AU2003226425A1 - Method of making transistors - Google Patents
Method of making transistorsInfo
- Publication number
- AU2003226425A1 AU2003226425A1 AU2003226425A AU2003226425A AU2003226425A1 AU 2003226425 A1 AU2003226425 A1 AU 2003226425A1 AU 2003226425 A AU2003226425 A AU 2003226425A AU 2003226425 A AU2003226425 A AU 2003226425A AU 2003226425 A1 AU2003226425 A1 AU 2003226425A1
- Authority
- AU
- Australia
- Prior art keywords
- aperture
- making transistors
- substrate
- features
- making
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/6729—Thin-film transistors [TFT] characterised by the electrodes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/01—Manufacture or treatment
- H10D30/021—Manufacture or treatment of FETs having insulated gates [IGFET]
- H10D30/031—Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having potential barriers
- H10K10/40—Organic transistors
- H10K10/46—Field-effect transistors, e.g. organic thin-film transistors [OTFT]
- H10K10/462—Insulated gate field-effect transistors [IGFETs]
- H10K10/466—Lateral bottom-gate IGFETs comprising only a single gate
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
- H10K71/164—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using vacuum deposition
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/18—Deposition of organic active material using non-liquid printing techniques, e.g. thermal transfer printing from a donor sheet
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/20—Changing the shape of the active layer in the devices, e.g. patterning
- H10K71/221—Changing the shape of the active layer in the devices, e.g. patterning by lift-off techniques
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/60—Forming conductive regions or layers, e.g. electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/10—Organic polymers or oligomers
- H10K85/111—Organic polymers or oligomers comprising aromatic, heteroaromatic, or aryl chains, e.g. polyaniline, polyphenylene or polyphenylene vinylene
- H10K85/113—Heteroaromatic compounds comprising sulfur or selene, e.g. polythiophene
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/10—Organic polymers or oligomers
- H10K85/111—Organic polymers or oligomers comprising aromatic, heteroaromatic, or aryl chains, e.g. polyaniline, polyphenylene or polyphenylene vinylene
- H10K85/113—Heteroaromatic compounds comprising sulfur or selene, e.g. polythiophene
- H10K85/1135—Polyethylene dioxythiophene [PEDOT]; Derivatives thereof
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/20—Carbon compounds, e.g. carbon nanotubes or fullerenes
- H10K85/211—Fullerenes, e.g. C60
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/30—Coordination compounds
- H10K85/311—Phthalocyanine
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/60—Organic compounds having low molecular weight
- H10K85/615—Polycyclic condensed aromatic hydrocarbons, e.g. anthracene
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
- H10P14/69—Inorganic materials
- H10P14/692—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses
- H10P14/6938—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses the material containing at least one metal element, e.g. metal oxides, metal oxynitrides or metal oxycarbides
- H10P14/69398—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses the material containing at least one metal element, e.g. metal oxides, metal oxynitrides or metal oxycarbides the material having a perovskite structure, e.g. BaTiO3
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S438/00—Semiconductor device manufacturing: process
- Y10S438/942—Masking
- Y10S438/943—Movable
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S438/00—Semiconductor device manufacturing: process
- Y10S438/942—Masking
- Y10S438/944—Shadow
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Nanotechnology (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Theoretical Computer Science (AREA)
- Crystallography & Structural Chemistry (AREA)
- Mathematical Physics (AREA)
- Physics & Mathematics (AREA)
- Thin Film Transistor (AREA)
- Electrodes Of Semiconductors (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Junction Field-Effect Transistors (AREA)
- Control Of Motors That Do Not Use Commutators (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/137,562 US6667215B2 (en) | 2002-05-02 | 2002-05-02 | Method of making transistors |
| US10/137,562 | 2002-05-02 | ||
| PCT/US2003/012022 WO2003094219A1 (en) | 2002-05-02 | 2003-04-17 | Method of making transistors |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| AU2003226425A1 true AU2003226425A1 (en) | 2003-11-17 |
Family
ID=29269106
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AU2003226425A Abandoned AU2003226425A1 (en) | 2002-05-02 | 2003-04-17 | Method of making transistors |
Country Status (9)
| Country | Link |
|---|---|
| US (2) | US6667215B2 (https=) |
| EP (1) | EP1502295B1 (https=) |
| JP (1) | JP4426438B2 (https=) |
| KR (1) | KR20040105251A (https=) |
| CN (1) | CN100372082C (https=) |
| AT (1) | ATE442673T1 (https=) |
| AU (1) | AU2003226425A1 (https=) |
| DE (1) | DE60329177D1 (https=) |
| WO (1) | WO2003094219A1 (https=) |
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| US6821348B2 (en) * | 2002-02-14 | 2004-11-23 | 3M Innovative Properties Company | In-line deposition processes for circuit fabrication |
| US6897164B2 (en) * | 2002-02-14 | 2005-05-24 | 3M Innovative Properties Company | Aperture masks for circuit fabrication |
| US20030151118A1 (en) * | 2002-02-14 | 2003-08-14 | 3M Innovative Properties Company | Aperture masks for circuit fabrication |
| EP1357602A1 (de) * | 2002-03-19 | 2003-10-29 | Scheuten Glasgroep | Selbstjustierende Serienverschaltung von Dünnschichten und Verfahren zur Herstellung |
| PT1355359E (pt) * | 2002-03-19 | 2007-07-13 | Scheuten Glasgroep Bv | Conexão em série de auto-ajuste de camadas finas e grossas e processo para o fabrico. |
| DE10212878B4 (de) * | 2002-03-22 | 2007-11-29 | Qimonda Ag | Halbleiterschaltungsanordnung und Halbleiterspeichereinrichtung |
| US6784017B2 (en) * | 2002-08-12 | 2004-08-31 | Precision Dynamics Corporation | Method of creating a high performance organic semiconductor device |
| JP2004319964A (ja) * | 2003-03-28 | 2004-11-11 | Mitsubishi Electric Corp | 半導体装置及びその製造方法 |
| US7556982B2 (en) * | 2003-08-07 | 2009-07-07 | Uchicago Argonne, Llc | Method to grow pure nanocrystalline diamond films at low temperatures and high deposition rates |
| US7459839B2 (en) * | 2003-12-05 | 2008-12-02 | Zhidan Li Tolt | Low voltage electron source with self aligned gate apertures, and luminous display using the electron source |
| US7078937B2 (en) * | 2003-12-17 | 2006-07-18 | 3M Innovative Properties Company | Logic circuitry powered by partially rectified ac waveform |
| US7772063B2 (en) * | 2004-08-11 | 2010-08-10 | Identifi Technologies, Inc. | Reduced-step CMOS processes for low-cost radio frequency identification devices |
| KR101090250B1 (ko) * | 2004-10-15 | 2011-12-06 | 삼성전자주식회사 | 유기 반도체를 이용한 박막 트랜지스터 표시판 및 그 제조방법 |
| KR101186966B1 (ko) * | 2004-11-09 | 2012-10-02 | 코닌클리케 필립스 일렉트로닉스 엔.브이. | 유기 트랜지스터를 제조하기 위한 자체-정렬 공정 |
| US20060105550A1 (en) * | 2004-11-17 | 2006-05-18 | Manish Sharma | Method of depositing material on a substrate for a device |
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| US20060128165A1 (en) * | 2004-12-13 | 2006-06-15 | 3M Innovative Properties Company | Method for patterning surface modification |
| JP4938984B2 (ja) * | 2005-02-02 | 2012-05-23 | 独立行政法人理化学研究所 | トップコンタクト型電界効果トランジスタの製造方法およびトップコンタクト型電界効果トランジスタ |
| KR20060104092A (ko) * | 2005-03-29 | 2006-10-09 | 삼성전자주식회사 | 유기 박막 트랜지스터 표시판 및 그 제조 방법 |
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| EP1727219B1 (en) | 2005-05-25 | 2014-05-07 | Samsung SDI Germany GmbH | Organic thin film transistor and method for producing the same |
| US7615501B2 (en) * | 2005-08-11 | 2009-11-10 | 3M Innovative Properties Company | Method for making a thin film layer |
| JP5078246B2 (ja) * | 2005-09-29 | 2012-11-21 | 株式会社半導体エネルギー研究所 | 半導体装置、及び半導体装置の作製方法 |
| US8414962B2 (en) | 2005-10-28 | 2013-04-09 | The Penn State Research Foundation | Microcontact printed thin film capacitors |
| JP4722679B2 (ja) * | 2005-11-11 | 2011-07-13 | 日本電信電話株式会社 | 電極の製造方法及び素子の製造方法 |
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| US7960708B2 (en) * | 2007-03-13 | 2011-06-14 | University Of Houston | Device and method for manufacturing a particulate filter with regularly spaced micropores |
| US20100096621A1 (en) * | 2007-03-23 | 2010-04-22 | Takashi Chuman | Organic transistor and manufacture method thereof |
| EP2183781B1 (en) * | 2007-06-28 | 2012-10-24 | 3M Innovative Properties Company | Method for forming gate structures |
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| US9625878B2 (en) | 2009-03-10 | 2017-04-18 | Drexel University | Dynamic time multiplexing fabrication of holographic polymer dispersed liquid crystals for increased wavelength sensitivity |
| EP2418684A4 (en) * | 2009-04-10 | 2016-12-14 | Mitsubishi Chem Corp | FIELD EFFECT TRANSISTOR, METHOD FOR ITS MANUFACTURE AND ELECTRONIC DEVICE THEREFOR |
| US9752932B2 (en) | 2010-03-10 | 2017-09-05 | Drexel University | Tunable electro-optic filter stack |
| WO2012086609A1 (ja) * | 2010-12-22 | 2012-06-28 | 三菱化学株式会社 | 電界効果トランジスタ、その製造方法及びそれを有する電子デバイス |
| US10008443B2 (en) | 2012-04-30 | 2018-06-26 | California Institute Of Technology | Implant device |
| US9144490B2 (en) * | 2012-04-30 | 2015-09-29 | California Institute Of Technology | High-lead count implant device and method of making the same |
| US9781842B2 (en) | 2013-08-05 | 2017-10-03 | California Institute Of Technology | Long-term packaging for the protection of implant electronics |
| US10274819B2 (en) * | 2015-02-05 | 2019-04-30 | Taiwan Semiconductor Manufacturing Company, Ltd. | EUV pellicle fabrication methods and structures thereof |
| EP3340929A4 (en) * | 2015-08-28 | 2019-04-10 | California Institute of Technology | IMPLANT DEVICE AND METHOD FOR THE PRODUCTION THEREOF |
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| GB9817745D0 (en) | 1998-08-15 | 1998-10-14 | Philips Electronics Nv | Manufacture of electronic devices comprising thin-film circuit elements |
| JP2000132762A (ja) | 1998-10-27 | 2000-05-12 | Matsushita Electric Works Ltd | 受光量表示ユニット付き光電式分離型感知器及び波形確認端子ユニット付き光電式分離型感知器 |
| US6384529B2 (en) | 1998-11-18 | 2002-05-07 | Eastman Kodak Company | Full color active matrix organic electroluminescent display panel having an integrated shadow mask |
| WO2001008242A1 (en) | 1999-07-21 | 2001-02-01 | E Ink Corporation | Preferred methods for producing electrical circuit elements used to control an electronic display |
| JP4053209B2 (ja) | 2000-05-01 | 2008-02-27 | 三星エスディアイ株式会社 | 有機elディスプレイの製造方法 |
| JP2002050764A (ja) * | 2000-08-02 | 2002-02-15 | Matsushita Electric Ind Co Ltd | 薄膜トランジスタ、アレイ基板、液晶表示装置、有機el表示装置およびその製造方法 |
| US6791258B2 (en) | 2001-06-21 | 2004-09-14 | 3M Innovative Properties Company | Organic light emitting full color display panel |
| US20030097010A1 (en) | 2001-09-27 | 2003-05-22 | Vogel Dennis E. | Process for preparing pentacene derivatives |
| US6864396B2 (en) | 2001-09-27 | 2005-03-08 | 3M Innovative Properties Company | Substituted pentacene semiconductors |
| US20030151118A1 (en) | 2002-02-14 | 2003-08-14 | 3M Innovative Properties Company | Aperture masks for circuit fabrication |
| US6821348B2 (en) | 2002-02-14 | 2004-11-23 | 3M Innovative Properties Company | In-line deposition processes for circuit fabrication |
| US6897164B2 (en) | 2002-02-14 | 2005-05-24 | 3M Innovative Properties Company | Aperture masks for circuit fabrication |
-
2002
- 2002-05-02 US US10/137,562 patent/US6667215B2/en not_active Expired - Fee Related
-
2003
- 2003-04-17 CN CNB038098725A patent/CN100372082C/zh not_active Expired - Fee Related
- 2003-04-17 JP JP2004502343A patent/JP4426438B2/ja not_active Expired - Fee Related
- 2003-04-17 WO PCT/US2003/012022 patent/WO2003094219A1/en not_active Ceased
- 2003-04-17 AT AT03747596T patent/ATE442673T1/de not_active IP Right Cessation
- 2003-04-17 KR KR10-2004-7017661A patent/KR20040105251A/ko not_active Withdrawn
- 2003-04-17 EP EP03747596A patent/EP1502295B1/en not_active Expired - Lifetime
- 2003-04-17 AU AU2003226425A patent/AU2003226425A1/en not_active Abandoned
- 2003-04-17 DE DE60329177T patent/DE60329177D1/de not_active Expired - Lifetime
- 2003-11-21 US US10/719,209 patent/US6806520B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| DE60329177D1 (de) | 2009-10-22 |
| US6667215B2 (en) | 2003-12-23 |
| EP1502295B1 (en) | 2009-09-09 |
| ATE442673T1 (de) | 2009-09-15 |
| CN1650409A (zh) | 2005-08-03 |
| KR20040105251A (ko) | 2004-12-14 |
| CN100372082C (zh) | 2008-02-27 |
| US6806520B2 (en) | 2004-10-19 |
| US20040106262A1 (en) | 2004-06-03 |
| WO2003094219A1 (en) | 2003-11-13 |
| JP4426438B2 (ja) | 2010-03-03 |
| EP1502295A1 (en) | 2005-02-02 |
| JP2005531131A (ja) | 2005-10-13 |
| US20030207505A1 (en) | 2003-11-06 |
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| Date | Code | Title | Description |
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| MK6 | Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase |