DE69425775D1 - Methode für die Montage und das Prüfen von monolitisch integrierten Mikrowellenschaltungsmodulen (MMIC) - Google Patents

Methode für die Montage und das Prüfen von monolitisch integrierten Mikrowellenschaltungsmodulen (MMIC)

Info

Publication number
DE69425775D1
DE69425775D1 DE69425775T DE69425775T DE69425775D1 DE 69425775 D1 DE69425775 D1 DE 69425775D1 DE 69425775 T DE69425775 T DE 69425775T DE 69425775 T DE69425775 T DE 69425775T DE 69425775 D1 DE69425775 D1 DE 69425775D1
Authority
DE
Germany
Prior art keywords
mmic
assembling
testing
circuit modules
monolithically integrated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69425775T
Other languages
English (en)
Other versions
DE69425775T2 (de
Inventor
Yuhei Kosugi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Application granted granted Critical
Publication of DE69425775D1 publication Critical patent/DE69425775D1/de
Publication of DE69425775T2 publication Critical patent/DE69425775T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67276—Production flow monitoring, e.g. for increasing throughput
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01057—Lanthanum [La]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01068—Erbium [Er]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H01L2924/141—Analog devices
    • H01L2924/1423—Monolithic Microwave Integrated Circuit [MMIC]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Automation & Control Theory (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Microwave Amplifiers (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
DE69425775T 1993-04-07 1994-04-07 Methode für die Montage und das Prüfen von monolitisch integrierten Mikrowellenschaltungsmodulen (MMIC) Expired - Fee Related DE69425775T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5105014A JPH0821807B2 (ja) 1993-04-07 1993-04-07 マイクロ波回路モジュールの製造装置

Publications (2)

Publication Number Publication Date
DE69425775D1 true DE69425775D1 (de) 2000-10-12
DE69425775T2 DE69425775T2 (de) 2001-02-01

Family

ID=14396218

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69425775T Expired - Fee Related DE69425775T2 (de) 1993-04-07 1994-04-07 Methode für die Montage und das Prüfen von monolitisch integrierten Mikrowellenschaltungsmodulen (MMIC)

Country Status (7)

Country Link
US (1) US5396433A (de)
EP (1) EP0622840B1 (de)
JP (1) JPH0821807B2 (de)
AU (1) AU667769B2 (de)
CA (1) CA2120804C (de)
DE (1) DE69425775T2 (de)
TW (1) TW252220B (de)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2898493B2 (ja) * 1992-11-26 1999-06-02 三菱電機株式会社 ミリ波またはマイクロ波ｉｃのレイアウト設計方法及びレイアウト設計装置
JPH08288452A (ja) * 1995-04-20 1996-11-01 Mitsubishi Electric Corp 集積回路装置，及びその製造方法
US5793650A (en) * 1995-10-19 1998-08-11 Analog Devices, Inc. System and method of identifying the number of chip failures on a wafer attributed to cluster failures
CH691798A5 (fr) * 1996-06-19 2001-10-31 Hct Shaping Systems Sa Centre de découpage destiné à produire des tranches à partir de pièces à trancher.
US5659467A (en) * 1996-06-26 1997-08-19 Texas Instruments Incorporated Multiple model supervisor control system and method of operation
KR100216066B1 (ko) * 1997-05-20 1999-08-16 윤종용 반도체 집적회로 소자 검사공정 제어 시스템 및 제어방법
US6161052A (en) * 1997-10-28 2000-12-12 Micron Electronics, Inc. Method for identifying a component with physical characterization
US6289292B1 (en) * 1997-10-28 2001-09-11 Micron Technology, Inc. System for identifying a component with physical characterization
JPH11260931A (ja) 1998-03-15 1999-09-24 Toshiba Microelectronics Corp 半導体集積回路装置の市場故障率推定方法、半導体集積回路装置の製造方法及びテスト用半導体集積回路装置
TWI238594B (en) * 2001-06-18 2005-08-21 Delta Electronics Inc Method of adjusting oscillator frequency
DE10225042A1 (de) * 2002-06-06 2004-01-08 Marconi Communications Gmbh Integrierter Schaltkreis und Verfahren zur Herstellung desselben
US6810296B2 (en) * 2002-09-25 2004-10-26 Advanced Micro Devices, Inc. Correlating an inline parameter to a device operation parameter
DE102004013614A1 (de) * 2004-03-19 2005-10-13 Siemens Ag Verfahren zur Ermittlung und Darstellung für einen Betrieb eines Geräts notwendiger Justageschritte
JP5532352B2 (ja) 2009-02-20 2014-06-25 サンパワー コーポレイション ソーラーコレクタ設置を設計する方法およびそのプログラム
CN102326163A (zh) * 2009-02-20 2012-01-18 太阳能公司 包括异常事件状况管理和显示的自动化太阳能收集器安装设计
EP2399213A2 (de) 2009-02-20 2011-12-28 SunPower Corporation Gestaltung einer automatisierten sonnenkollektorinstallation mit möglichkeit zur definition heterogener gestaltungspräferenzen
EP2399211A1 (de) * 2009-02-20 2011-12-28 SunPower Corporation Entwurf einer automatisierten sonnenkollektorinstallation
JP2010199362A (ja) * 2009-02-26 2010-09-09 Denso Corp 半導体チップの組付け方法
DE102009026767A1 (de) * 2009-06-05 2010-12-09 Robert Bosch Gmbh Radarsensor mit Störsignalkompensation
US20120105404A1 (en) * 2009-06-24 2012-05-03 Sharp Kabushiki Kaisha Display device with light sensors

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1054514A (de) * 1963-04-05 1900-01-01
JPH0616475B2 (ja) * 1987-04-03 1994-03-02 三菱電機株式会社 物品の製造システム及び物品の製造方法
JPS63306253A (ja) * 1987-06-04 1988-12-14 Akebono Brake Res & Dev Center Ltd 車輪加速スリップ制御装置
US5031111C1 (en) * 1988-08-08 2001-03-27 Trw Inc Automated circuit design method
US4954453A (en) * 1989-02-24 1990-09-04 At&T Bell Laboratories Method of producing an article comprising a multichip assembly
GB8918482D0 (en) * 1989-08-14 1989-09-20 Inmos Ltd Packaging semiconductor chips
US5047947A (en) * 1990-07-25 1991-09-10 Grumman Aerospace Corporation Method of modeling the assembly of products to increase production yield

Also Published As

Publication number Publication date
EP0622840A2 (de) 1994-11-02
EP0622840A3 (de) 1995-03-22
DE69425775T2 (de) 2001-02-01
EP0622840B1 (de) 2000-09-06
CA2120804C (en) 1997-12-09
AU667769B2 (en) 1996-04-04
JPH0821807B2 (ja) 1996-03-04
US5396433A (en) 1995-03-07
AU5933894A (en) 1994-10-13
TW252220B (de) 1995-07-21
CA2120804A1 (en) 1994-10-08
JPH06296106A (ja) 1994-10-21

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee