AU667769B2 - Apparatus and method for assembling and checking microwave monolithic integrated circuit (MMIC) module - Google Patents

Apparatus and method for assembling and checking microwave monolithic integrated circuit (MMIC) module Download PDF

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Publication number
AU667769B2
AU667769B2 AU59338/94A AU5933894A AU667769B2 AU 667769 B2 AU667769 B2 AU 667769B2 AU 59338/94 A AU59338/94 A AU 59338/94A AU 5933894 A AU5933894 A AU 5933894A AU 667769 B2 AU667769 B2 AU 667769B2
Authority
AU
Australia
Prior art keywords
characteristic
substrate
adjustment
circuit module
active elements
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
AU59338/94A
Other languages
English (en)
Other versions
AU5933894A (en
Inventor
Yuhei Kosugi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Publication of AU5933894A publication Critical patent/AU5933894A/en
Application granted granted Critical
Publication of AU667769B2 publication Critical patent/AU667769B2/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0612—Production flow monitoring, e.g. for increasing throughput
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/23—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Microwave Amplifiers (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
AU59338/94A 1993-04-07 1994-04-07 Apparatus and method for assembling and checking microwave monolithic integrated circuit (MMIC) module Ceased AU667769B2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP5-105014 1993-04-07
JP5105014A JPH0821807B2 (ja) 1993-04-07 1993-04-07 マイクロ波回路モジュールの製造装置

Publications (2)

Publication Number Publication Date
AU5933894A AU5933894A (en) 1994-10-13
AU667769B2 true AU667769B2 (en) 1996-04-04

Family

ID=14396218

Family Applications (1)

Application Number Title Priority Date Filing Date
AU59338/94A Ceased AU667769B2 (en) 1993-04-07 1994-04-07 Apparatus and method for assembling and checking microwave monolithic integrated circuit (MMIC) module

Country Status (7)

Country Link
US (1) US5396433A (ref)
EP (1) EP0622840B1 (ref)
JP (1) JPH0821807B2 (ref)
AU (1) AU667769B2 (ref)
CA (1) CA2120804C (ref)
DE (1) DE69425775T2 (ref)
TW (1) TW252220B (ref)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2898493B2 (ja) * 1992-11-26 1999-06-02 三菱電機株式会社 ミリ波またはマイクロ波ｉｃのレイアウト設計方法及びレイアウト設計装置
JPH08288452A (ja) * 1995-04-20 1996-11-01 Mitsubishi Electric Corp 集積回路装置，及びその製造方法
US5793650A (en) * 1995-10-19 1998-08-11 Analog Devices, Inc. System and method of identifying the number of chip failures on a wafer attributed to cluster failures
CH691798A5 (fr) * 1996-06-19 2001-10-31 Hct Shaping Systems Sa Centre de découpage destiné à produire des tranches à partir de pièces à trancher.
US5659467A (en) * 1996-06-26 1997-08-19 Texas Instruments Incorporated Multiple model supervisor control system and method of operation
KR100216066B1 (ko) * 1997-05-20 1999-08-16 윤종용 반도체 집적회로 소자 검사공정 제어 시스템 및 제어방법
US6161052A (en) * 1997-10-28 2000-12-12 Micron Electronics, Inc. Method for identifying a component with physical characterization
US6289292B1 (en) * 1997-10-28 2001-09-11 Micron Technology, Inc. System for identifying a component with physical characterization
JPH11260931A (ja) 1998-03-15 1999-09-24 Toshiba Microelectronics Corp 半導体集積回路装置の市場故障率推定方法、半導体集積回路装置の製造方法及びテスト用半導体集積回路装置
TWI238594B (en) * 2001-06-18 2005-08-21 Delta Electronics Inc Method of adjusting oscillator frequency
DE10225042A1 (de) * 2002-06-06 2004-01-08 Marconi Communications Gmbh Integrierter Schaltkreis und Verfahren zur Herstellung desselben
US6810296B2 (en) * 2002-09-25 2004-10-26 Advanced Micro Devices, Inc. Correlating an inline parameter to a device operation parameter
DE102004013614A1 (de) * 2004-03-19 2005-10-13 Siemens Ag Verfahren zur Ermittlung und Darstellung für einen Betrieb eines Geräts notwendiger Justageschritte
EP2399210A1 (en) 2009-02-20 2011-12-28 SunPower Corporation Automated solar collector installation design including exceptional condition management and display
CN102317945A (zh) * 2009-02-20 2012-01-11 太阳能公司 自动化太阳能收集器安装设计
EP2399212A1 (en) 2009-02-20 2011-12-28 SunPower Corporation Automated solar collector installation design including version management
JP5532351B2 (ja) 2009-02-20 2014-06-25 サンパワー コーポレイション ソーラーコレクタ設置レイアウトを設計する方法、コンピュータ読み取り可能な記憶媒体及びシステム
JP2010199362A (ja) * 2009-02-26 2010-09-09 Denso Corp 半導体チップの組付け方法
DE102009026767A1 (de) 2009-06-05 2010-12-09 Robert Bosch Gmbh Radarsensor mit Störsignalkompensation
WO2010150572A1 (ja) * 2009-06-24 2010-12-29 シャープ株式会社 光センサ付き表示装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4901242A (en) * 1987-04-03 1990-02-13 Mitsubishi Denki Kabushiki Kaisha System for managing production of semiconductor devices
US5031111A (en) * 1988-08-08 1991-07-09 Trw Inc. Automated circuit design method
US5047941A (en) * 1987-06-04 1991-09-10 Akebono Brake Industry Co. Ltd. Wheel acceleration slip control device

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1054514A (ref) * 1963-04-05 1900-01-01
US4954453A (en) * 1989-02-24 1990-09-04 At&T Bell Laboratories Method of producing an article comprising a multichip assembly
GB8918482D0 (en) * 1989-08-14 1989-09-20 Inmos Ltd Packaging semiconductor chips
US5047947A (en) * 1990-07-25 1991-09-10 Grumman Aerospace Corporation Method of modeling the assembly of products to increase production yield

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4901242A (en) * 1987-04-03 1990-02-13 Mitsubishi Denki Kabushiki Kaisha System for managing production of semiconductor devices
US5047941A (en) * 1987-06-04 1991-09-10 Akebono Brake Industry Co. Ltd. Wheel acceleration slip control device
US5031111A (en) * 1988-08-08 1991-07-09 Trw Inc. Automated circuit design method
US5031111C1 (en) * 1988-08-08 2001-03-27 Trw Inc Automated circuit design method

Also Published As

Publication number Publication date
EP0622840B1 (en) 2000-09-06
EP0622840A3 (en) 1995-03-22
JPH06296106A (ja) 1994-10-21
DE69425775D1 (de) 2000-10-12
JPH0821807B2 (ja) 1996-03-04
TW252220B (ref) 1995-07-21
CA2120804A1 (en) 1994-10-08
EP0622840A2 (en) 1994-11-02
US5396433A (en) 1995-03-07
CA2120804C (en) 1997-12-09
AU5933894A (en) 1994-10-13
DE69425775T2 (de) 2001-02-01

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Legal Events

Date Code Title Description
MK14 Patent ceased section 143(a) (annual fees not paid) or expired