TW252220B - - Google Patents

Info

Publication number
TW252220B
TW252220B TW083109131A TW83109131A TW252220B TW 252220 B TW252220 B TW 252220B TW 083109131 A TW083109131 A TW 083109131A TW 83109131 A TW83109131 A TW 83109131A TW 252220 B TW252220 B TW 252220B
Authority
TW
Taiwan
Application number
TW083109131A
Original Assignee
Nippon Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co filed Critical Nippon Electric Co
Application granted granted Critical
Publication of TW252220B publication Critical patent/TW252220B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67276—Production flow monitoring, e.g. for increasing throughput
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01057—Lanthanum [La]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01068—Erbium [Er]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H01L2924/141—Analog devices
    • H01L2924/1423—Monolithic Microwave Integrated Circuit [MMIC]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Automation & Control Theory (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Microwave Amplifiers (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
TW083109131A 1993-04-07 1994-10-03 TW252220B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5105014A JPH0821807B2 (ja) 1993-04-07 1993-04-07 マイクロ波回路モジュールの製造装置

Publications (1)

Publication Number Publication Date
TW252220B true TW252220B (zh) 1995-07-21

Family

ID=14396218

Family Applications (1)

Application Number Title Priority Date Filing Date
TW083109131A TW252220B (zh) 1993-04-07 1994-10-03

Country Status (7)

Country Link
US (1) US5396433A (zh)
EP (1) EP0622840B1 (zh)
JP (1) JPH0821807B2 (zh)
AU (1) AU667769B2 (zh)
CA (1) CA2120804C (zh)
DE (1) DE69425775T2 (zh)
TW (1) TW252220B (zh)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2898493B2 (ja) * 1992-11-26 1999-06-02 三菱電機株式会社 ミリ波またはマイクロ波ｉｃのレイアウト設計方法及びレイアウト設計装置
JPH08288452A (ja) * 1995-04-20 1996-11-01 Mitsubishi Electric Corp 集積回路装置，及びその製造方法
US5793650A (en) * 1995-10-19 1998-08-11 Analog Devices, Inc. System and method of identifying the number of chip failures on a wafer attributed to cluster failures
CH691798A5 (fr) * 1996-06-19 2001-10-31 Hct Shaping Systems Sa Centre de découpage destiné à produire des tranches à partir de pièces à trancher.
US5659467A (en) * 1996-06-26 1997-08-19 Texas Instruments Incorporated Multiple model supervisor control system and method of operation
KR100216066B1 (ko) * 1997-05-20 1999-08-16 윤종용 반도체 집적회로 소자 검사공정 제어 시스템 및 제어방법
US6289292B1 (en) * 1997-10-28 2001-09-11 Micron Technology, Inc. System for identifying a component with physical characterization
US6161052A (en) * 1997-10-28 2000-12-12 Micron Electronics, Inc. Method for identifying a component with physical characterization
JPH11260931A (ja) 1998-03-15 1999-09-24 Toshiba Microelectronics Corp 半導体集積回路装置の市場故障率推定方法、半導体集積回路装置の製造方法及びテスト用半導体集積回路装置
TWI238594B (en) * 2001-06-18 2005-08-21 Delta Electronics Inc Method of adjusting oscillator frequency
DE10225042A1 (de) * 2002-06-06 2004-01-08 Marconi Communications Gmbh Integrierter Schaltkreis und Verfahren zur Herstellung desselben
US6810296B2 (en) * 2002-09-25 2004-10-26 Advanced Micro Devices, Inc. Correlating an inline parameter to a device operation parameter
DE102004013614A1 (de) * 2004-03-19 2005-10-13 Siemens Ag Verfahren zur Ermittlung und Darstellung für einen Betrieb eines Geräts notwendiger Justageschritte
WO2010096268A1 (en) * 2009-02-20 2010-08-26 Sunpower Corporation Automated solar collector installation design
JP5532351B2 (ja) 2009-02-20 2014-06-25 サンパワー コーポレイション ソーラーコレクタ設置レイアウトを設計する方法、コンピュータ読み取り可能な記憶媒体及びシステム
EP2399212A1 (en) 2009-02-20 2011-12-28 SunPower Corporation Automated solar collector installation design including version management
EP2399210A1 (en) * 2009-02-20 2011-12-28 SunPower Corporation Automated solar collector installation design including exceptional condition management and display
JP2010199362A (ja) * 2009-02-26 2010-09-09 Denso Corp 半導体チップの組付け方法
DE102009026767A1 (de) * 2009-06-05 2010-12-09 Robert Bosch Gmbh Radarsensor mit Störsignalkompensation
US20120105404A1 (en) * 2009-06-24 2012-05-03 Sharp Kabushiki Kaisha Display device with light sensors

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1054514A (zh) * 1963-04-05 1900-01-01
JPH0616475B2 (ja) * 1987-04-03 1994-03-02 三菱電機株式会社 物品の製造システム及び物品の製造方法
JPS63306253A (ja) * 1987-06-04 1988-12-14 Akebono Brake Res & Dev Center Ltd 車輪加速スリップ制御装置
US5031111C1 (en) * 1988-08-08 2001-03-27 Trw Inc Automated circuit design method
US4954453A (en) * 1989-02-24 1990-09-04 At&T Bell Laboratories Method of producing an article comprising a multichip assembly
GB8918482D0 (en) * 1989-08-14 1989-09-20 Inmos Ltd Packaging semiconductor chips
US5047947A (en) * 1990-07-25 1991-09-10 Grumman Aerospace Corporation Method of modeling the assembly of products to increase production yield

Also Published As

Publication number Publication date
AU5933894A (en) 1994-10-13
US5396433A (en) 1995-03-07
DE69425775T2 (de) 2001-02-01
JPH06296106A (ja) 1994-10-21
EP0622840A3 (en) 1995-03-22
EP0622840A2 (en) 1994-11-02
CA2120804A1 (en) 1994-10-08
JPH0821807B2 (ja) 1996-03-04
DE69425775D1 (de) 2000-10-12
CA2120804C (en) 1997-12-09
AU667769B2 (en) 1996-04-04
EP0622840B1 (en) 2000-09-06

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