CA2120804C - Apparatus and method for assembling and checking microwave monolithic integrated circuit (mmic) module - Google Patents

Apparatus and method for assembling and checking microwave monolithic integrated circuit (mmic) module

Info

Publication number
CA2120804C
CA2120804C CA002120804A CA2120804A CA2120804C CA 2120804 C CA2120804 C CA 2120804C CA 002120804 A CA002120804 A CA 002120804A CA 2120804 A CA2120804 A CA 2120804A CA 2120804 C CA2120804 C CA 2120804C
Authority
CA
Canada
Prior art keywords
active elements
combination
characteristic value
substrate
results
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CA002120804A
Other languages
English (en)
French (fr)
Other versions
CA2120804A1 (en
Inventor
Yuhei Kosugi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Publication of CA2120804A1 publication Critical patent/CA2120804A1/en
Application granted granted Critical
Publication of CA2120804C publication Critical patent/CA2120804C/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0612—Production flow monitoring, e.g. for increasing throughput
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/23—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Microwave Amplifiers (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
CA002120804A 1993-04-07 1994-04-07 Apparatus and method for assembling and checking microwave monolithic integrated circuit (mmic) module Expired - Fee Related CA2120804C (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP5105014A JPH0821807B2 (ja) 1993-04-07 1993-04-07 マイクロ波回路モジュールの製造装置
JP105014/1993 1993-04-07

Publications (2)

Publication Number Publication Date
CA2120804A1 CA2120804A1 (en) 1994-10-08
CA2120804C true CA2120804C (en) 1997-12-09

Family

ID=14396218

Family Applications (1)

Application Number Title Priority Date Filing Date
CA002120804A Expired - Fee Related CA2120804C (en) 1993-04-07 1994-04-07 Apparatus and method for assembling and checking microwave monolithic integrated circuit (mmic) module

Country Status (7)

Country Link
US (1) US5396433A (ref)
EP (1) EP0622840B1 (ref)
JP (1) JPH0821807B2 (ref)
AU (1) AU667769B2 (ref)
CA (1) CA2120804C (ref)
DE (1) DE69425775T2 (ref)
TW (1) TW252220B (ref)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2898493B2 (ja) * 1992-11-26 1999-06-02 三菱電機株式会社 ミリ波またはマイクロ波ｉｃのレイアウト設計方法及びレイアウト設計装置
JPH08288452A (ja) * 1995-04-20 1996-11-01 Mitsubishi Electric Corp 集積回路装置，及びその製造方法
US5793650A (en) * 1995-10-19 1998-08-11 Analog Devices, Inc. System and method of identifying the number of chip failures on a wafer attributed to cluster failures
CH691798A5 (fr) * 1996-06-19 2001-10-31 Hct Shaping Systems Sa Centre de découpage destiné à produire des tranches à partir de pièces à trancher.
US5659467A (en) * 1996-06-26 1997-08-19 Texas Instruments Incorporated Multiple model supervisor control system and method of operation
KR100216066B1 (ko) * 1997-05-20 1999-08-16 윤종용 반도체 집적회로 소자 검사공정 제어 시스템 및 제어방법
US6161052A (en) * 1997-10-28 2000-12-12 Micron Electronics, Inc. Method for identifying a component with physical characterization
US6289292B1 (en) * 1997-10-28 2001-09-11 Micron Technology, Inc. System for identifying a component with physical characterization
JPH11260931A (ja) 1998-03-15 1999-09-24 Toshiba Microelectronics Corp 半導体集積回路装置の市場故障率推定方法、半導体集積回路装置の製造方法及びテスト用半導体集積回路装置
TWI238594B (en) * 2001-06-18 2005-08-21 Delta Electronics Inc Method of adjusting oscillator frequency
DE10225042A1 (de) * 2002-06-06 2004-01-08 Marconi Communications Gmbh Integrierter Schaltkreis und Verfahren zur Herstellung desselben
US6810296B2 (en) * 2002-09-25 2004-10-26 Advanced Micro Devices, Inc. Correlating an inline parameter to a device operation parameter
DE102004013614A1 (de) * 2004-03-19 2005-10-13 Siemens Ag Verfahren zur Ermittlung und Darstellung für einen Betrieb eines Geräts notwendiger Justageschritte
EP2399210A1 (en) 2009-02-20 2011-12-28 SunPower Corporation Automated solar collector installation design including exceptional condition management and display
CN102317945A (zh) * 2009-02-20 2012-01-11 太阳能公司 自动化太阳能收集器安装设计
EP2399212A1 (en) 2009-02-20 2011-12-28 SunPower Corporation Automated solar collector installation design including version management
JP5532351B2 (ja) 2009-02-20 2014-06-25 サンパワー コーポレイション ソーラーコレクタ設置レイアウトを設計する方法、コンピュータ読み取り可能な記憶媒体及びシステム
JP2010199362A (ja) * 2009-02-26 2010-09-09 Denso Corp 半導体チップの組付け方法
DE102009026767A1 (de) 2009-06-05 2010-12-09 Robert Bosch Gmbh Radarsensor mit Störsignalkompensation
WO2010150572A1 (ja) * 2009-06-24 2010-12-29 シャープ株式会社 光センサ付き表示装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1054514A (ref) * 1963-04-05 1900-01-01
JPH0616475B2 (ja) * 1987-04-03 1994-03-02 三菱電機株式会社 物品の製造システム及び物品の製造方法
JPS63306253A (ja) * 1987-06-04 1988-12-14 Akebono Brake Res & Dev Center Ltd 車輪加速スリップ制御装置
US5031111C1 (en) * 1988-08-08 2001-03-27 Trw Inc Automated circuit design method
US4954453A (en) * 1989-02-24 1990-09-04 At&T Bell Laboratories Method of producing an article comprising a multichip assembly
GB8918482D0 (en) * 1989-08-14 1989-09-20 Inmos Ltd Packaging semiconductor chips
US5047947A (en) * 1990-07-25 1991-09-10 Grumman Aerospace Corporation Method of modeling the assembly of products to increase production yield

Also Published As

Publication number Publication date
EP0622840B1 (en) 2000-09-06
EP0622840A3 (en) 1995-03-22
JPH06296106A (ja) 1994-10-21
DE69425775D1 (de) 2000-10-12
JPH0821807B2 (ja) 1996-03-04
AU667769B2 (en) 1996-04-04
TW252220B (ref) 1995-07-21
CA2120804A1 (en) 1994-10-08
EP0622840A2 (en) 1994-11-02
US5396433A (en) 1995-03-07
AU5933894A (en) 1994-10-13
DE69425775T2 (de) 2001-02-01

Similar Documents

Publication Publication Date Title
CA2120804C (en) Apparatus and method for assembling and checking microwave monolithic integrated circuit (mmic) module
US5717249A (en) RF power amplifying circuit device
US6184463B1 (en) Integrated circuit package for flip chip
US5311401A (en) Stacked chip assembly and manufacturing method therefor
US7176559B2 (en) Integrated circuit package with a balanced-part structure
US6740983B2 (en) Method for ball grind array chip packages having improved testing and stacking characteristics
US5616958A (en) Electronic package
US5939783A (en) Electronic package
US5994768A (en) Multi-layer lead frame
US5357672A (en) Method and system for fabricating IC packages from laminated boards and heat spreader
US20010054756A1 (en) Multi-layered semiconductor device and method for producing the same
US20030179556A1 (en) Enhanced die-up ball grid array package with two substrates and method for making the same
US6301122B1 (en) Radio frequency module with thermally and electrically coupled metal film on insulating substrate
US6344973B1 (en) Power module with a circuit arrangement comprising active semiconductor components and passive components, and method for producing same
US6118357A (en) Wireless MMIC chip packaging for microwave and millimeterwave frequencies
JPH01155637A (ja) マルチチツプ・モジユール
US20010038150A1 (en) Semiconductor device manufactured by package group molding and dicing method
US6320136B1 (en) Layered printed-circuit-board and module using the same
US20020063331A1 (en) Film carrier semiconductor device
Karnfelt et al. Investigation of parylene-C on the performance of millimeter-wave circuits
US20230290752A1 (en) Semiconductor device and method of manufacturing the same
US20040089930A1 (en) Simplified stacked chip assemblies
JPH1174416A (ja) 半導体チップ用キャリア，半導体モジュール，半導体チップ用キャリアの製造方法，および半導体モジュールの製造方法
McNulty et al. Microwave multichip modules using low cost microwave chip on flex packaging technology
JP3102885B2 (ja) チャンバを設けた高密度相互接続構造体

Legal Events

Date Code Title Description
EEER Examination request
MKLA Lapsed