AU2002210947A1 - Circuit board unit and electronic equipment - Google Patents

Circuit board unit and electronic equipment

Info

Publication number
AU2002210947A1
AU2002210947A1 AU2002210947A AU1094702A AU2002210947A1 AU 2002210947 A1 AU2002210947 A1 AU 2002210947A1 AU 2002210947 A AU2002210947 A AU 2002210947A AU 1094702 A AU1094702 A AU 1094702A AU 2002210947 A1 AU2002210947 A1 AU 2002210947A1
Authority
AU
Australia
Prior art keywords
circuit board
electronic equipment
board unit
unit
electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2002210947A
Other languages
English (en)
Inventor
Kouji Hirata
Katsushi Itoh
Ryouichi Kubota
Yasuhiro Ootori
Chiyoshi Sasaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Interactive Entertainment Inc
Original Assignee
Sony Computer Entertainment Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Computer Entertainment Inc filed Critical Sony Computer Entertainment Inc
Publication of AU2002210947A1 publication Critical patent/AU2002210947A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/066—Heatsink mounted on the surface of the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2036—Permanent spacer or stand-off in a printed circuit or printed circuit assembly
AU2002210947A 2000-10-25 2001-10-25 Circuit board unit and electronic equipment Abandoned AU2002210947A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2000-325992 2000-10-25
JP2000325992A JP2002134968A (ja) 2000-10-25 2000-10-25 回路基板ユニット、電子機器
PCT/JP2001/009380 WO2002035900A1 (fr) 2000-10-25 2001-10-25 Ensemble plaquette de circuit imprime et equipement electronique

Publications (1)

Publication Number Publication Date
AU2002210947A1 true AU2002210947A1 (en) 2002-05-06

Family

ID=18803267

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2002210947A Abandoned AU2002210947A1 (en) 2000-10-25 2001-10-25 Circuit board unit and electronic equipment

Country Status (7)

Country Link
US (1) US7254035B2 (de)
EP (1) EP1330149B1 (de)
JP (1) JP2002134968A (de)
AU (1) AU2002210947A1 (de)
DE (1) DE60138125D1 (de)
TW (1) TW507521B (de)
WO (1) WO2002035900A1 (de)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1315361C (zh) * 2003-06-09 2007-05-09 三星电子株式会社 显示器及其控制方法
US7524206B2 (en) * 2005-03-23 2009-04-28 Pulse Engineering, Inc. Power-enabled connector assembly with heat dissipation apparatus and method of manufacturing
JP2007286785A (ja) * 2006-04-14 2007-11-01 Fujitsu Ltd 電子機器および冷却部品
JP4699967B2 (ja) * 2006-09-21 2011-06-15 株式会社ソニー・コンピュータエンタテインメント 情報処理装置
US8144458B2 (en) * 2007-06-13 2012-03-27 Hewlett-Packard Development Company, L.P. Component layout in an enclosure
TWI418292B (zh) * 2010-07-22 2013-12-01 Via Tech Inc 電子設備
CA2809725A1 (en) * 2013-03-11 2014-09-11 Sureshchandra B. Patel Multiprocessor computing apparatus with wireless interconnect for communication among its components
JP6607053B2 (ja) * 2016-01-20 2019-11-20 Ｔｄｋ株式会社 電源装置
JP6538607B2 (ja) 2016-03-31 2019-07-03 株式会社ソニー・インタラクティブエンタテインメント 電子機器
EP3507721B1 (de) 2016-09-02 2022-11-23 FutureVault Inc. Echtzeitdokumentenfiltrierungssysteme und -verfahren
SG11201901779PA (en) 2016-09-02 2019-03-28 Futurevault Inc Systems and methods for sharing documents
EP3507722A4 (de) 2016-09-02 2020-03-18 FutureVault Inc. Verfahren und system zur automatisierten dokumentenablage und -verarbeitung
JP2018113406A (ja) 2017-01-13 2018-07-19 アルパイン株式会社 電子機器
JP6998115B2 (ja) * 2017-02-27 2022-01-18 川崎重工業株式会社 ロボットコントローラ
WO2019030809A1 (ja) * 2017-08-08 2019-02-14 Ｎｅｃプラットフォームズ株式会社 放熱構造体
JP2019098411A (ja) * 2017-11-28 2019-06-24 京セラインダストリアルツールズ株式会社 電動工具
JP6783349B2 (ja) * 2019-06-06 2020-11-11 株式会社ソニー・インタラクティブエンタテインメント 電子機器
EP4149224A1 (de) * 2021-09-09 2023-03-15 Stryker European Operations Limited Gehäusezusammenbau zur aufnahme von leiterplatten
US20230152046A1 (en) * 2021-11-18 2023-05-18 Quanta Computer Inc. Die-cast fin with opening and cover

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5810380A (ja) 1981-07-13 1983-01-20 株式会社日立製作所 コネクタ−
JPS5967992A (ja) 1982-10-09 1984-04-17 ブラザー工業株式会社 ミシンの加工布案内装置
US4599680A (en) 1983-09-26 1986-07-08 Southwest Research Institute Packaging arrangement for spacecraft computer
JPS6271300A (ja) 1985-09-25 1987-04-01 日本電信電話株式会社 電子装置の放熱構造
JPS6328098A (ja) 1986-07-22 1988-02-05 富士通株式会社 電子回路ユニツトの放熱構造
US4849858A (en) 1986-10-20 1989-07-18 Westinghouse Electric Corp. Composite heat transfer means
JP2592673B2 (ja) 1988-02-10 1997-03-19 東京エレクトロン株式会社 塗布装置
EP0340959B1 (de) 1988-05-06 1994-12-28 Digital Equipment Corporation Schaltungschipspackung zum Schützen gegen elektromagnetische Interferenzen, elektrostatische Entladungen und thermische und mechanische Spannungen
US5218516A (en) * 1991-10-31 1993-06-08 Northern Telecom Limited Electronic module
JPH06302728A (ja) 1993-04-12 1994-10-28 Oki Electric Ind Co Ltd セラミック多層基板上におけるｌｓｉ放熱構造
US6088227A (en) 1995-06-07 2000-07-11 Smiths Industries Aerospace And Defense Systems, Inc. Heat sink with integrated buss bar
JPH0945827A (ja) 1995-08-02 1997-02-14 Hitachi Ltd 半導体装置
JPH0964582A (ja) 1995-08-21 1997-03-07 Matsushita Electric Ind Co Ltd シールドケース構造
US5801924A (en) 1996-02-22 1998-09-01 Cray Research, Inc. Method and apparatus for cooling daughter card modules
JP3776169B2 (ja) 1996-06-13 2006-05-17 任天堂株式会社 電子機器の放熱構造
US6037659A (en) 1997-04-28 2000-03-14 Hewlett-Packard Company Composite thermal interface pad
JPH1174667A (ja) 1997-06-16 1999-03-16 Nitto Denko Corp 放熱シート
JPH11112174A (ja) 1997-09-30 1999-04-23 Toshiba Corp 回路部品の放熱手段を有する回路モジュールおよびこの回路モジュールを搭載した携帯形情報機器
JPH11289142A (ja) * 1998-04-01 1999-10-19 Toshiba Corp 回路モジュール実装構造およびこの回路モジュールを有する電子機器
JP2000196269A (ja) 1998-12-25 2000-07-14 Toshiba Corp 回路モジュ―ル
US6411522B1 (en) * 1999-04-01 2002-06-25 Western Digital Ventures, Inc. Integrated computer module with EMI shielding plate
JP3273505B2 (ja) * 1999-08-18 2002-04-08 古河電気工業株式会社 放熱フィンを備えたヒートシンクおよび放熱フィンの固定方法
JP4388174B2 (ja) * 1999-09-06 2009-12-24 株式会社ソニー・コンピュータエンタテインメント 電子機器

Also Published As

Publication number Publication date
EP1330149A4 (de) 2006-04-26
JP2002134968A (ja) 2002-05-10
US20020089825A1 (en) 2002-07-11
WO2002035900A1 (fr) 2002-05-02
DE60138125D1 (de) 2009-05-07
US7254035B2 (en) 2007-08-07
EP1330149A1 (de) 2003-07-23
EP1330149B1 (de) 2009-03-25
TW507521B (en) 2002-10-21

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