AU2013356152B2 - Cooling system for electronic device storing apparatus and cooling system for electronic device storing building - Google Patents

Cooling system for electronic device storing apparatus and cooling system for electronic device storing building Download PDF

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Publication number
AU2013356152B2
AU2013356152B2 AU2013356152A AU2013356152A AU2013356152B2 AU 2013356152 B2 AU2013356152 B2 AU 2013356152B2 AU 2013356152 A AU2013356152 A AU 2013356152A AU 2013356152 A AU2013356152 A AU 2013356152A AU 2013356152 B2 AU2013356152 B2 AU 2013356152B2
Authority
AU
Australia
Prior art keywords
refrigerant
rack
electronic device
cooling system
tank
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
AU2013356152A
Other languages
English (en)
Other versions
AU2013356152A1 (en
Inventor
Masaki Chiba
Kenichi Inaba
Arihiro Matsunaga
Hitoshi Sakamoto
Akira SHOUJIGUCHI
Minoru Yoshikawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Publication of AU2013356152A1 publication Critical patent/AU2013356152A1/en
Application granted granted Critical
Publication of AU2013356152B2 publication Critical patent/AU2013356152B2/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/208—Liquid cooling with phase change
    • H05K7/20818—Liquid cooling with phase change within cabinets for removing heat from server blades
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B23/00—Machines, plants or systems, with a single mode of operation not covered by groups F25B1/00 - F25B21/00, e.g. using selective radiation effect
    • F25B23/006—Machines, plants or systems, with a single mode of operation not covered by groups F25B1/00 - F25B21/00, e.g. using selective radiation effect boiling cooling systems
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/06—Control arrangements therefor
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20718—Forced ventilation of a gaseous coolant
    • H05K7/20736—Forced ventilation of a gaseous coolant within cabinets for removing heat from server blades
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/208—Liquid cooling with phase change
    • H05K7/20809—Liquid cooling with phase change within server blades for removing heat from heat source

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Theoretical Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Human Computer Interaction (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
AU2013356152A 2012-12-03 2013-12-03 Cooling system for electronic device storing apparatus and cooling system for electronic device storing building Expired - Fee Related AU2013356152B2 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2012264430 2012-12-03
JP2012-264430 2012-12-03
PCT/JP2013/007069 WO2014087635A1 (ja) 2012-12-03 2013-12-03 電子機器収納装置の冷却システム及び電子機器収納建屋の冷却システム

Publications (2)

Publication Number Publication Date
AU2013356152A1 AU2013356152A1 (en) 2015-05-28
AU2013356152B2 true AU2013356152B2 (en) 2017-07-27

Family

ID=50883077

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2013356152A Expired - Fee Related AU2013356152B2 (en) 2012-12-03 2013-12-03 Cooling system for electronic device storing apparatus and cooling system for electronic device storing building

Country Status (10)

Country Link
US (1) US9693485B2 (OSRAM)
EP (1) EP2927778A4 (OSRAM)
JP (1) JPWO2014087635A1 (OSRAM)
KR (1) KR20150091506A (OSRAM)
CN (1) CN104838329A (OSRAM)
AU (1) AU2013356152B2 (OSRAM)
BR (1) BR112015012796A2 (OSRAM)
IN (1) IN2015DN03895A (OSRAM)
SG (1) SG11201504298TA (OSRAM)
WO (1) WO2014087635A1 (OSRAM)

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AU2009282170B2 (en) 2008-08-11 2014-11-27 Green Revolution Cooling, Inc. Liquid submerged, horizontal computer server rack and systems and methods of cooling such a server rack
WO2016031186A1 (ja) * 2014-08-27 2016-03-03 日本電気株式会社 相変化冷却装置および相変化冷却方法
US9552025B2 (en) 2014-09-23 2017-01-24 Google Inc. Cooling electronic devices in a data center
JP5869646B1 (ja) * 2014-10-17 2016-02-24 Ｎｅｃプラットフォームズ株式会社 冷媒供給装置および冷却装置および冷却システム
CN105987468A (zh) * 2015-02-06 2016-10-05 深圳易信科技股份有限公司 机房应急制冷装置
JP6662374B2 (ja) * 2015-03-13 2020-03-11 日本電気株式会社 冷媒供給装置、それを用いた相変化冷却装置、および冷媒供給方法
US10448543B2 (en) * 2015-05-04 2019-10-15 Google Llc Cooling electronic devices in a data center
CN106304752A (zh) * 2015-05-19 2017-01-04 王玉富 一种适用于服务器分层配置的相变换热机柜
CN108141990B (zh) * 2015-10-21 2020-03-20 维谛公司 用于小型设备间的冷却系统及冷却小型设备间的方法
US10349561B2 (en) 2016-04-15 2019-07-09 Google Llc Cooling electronic devices in a data center
CN105910600A (zh) * 2016-06-14 2016-08-31 冯青元 微区域导航系统及其方法
CN105919301B (zh) * 2016-06-17 2018-02-06 胡江 基于物联网的储米柜及其控制方法
JP6304420B1 (ja) * 2017-03-23 2018-04-04 日本電気株式会社 冷媒分配装置、冷却装置及び冷媒分配装置における冷媒分配方法
JP6733630B2 (ja) * 2017-09-13 2020-08-05 株式会社デンソー サーモサイフォン
US11359865B2 (en) * 2018-07-23 2022-06-14 Green Revolution Cooling, Inc. Dual Cooling Tower Time Share Water Treatment System
KR101995512B1 (ko) * 2019-03-22 2019-07-02 엘제이테크 주식회사 산업용 기기의 냉각 장치
USD982145S1 (en) 2020-10-19 2023-03-28 Green Revolution Cooling, Inc. Cooling system enclosure
USD998770S1 (en) 2020-10-19 2023-09-12 Green Revolution Cooling, Inc. Cooling system enclosure
US12389566B2 (en) 2020-11-12 2025-08-12 Green Revolution Cooling, Inc. Multi-rack immersion cooling distribution system
US11812587B2 (en) * 2021-05-03 2023-11-07 Microsoft Technology Licensing, Llc Computer cooling
US11805624B2 (en) 2021-09-17 2023-10-31 Green Revolution Cooling, Inc. Coolant shroud
US11925946B2 (en) 2022-03-28 2024-03-12 Green Revolution Cooling, Inc. Fluid delivery wand
US12089368B2 (en) 2022-09-14 2024-09-10 Green Revolution Cooling, Inc. System and method for cooling computing devices using a primary circuit dielectric cooling fluid
US12414273B2 (en) 2023-01-25 2025-09-09 Green Revolution Cooling, Inc. Immersion cooling reservoir level control
USD1124280S1 (en) 2023-09-19 2026-04-28 Green Revolution Cooling, Inc Cooling system enclosure

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JPH05312361A (ja) * 1991-11-20 1993-11-22 Furukawa Electric Co Ltd:The 空調システム
US20110308262A1 (en) * 2010-06-18 2011-12-22 Hitachi Plant Technologies Ltd. Refrigerant circulation apparatus

Also Published As

Publication number Publication date
WO2014087635A1 (ja) 2014-06-12
KR20150091506A (ko) 2015-08-11
SG11201504298TA (en) 2015-07-30
IN2015DN03895A (OSRAM) 2015-10-02
EP2927778A4 (en) 2016-08-03
CN104838329A (zh) 2015-08-12
US9693485B2 (en) 2017-06-27
AU2013356152A1 (en) 2015-05-28
US20150305209A1 (en) 2015-10-22
JPWO2014087635A1 (ja) 2017-01-05
EP2927778A1 (en) 2015-10-07
BR112015012796A2 (pt) 2017-07-11

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Legal Events

Date Code Title Description
DA3 Amendments made section 104

Free format text: THE NATURE OF THE AMENDMENT IS: AMEND THE INVENTION TITLE TO READ COOLING SYSTEM FOR ELECTRONIC DEVICE STORING APPARATUS AND COOLING SYSTEM FOR ELECTRONIC DEVICE STORING BUILDING

MK25 Application lapsed reg. 22.2i(2) - failure to pay acceptance fee