AU2001283048A1 - Process for improving polymer to metal adhesion - Google Patents

Process for improving polymer to metal adhesion

Info

Publication number
AU2001283048A1
AU2001283048A1 AU2001283048A AU8304801A AU2001283048A1 AU 2001283048 A1 AU2001283048 A1 AU 2001283048A1 AU 2001283048 A AU2001283048 A AU 2001283048A AU 8304801 A AU8304801 A AU 8304801A AU 2001283048 A1 AU2001283048 A1 AU 2001283048A1
Authority
AU
Australia
Prior art keywords
metal adhesion
improving polymer
polymer
improving
adhesion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001283048A
Other languages
English (en)
Inventor
Donald Ferrier
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
MacDermid Inc
Original Assignee
MacDermid Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by MacDermid Inc filed Critical MacDermid Inc
Publication of AU2001283048A1 publication Critical patent/AU2001283048A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/383—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by microetching
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/02—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving pretreatment of the surfaces to be joined
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
    • C23C22/05—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions
    • C23C22/06—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6
    • C23C22/40—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6 containing molybdates, tungstates or vanadates
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
    • C23C22/05—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions
    • C23C22/06—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6
    • C23C22/48—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6 not containing phosphates, hexavalent chromium compounds, fluorides or complex fluorides, molybdates, tungstates, vanadates or oxalates
    • C23C22/52—Treatment of copper or alloys based thereon
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • C23F1/16—Acidic compositions
    • C23F1/18—Acidic compositions for etching copper or alloys thereof
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2400/00—Presence of inorganic and organic materials
    • C09J2400/10—Presence of inorganic materials
    • C09J2400/16—Metal
    • C09J2400/163—Metal in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2400/00—Presence of inorganic and organic materials
    • C09J2400/10—Presence of inorganic materials
    • C09J2400/16—Metal
    • C09J2400/166—Metal in the pretreated surface to be joined
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2400/00—Presence of inorganic and organic materials
    • C09J2400/20—Presence of organic materials
    • C09J2400/22—Presence of unspecified polymer
    • C09J2400/226—Presence of unspecified polymer in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2400/00—Presence of inorganic and organic materials
    • C09J2400/20—Presence of organic materials
    • C09J2400/22—Presence of unspecified polymer
    • C09J2400/228—Presence of unspecified polymer in the pretreated surface to be joined

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Chemical Treatment Of Metals (AREA)
  • Preventing Corrosion Or Incrustation Of Metals (AREA)
  • Laminated Bodies (AREA)
AU2001283048A 2000-08-22 2001-07-31 Process for improving polymer to metal adhesion Abandoned AU2001283048A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/643,813 US6554948B1 (en) 2000-08-22 2000-08-22 Process for improving the adhesion of polymeric materials to metal surfaces
US09643813 2000-08-22
PCT/US2001/024005 WO2002016524A1 (en) 2000-08-22 2001-07-31 Process for improving polymer to metal adhesion

Publications (1)

Publication Number Publication Date
AU2001283048A1 true AU2001283048A1 (en) 2002-03-04

Family

ID=24582325

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001283048A Abandoned AU2001283048A1 (en) 2000-08-22 2001-07-31 Process for improving polymer to metal adhesion

Country Status (10)

Country Link
US (1) US6554948B1 (de)
EP (1) EP1311644B1 (de)
JP (1) JP4295504B2 (de)
CN (1) CN100343356C (de)
AU (1) AU2001283048A1 (de)
CA (1) CA2420540A1 (de)
DE (1) DE60115253T2 (de)
ES (1) ES2252274T3 (de)
TW (1) TW538080B (de)
WO (1) WO2002016524A1 (de)

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* Cited by examiner, † Cited by third party
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US6141870A (en) 1997-08-04 2000-11-07 Peter K. Trzyna Method for making electrical device
US6461415B1 (en) * 2000-08-23 2002-10-08 Applied Thin Films, Inc. High temperature amorphous composition based on aluminum phosphate
US6645639B1 (en) * 2000-10-13 2003-11-11 Applied Thin Films, Inc. Epitaxial oxide films via nitride conversion
US6573209B1 (en) * 2000-10-13 2003-06-03 Applied Thin Films, Inc. Zirconium nitride and yttrium nitride solid solution composition
DE10114980A1 (de) * 2001-03-27 2002-10-17 Henkel Kgaa Haftvermittler für Lacke und Klebstoffe auf Metallen
EP1539376A4 (de) * 2002-08-14 2011-04-06 Applied Thin Films Inc Aluminiumphosphatverbindungen, -zusammensetzungen, -materialien und verwandte verbundstoffe
US8021758B2 (en) * 2002-12-23 2011-09-20 Applied Thin Films, Inc. Aluminum phosphate compounds, coatings, related composites and applications
US7232478B2 (en) * 2003-07-14 2007-06-19 Enthone Inc. Adhesion promotion in printed circuit boards
US20060065365A1 (en) * 2004-09-30 2006-03-30 Ferrier Donald R Melamine-formaldehyde post-dip composition for improving adhesion of metal to polymer
US20120168075A1 (en) † 2008-03-21 2012-07-05 Enthone Inc. Adhesion promotion of metal to laminate with multi-functional molecular system
US8518281B2 (en) * 2008-06-03 2013-08-27 Kesheng Feng Acid-resistance promoting composition
US8308893B2 (en) * 2010-02-01 2012-11-13 Ming De Wang Nano-oxide process for bonding copper/copper alloy and resin
CN106879193A (zh) 2010-07-06 2017-06-20 埃托特克德国有限公司 处理金属表面的方法
KR101730983B1 (ko) * 2010-07-06 2017-04-27 나믹스 코포레이션 인쇄회로기판에서 사용하기 위한 유기 기판에의 접착을 향상시키는 구리 표면의 처리 방법
US8524540B2 (en) * 2011-02-01 2013-09-03 Nilesh Kapadia Adhesion promoting composition for metal leadframes
CN111867275B (zh) * 2020-07-31 2021-08-24 国网河南省电力公司西峡县供电公司 一种提高印刷电路板层间结合力的棕化方法
CA3110357A1 (en) * 2021-02-25 2022-08-25 Sixring Inc. Modified sulfuric acid and uses thereof

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JPS5221460B1 (de) 1971-04-26 1977-06-10
SE400575B (sv) 1974-12-13 1978-04-03 Nordnero Ab Bad for betning av koppar och dess legeringar
DE2557269A1 (de) 1975-12-19 1977-06-30 Licentia Gmbh Verfahren zum aetzen von kupfer oder kupferlegierungen
JPS52150104A (en) 1976-06-07 1977-12-13 Fuji Photo Film Co Ltd Photoosensitive lithographic press plate material
CA1146851A (en) * 1978-05-01 1983-05-24 Donald F. Greene Hydrogen peroxide disinfecting and sterilizing compositions
JPS57116775A (en) 1981-01-14 1982-07-20 Toshiba Corp Etching solution for nickel
US4409037A (en) 1982-04-05 1983-10-11 Macdermid Incorporated Adhesion promoter for printed circuits
US4844981A (en) 1982-04-05 1989-07-04 Macdermid, Incorporated Adhesion promoter for printed circuits
JPS6113688A (ja) 1984-06-28 1986-01-21 福田金属箔粉工業株式会社 印刷回路用銅箔およびその製造方法
JPS61176192A (ja) 1985-01-31 1986-08-07 株式会社日立製作所 銅と樹脂との接着方法
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US6020029A (en) * 1997-06-12 2000-02-01 Macdermid, Incorporated Process for treating metal surfaces
US5869130A (en) 1997-06-12 1999-02-09 Mac Dermid, Incorporated Process for improving the adhesion of polymeric materials to metal surfaces
US6054061A (en) * 1997-12-11 2000-04-25 Shipley Company, L.L.C. Composition for circuit board manufacture
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Also Published As

Publication number Publication date
WO2002016524A1 (en) 2002-02-28
CN1447846A (zh) 2003-10-08
EP1311644A4 (de) 2004-09-01
DE60115253D1 (de) 2005-12-29
TW538080B (en) 2003-06-21
US6554948B1 (en) 2003-04-29
ES2252274T3 (es) 2006-05-16
EP1311644B1 (de) 2005-11-23
DE60115253T2 (de) 2006-08-17
CN100343356C (zh) 2007-10-17
CA2420540A1 (en) 2002-02-28
JP2004517974A (ja) 2004-06-17
EP1311644A1 (de) 2003-05-21
JP4295504B2 (ja) 2009-07-15

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