materials 0.000 description 1
- PORWMNRCUJJQNO-UHFFFAOYSA-N tellurium atom Chemical compound [Te] PORWMNRCUJJQNO-UHFFFAOYSA-N 0.000 description 1
- 229920001897 terpolymer Polymers 0.000 description 1
- 238000012956 testing procedure Methods 0.000 description 1
- 239000002562 thickening agent Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- GZCWPZJOEIAXRU-UHFFFAOYSA-N tin zinc Chemical compound [Zn].[Sn] GZCWPZJOEIAXRU-UHFFFAOYSA-N 0.000 description 1
- 239000005028 tinplate Substances 0.000 description 1
- BFDQRLXGNLZULX-UHFFFAOYSA-N titanium hydrofluoride Chemical compound F.[Ti] BFDQRLXGNLZULX-UHFFFAOYSA-N 0.000 description 1
- YONPGGFAJWQGJC-UHFFFAOYSA-K titanium(iii) chloride Chemical compound Cl[Ti](Cl)Cl YONPGGFAJWQGJC-UHFFFAOYSA-K 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 229910000314 transition metal oxide Inorganic materials 0.000 description 1
- MTPVUVINMAGMJL-UHFFFAOYSA-N trimethyl(1,1,2,2,2-pentafluoroethyl)silane Chemical compound C[Si](C)(C)C(F)(F)C(F)(F)F MTPVUVINMAGMJL-UHFFFAOYSA-N 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- UONOETXJSWQNOL-UHFFFAOYSA-N tungsten carbide Chemical compound [W+]#[C-] UONOETXJSWQNOL-UHFFFAOYSA-N 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
- GPPXJZIENCGNKB-UHFFFAOYSA-N vanadium Chemical compound [V]#[V] GPPXJZIENCGNKB-UHFFFAOYSA-N 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 238000011179 visual inspection Methods 0.000 description 1
- 239000012855 volatile organic compound Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- 239000011592 zinc chloride Substances 0.000 description 1
- 235000005074 zinc chloride Nutrition 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
- 235000019352 zinc silicate Nutrition 0.000 description 1
- 229910052845 zircon Inorganic materials 0.000 description 1
- GFQYVLUOOAAOGM-UHFFFAOYSA-N zirconium(iv) silicate Chemical compound [Zr+4].[O-][Si]([O-])([O-])[O-] GFQYVLUOOAAOGM-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D9/00—Electrolytic coating other than with metals
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D9/00—Electrolytic coating other than with metals
- C25D9/04—Electrolytic coating other than with metals with inorganic materials
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D9/00—Electrolytic coating other than with metals
- C25D9/04—Electrolytic coating other than with metals with inorganic materials
- C25D9/08—Electrolytic coating other than with metals with inorganic materials by cathodic processes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electrochemistry (AREA)
- Inorganic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
- Chemical Treatment Of Metals (AREA)
- Physical Vapour Deposition (AREA)
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09/532,982 US6322687B1 (en) | 1997-01-31 | 2000-03-22 | Electrolytic process for forming a mineral |
| US09/532982 | 2000-03-22 | ||
| US09/775,072 US6592738B2 (en) | 1997-01-31 | 2001-02-01 | Electrolytic process for treating a conductive surface and products formed thereby |
| US09/775072 | 2001-02-01 | ||
| PCT/US2001/009293 WO2001071067A2 (en) | 2000-03-22 | 2001-03-22 | An energy enhanced process for treating a conductive surface and products formed thereby |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| AU5294801A AU5294801A (en) | 2001-10-03 |
| AU780174B2 true AU780174B2 (en) | 2005-03-03 |
Family
ID=27064015
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AU52948/01A Ceased AU780174B2 (en) | 2000-03-22 | 2001-03-22 | An energy enhanced process for treating a conductive surface and products formed thereby |
Country Status (10)
| Country | Link |
|---|---|
| US (1) | US6592738B2 (https=) |
| EP (1) | EP1307608A2 (https=) |
| JP (1) | JP2003528220A (https=) |
| KR (1) | KR100768565B1 (https=) |
| CN (1) | CN1284886C (https=) |
| AU (1) | AU780174B2 (https=) |
| BR (1) | BR0109472A (https=) |
| CA (1) | CA2387813C (https=) |
| MX (1) | MXPA02003563A (https=) |
| WO (1) | WO2001071067A2 (https=) |
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|---|---|---|---|---|
| US6452406B1 (en) * | 1996-09-13 | 2002-09-17 | International Business Machines Corporation | Probe structure having a plurality of discrete insulated probe tips |
| US6599643B2 (en) * | 1997-01-31 | 2003-07-29 | Elisha Holding Llc | Energy enhanced process for treating a conductive surface and products formed thereby |
| US6455100B1 (en) | 1999-04-13 | 2002-09-24 | Elisha Technologies Co Llc | Coating compositions for electronic components and other metal surfaces, and methods for making and using the compositions |
| US20020197492A1 (en) * | 2001-06-25 | 2002-12-26 | Ling Hao | Selective plating on plastic components |
| AU2002363057A1 (en) * | 2001-08-03 | 2003-05-06 | Elisha Holding Llc | An electrolytic and electroless process for treating metallic surfaces and products formed thereby |
| US6911139B2 (en) | 2001-08-03 | 2005-06-28 | Elisha Holding Llc | Process for treating a conductive surface and products formed thereby |
| TWI280988B (en) | 2001-12-04 | 2007-05-11 | Nippon Steel Corp | Metal oxide and/or metal hydroxide coated metal materials and method for their production |
| EP1537255A2 (en) * | 2002-02-05 | 2005-06-08 | Elisha Holding LLC | Method for treating metallic surfaces and products formed thereby |
| EP1546438A2 (en) * | 2002-09-23 | 2005-06-29 | Elisha Holding LLC | Coating compositions for electronic components and other metal surfaces, and methods for making and using the compositions |
| BR0316116A (pt) * | 2002-11-14 | 2005-09-27 | Elisha Holding Llc | Processo para aplicar um revestimento protetor em múltiplas camadas a um substrato tendo uma superfìcie eletricamente condutiva, e, artigo resistente à corrosão |
| JP4492103B2 (ja) * | 2002-11-25 | 2010-06-30 | 東洋製罐株式会社 | 表面処理金属材料及びその表面処理方法、並びに樹脂被覆金属材料、金属缶、缶蓋 |
| US20040222105A1 (en) * | 2003-04-25 | 2004-11-11 | Heimann Robert L. | Method for preparing and using silicate systems to treat electrically conductive surfaces and products obtained therefrom |
| CN100590225C (zh) * | 2003-04-25 | 2010-02-17 | 以利沙控股有限公司 | 制备和使用硅酸盐体系处理导电表面的方法和由此得到的产品 |
| US7727588B2 (en) * | 2003-09-05 | 2010-06-01 | Yield Engineering Systems, Inc. | Apparatus for the efficient coating of substrates |
| US20050121332A1 (en) * | 2003-10-03 | 2005-06-09 | Kochilla John R. | Apparatus and method for treatment of metal surfaces by inorganic electrophoretic passivation |
| US20050188312A1 (en) * | 2004-02-23 | 2005-08-25 | Research In Motion Limited | Wireless communications device user interface |
| WO2008073887A2 (en) * | 2006-12-11 | 2008-06-19 | Elisha Holding, Llc | Method for treating metallic surfaces with an alternating electrical current |
| DK2229471T3 (da) * | 2008-01-08 | 2015-06-22 | Treadstone Technologies Inc | Stærkt elektrisk ledende overflader til elektrokemiske anvendelser |
| JP5470751B2 (ja) * | 2008-02-13 | 2014-04-16 | Ｔｄｋ株式会社 | 活物質及び電極の製造方法、活物質及び電極 |
| JP5347522B2 (ja) * | 2009-01-20 | 2013-11-20 | Ｔｄｋ株式会社 | 活物質及び電極の製造方法、活物質及び電極 |
| JP5434278B2 (ja) * | 2009-05-29 | 2014-03-05 | Ｔｄｋ株式会社 | 活物質及び電極の製造方法、活物質及び電極 |
| US8632864B2 (en) | 2009-08-24 | 2014-01-21 | Lacks Industries, Inc. | Decorative surface finish and method of forming same |
| KR101242316B1 (ko) * | 2009-08-28 | 2013-03-11 | 도요타지도샤가부시키가이샤 | 전지, 차량 및 전지 탑재 기기 |
| DE102010011185A1 (de) * | 2010-03-12 | 2011-09-15 | Epg (Engineered Nanoproducts Germany) Ag | Metallische Oberflächen mit dünner, glas- oder keramikartiger Schutzschicht mit hoher chemischer Beständigkeit und verbesserten Antihaft-Eigenschaften |
| US8609254B2 (en) | 2010-05-19 | 2013-12-17 | Sanford Process Corporation | Microcrystalline anodic coatings and related methods therefor |
| US8512872B2 (en) | 2010-05-19 | 2013-08-20 | Dupalectpa-CHN, LLC | Sealed anodic coatings |
| WO2012012349A2 (en) | 2010-07-17 | 2012-01-26 | Enginuity Worldwide, LLC | Novel methods for improving surface characteristics |
| CN104451647B (zh) * | 2012-12-13 | 2016-09-28 | 林宾宾 | 成本较低的水电解极板表面处理方法 |
| US9340436B2 (en) * | 2013-04-16 | 2016-05-17 | Palo Alto Research Center Incorporated | Sea water desalination system |
| CN104361836B (zh) * | 2014-11-20 | 2017-01-11 | 无锡科思电子科技有限公司 | 一种led显示屏铸铁箱体的酸洗磷化方法 |
| MX2017011338A (es) * | 2015-03-04 | 2018-06-08 | Univ Texas | Recubrimientos ceramicos compuestos para proteccion anti-corrosion. |
| US10435782B2 (en) | 2015-04-15 | 2019-10-08 | Treadstone Technologies, Inc. | Method of metallic component surface modification for electrochemical applications |
| CN106835227B (zh) * | 2016-12-05 | 2018-11-13 | 浙江工业大学 | 一种基于卤素效应和陶瓷涂层提高钛基合金抗高温氧化性能的方法 |
| CN109612791A (zh) * | 2018-11-30 | 2019-04-12 | 西安交通大学 | 基于3d打印和粉末冶金技术的模拟应力腐蚀裂纹制备方法 |
| US12313297B2 (en) * | 2020-01-27 | 2025-05-27 | Lexmark International, Inc. | Thin-walled tube heater for fluid |
| CN113264678A (zh) * | 2021-04-02 | 2021-08-17 | 容科培 | 一种新型柔性发电玻璃的加工工艺 |
| JP2024004667A (ja) * | 2022-06-29 | 2024-01-17 | 勝規 瀬川 | ステンレス鋼の表面を改質するための電解液 |
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- 2001-02-01 US US09/775,072 patent/US6592738B2/en not_active Expired - Lifetime
- 2001-03-22 JP JP2001569444A patent/JP2003528220A/ja active Pending
- 2001-03-22 MX MXPA02003563A patent/MXPA02003563A/es active IP Right Grant
- 2001-03-22 WO PCT/US2001/009293 patent/WO2001071067A2/en not_active Ceased
- 2001-03-22 BR BR0109472-6A patent/BR0109472A/pt not_active Application Discontinuation
- 2001-03-22 CA CA2387813A patent/CA2387813C/en not_active Expired - Lifetime
- 2001-03-22 CN CNB018087817A patent/CN1284886C/zh not_active Expired - Lifetime
- 2001-03-22 EP EP01926411A patent/EP1307608A2/en not_active Withdrawn
- 2001-03-22 KR KR1020027012569A patent/KR100768565B1/ko not_active Expired - Fee Related
- 2001-03-22 AU AU52948/01A patent/AU780174B2/en not_active Ceased
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Also Published As
| Publication number | Publication date |
|---|---|
| JP2003528220A (ja) | 2003-09-24 |
| AU5294801A (en) | 2001-10-03 |
| CA2387813C (en) | 2014-08-12 |
| KR20020091152A (ko) | 2002-12-05 |
| EP1307608A2 (en) | 2003-05-07 |
| CN1284886C (zh) | 2006-11-15 |
| US6592738B2 (en) | 2003-07-15 |
| WO2001071067A3 (en) | 2003-02-06 |
| BR0109472A (pt) | 2004-01-13 |
| CN1476493A (zh) | 2004-02-18 |
| KR100768565B1 (ko) | 2007-10-19 |
| CA2387813A1 (en) | 2001-09-27 |
| US20020012804A1 (en) | 2002-01-31 |
| MXPA02003563A (es) | 2003-05-23 |
| WO2001071067A2 (en) | 2001-09-27 |
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| PC1 | Assignment before grant (sect. 113) |
Owner name: ELISHA HOLDING LLC Free format text: THE FORMER OWNER WAS: ELISHA TECHNOLOGIES CO. L.L.C. |