AU739164B2 - A chip module and process for the production thereof - Google Patents

A chip module and process for the production thereof Download PDF

Info

Publication number
AU739164B2
AU739164B2 AU54775/98A AU5477598A AU739164B2 AU 739164 B2 AU739164 B2 AU 739164B2 AU 54775/98 A AU54775/98 A AU 54775/98A AU 5477598 A AU5477598 A AU 5477598A AU 739164 B2 AU739164 B2 AU 739164B2
Authority
AU
Australia
Prior art keywords
chip
substrate
chips
processing
chip module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
AU54775/98A
Other languages
English (en)
Other versions
AU5477598A (en
Inventor
David Finn
Manfred Rietzler
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Smartrac IP BV
Original Assignee
Smartrac IP BV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Smartrac IP BV filed Critical Smartrac IP BV
Publication of AU5477598A publication Critical patent/AU5477598A/en
Application granted granted Critical
Publication of AU739164B2 publication Critical patent/AU739164B2/en
Assigned to RIETZLER, MANFRED, ASSA ABLOY IDENTIFICATION TECHNOLOGY GROUP AB reassignment RIETZLER, MANFRED Alteration of Name(s) in Register under S187 Assignors: FINN, DAVID, RIETZLER, MANFRED
Assigned to SMARTRAC IP B.V. reassignment SMARTRAC IP B.V. Alteration of Name(s) in Register under S187 Assignors: ASSA ABLOY IDENTIFICATION TECHNOLOGY GROUP AB, RIETZLER, MANFRED
Anticipated expiration legal-status Critical
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07221—Aligning
    • H10W72/07227—Aligning involving guiding structures, e.g. spacers or supporting members
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07231—Techniques
    • H10W72/07236—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07337—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/251—Materials
    • H10W72/252—Materials comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H10W72/354—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics comprising polymers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Credit Cards Or The Like (AREA)
  • Wire Bonding (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Die Bonding (AREA)
AU54775/98A 1996-12-11 1997-12-11 A chip module and process for the production thereof Expired AU739164B2 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE19651566A DE19651566B4 (de) 1996-12-11 1996-12-11 Chip-Modul sowie Verfahren zu dessen Herstellung und eine Chip-Karte
DE19651566 1996-12-11
PCT/DE1997/002885 WO1998026453A1 (de) 1996-12-11 1997-12-11 Chip-modul sowie verfahren zu dessen herstellung

Publications (2)

Publication Number Publication Date
AU5477598A AU5477598A (en) 1998-07-03
AU739164B2 true AU739164B2 (en) 2001-10-04

Family

ID=7814405

Family Applications (1)

Application Number Title Priority Date Filing Date
AU54775/98A Expired AU739164B2 (en) 1996-12-11 1997-12-11 A chip module and process for the production thereof

Country Status (10)

Country Link
US (1) US6288443B1 (https=)
EP (1) EP0944922B1 (https=)
JP (1) JP4340720B2 (https=)
KR (1) KR100340473B1 (https=)
CN (1) CN1155086C (https=)
AT (1) ATE274238T1 (https=)
AU (1) AU739164B2 (https=)
CA (1) CA2274785C (https=)
DE (2) DE19651566B4 (https=)
WO (1) WO1998026453A1 (https=)

Families Citing this family (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19920593B4 (de) * 1999-05-05 2006-07-13 Assa Abloy Identification Technology Group Ab Chipträger für ein Chipmodul und Verfahren zur Herstellung des Chipmoduls
DE19948555A1 (de) * 1999-12-03 2001-05-03 Andreas Plettner Verfahren zur Herstellung kontaktloser Chipkarten sowie zur Herstellung von elektrischen Einheiten, bestehend aus Chips mit Kontaktelementen
DE19958328A1 (de) 1999-10-08 2001-07-12 Flexchip Ag Verfahren zum Herstellen einer elektrischen Verbindung zwischen Chip-Kontaktelemente-Einheiten und externen Kontaktanschlüssen
JP4299414B2 (ja) * 1999-10-12 2009-07-22 富士通マイクロエレクトロニクス株式会社 コンビネーションカード、ｉｃカード用モジュール及びコンビネーションカードの製造方法
US6582281B2 (en) 2000-03-23 2003-06-24 Micron Technology, Inc. Semiconductor processing methods of removing conductive material
DE10014620A1 (de) * 2000-03-24 2001-09-27 Andreas Plettner Verfahren zur Herstellung eines Trägerbandes mit einer Vielzahl von elektrischen Einheiten, jeweils aufweisend einen Chip und Kontaktelemente
DE10119232C1 (de) * 2001-04-19 2002-12-05 Siemens Production & Logistics Einrichtung zum Kennzeichnen von mit einer Mehrzahl zu bestückender elektrischer Bauelemente versehenen Bauelemententrägern und Verfahren zur Verwendung der Einrichtung
JP2007503634A (ja) * 2003-08-26 2007-02-22 ミュールバウアー アーゲー スマートラベル用のモジュールブリッジ
TWI259564B (en) 2003-10-15 2006-08-01 Infineon Technologies Ag Wafer level packages for chips with sawn edge protection
AU2005304141B2 (en) * 2004-11-02 2010-08-26 Hid Global Gmbh Laying device, contacting device, advancing system, laying and contacting unit, production system, method for the production and a transponder unit
DE102004053292A1 (de) * 2004-11-04 2006-05-11 Giesecke & Devrient Gmbh Kartenförmiger Datenträger
US8286332B2 (en) 2006-09-26 2012-10-16 Hid Global Gmbh Method and apparatus for making a radio frequency inlay
US8322624B2 (en) 2007-04-10 2012-12-04 Feinics Amatech Teoranta Smart card with switchable matching antenna
US7546671B2 (en) 2006-09-26 2009-06-16 Micromechanic And Automation Technology Ltd. Method of forming an inlay substrate having an antenna wire
US8608080B2 (en) 2006-09-26 2013-12-17 Feinics Amatech Teoranta Inlays for security documents
US7971339B2 (en) 2006-09-26 2011-07-05 Hid Global Gmbh Method and apparatus for making a radio frequency inlay
US20080179404A1 (en) * 2006-09-26 2008-07-31 Advanced Microelectronic And Automation Technology Ltd. Methods and apparatuses to produce inlays with transponders
US7581308B2 (en) 2007-01-01 2009-09-01 Advanced Microelectronic And Automation Technology Ltd. Methods of connecting an antenna to a transponder chip
US7979975B2 (en) 2007-04-10 2011-07-19 Feinics Amatech Teavanta Methods of connecting an antenna to a transponder chip
US8240022B2 (en) * 2006-09-26 2012-08-14 Feinics Amatech Teorowita Methods of connecting an antenna to a transponder chip
DE102006059454A1 (de) 2006-12-15 2008-06-19 Bundesdruckerei Gmbh Personaldokument und Verfahren zu seiner Herstellung
US7980477B2 (en) 2007-05-17 2011-07-19 Féinics Amatech Teoranta Dual interface inlays
EP2001077A1 (fr) * 2007-05-21 2008-12-10 Gemplus Procédé de réalisation d'un dispositif comportant une antenne de transpondeur connectée à des plages de contact et dispositif obtenu
ES2355682T3 (es) 2007-09-18 2011-03-30 Hid Global Ireland Teoranta Procedimiento para la unión de un conductor de cable dispuesto sobre un sustrato.
DE102010041917B4 (de) * 2010-10-04 2014-01-23 Smartrac Ip B.V. Schaltungsanordnung und Verfahren zu deren Herstellung
KR101131782B1 (ko) 2011-07-19 2012-03-30 디지털옵틱스 코포레이션 이스트 집적 모듈용 기판
DE102012103430B4 (de) 2012-04-19 2015-10-22 Ev Group E. Thallner Gmbh Verfahren zum Heften von Chips auf ein Substrat
WO2014121300A2 (en) * 2013-02-04 2014-08-07 American Semiconductor, Inc. Photonic data transfer assembly
DE102015215232B4 (de) 2015-08-10 2023-01-19 Thyssenkrupp Ag Rundumüberwachungssystem, Schiff ausgestattet mit einem Rundumüberwachungssystem und Verfahren zur Überwachung auf einem Schiff
DE102018121139B3 (de) 2018-08-29 2019-09-26 Vsm Vereinigte Schmirgel- Und Maschinen-Fabriken Ag Endlos-Schleifband für eine Schleifmaschine
DE102019216124A1 (de) * 2019-10-21 2021-04-22 Thyssenkrupp Ag Förderbandanlage mit im Förderband integrierter Datenübertragung
EP4048612B1 (de) 2019-10-21 2023-05-17 FLSmidth A/S Verfahren zur herstellung von 1,6-anhydro-zuckern

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0207853A1 (fr) * 1985-06-26 1987-01-07 Bull S.A. Procédé de montage d'un circuit intégré sur un support, dispositif en résultant et son application à une carte à microcircuits électroniques
JPS63147352A (ja) * 1986-12-11 1988-06-20 Nec Corp 超薄型モジユ−ル
US5155068A (en) * 1989-08-31 1992-10-13 Sharp Kabushiki Kaisha Method for manufacturing an IC module for an IC card whereby an IC device and surrounding encapsulant are thinned by material removal

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3917707A1 (de) * 1989-05-31 1990-12-06 Siemens Ag Elektronisches modul und verfahren zu seiner herstellung
DE4238137A1 (de) * 1992-11-12 1994-05-19 Ant Nachrichtentech Verfahren zur Herstellung von Vorrichtungen mit Bauelementen
KR0179834B1 (ko) * 1995-07-28 1999-03-20 문정환 컬럼형 패키지

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0207853A1 (fr) * 1985-06-26 1987-01-07 Bull S.A. Procédé de montage d'un circuit intégré sur un support, dispositif en résultant et son application à une carte à microcircuits électroniques
JPS63147352A (ja) * 1986-12-11 1988-06-20 Nec Corp 超薄型モジユ−ル
US5155068A (en) * 1989-08-31 1992-10-13 Sharp Kabushiki Kaisha Method for manufacturing an IC module for an IC card whereby an IC device and surrounding encapsulant are thinned by material removal

Also Published As

Publication number Publication date
US6288443B1 (en) 2001-09-11
CA2274785C (en) 2004-05-11
CN1240535A (zh) 2000-01-05
EP0944922B1 (de) 2004-08-18
EP0944922A1 (de) 1999-09-29
KR100340473B1 (ko) 2002-06-12
CN1155086C (zh) 2004-06-23
DE19651566B4 (de) 2006-09-07
CA2274785A1 (en) 1998-06-18
KR20000057511A (ko) 2000-09-15
JP4340720B2 (ja) 2009-10-07
AU5477598A (en) 1998-07-03
JP2001517362A (ja) 2001-10-02
ATE274238T1 (de) 2004-09-15
DE19651566A1 (de) 1998-06-18
DE59711861D1 (de) 2004-09-23
WO1998026453A1 (de) 1998-06-18

Similar Documents

Publication Publication Date Title
AU739164B2 (en) A chip module and process for the production thereof
US5018051A (en) IC card having circuit modules for mounting electronic components
US6208021B1 (en) Semiconductor device, manufacturing method thereof and aggregate type semiconductor device
JP3499202B2 (ja) 半導体装置の製造方法
RU2190879C2 (ru) Карта со встроенным кристаллом ис и полупроводниковый кристалл ис для применения в карте
US5206188A (en) Method of manufacturing a high lead count circuit board
EP0814510B1 (en) TAB tape and semiconductor device using the TAB tape
KR20010005659A (ko) 납땜 와이어로 접속된 안테나를 갖는 무접촉 카드 제조 방법
EP1365481B1 (en) Card-edge connector and card member
WO2003028044A3 (de) Nicht-leitendes, ein band oder einen nutzen bildendes substrat, auf dem eine vielzahl von trägerelementen ausgebildet ist
KR970004949B1 (ko) 수지밀봉형 반도체장치 및 그 리드프레임
KR20050020708A (ko) 전기 회로 기판
US20080087995A1 (en) Flexible film semiconductor package and method for manufacturing the same
US6365440B1 (en) Method for contacting a circuit chip
EP1125247B1 (en) Data carrier with integrated circuit and transmission coil
US7208822B1 (en) Integrated circuit device, electronic module for chip cards using said device and method for making same
EP0051666A1 (en) Integrated circuit package with multi-contact pins
US8164195B2 (en) Pad structure of semiconductor integrated circuit apparatus
US7492038B2 (en) Semiconductor device
JP4246093B2 (ja) フレキシブル配線板
RU2168798C2 (ru) Полупроводниковое устройство и способ его изготовления
KR100587042B1 (ko) 적층형 패키지 및 그 제조방법
KR20040038134A (ko) 안정된 비접촉 통신수단을 제공하는 콤비형 스마트 카드
US20030036317A1 (en) Method for applying a semiconductor chip to a substrate and an assembly obtained thereby
JP2007149981A (ja) 半導体装置およびその製造方法

Legal Events

Date Code Title Description
FGA Letters patent sealed or granted (standard patent)