AU2001273766A1 - Device and method for cleaning articles used in the production of semiconductor components - Google Patents

Device and method for cleaning articles used in the production of semiconductor components

Info

Publication number
AU2001273766A1
AU2001273766A1 AU2001273766A AU7376601A AU2001273766A1 AU 2001273766 A1 AU2001273766 A1 AU 2001273766A1 AU 2001273766 A AU2001273766 A AU 2001273766A AU 7376601 A AU7376601 A AU 7376601A AU 2001273766 A1 AU2001273766 A1 AU 2001273766A1
Authority
AU
Australia
Prior art keywords
production
semiconductor components
articles used
cleaning articles
cleaning
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001273766A
Other languages
English (en)
Inventor
Jakob Blattner
Federici Rudy
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Brooks PRI Automation Switzerland GmbH
Original Assignee
Tec Sem AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tec Sem AG filed Critical Tec Sem AG
Publication of AU2001273766A1 publication Critical patent/AU2001273766A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
    • G03F1/82—Auxiliary processes, e.g. cleaning or inspecting
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
    • G03F7/70741—Handling masks outside exposure position, e.g. reticle libraries

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Library & Information Science (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
AU2001273766A 2000-06-27 2001-06-26 Device and method for cleaning articles used in the production of semiconductor components Abandoned AU2001273766A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
CH12702000 2000-06-27
CH1270/00 2000-06-27
PCT/CH2001/000402 WO2002001292A1 (de) 2000-06-27 2001-06-26 Vorrichtung und verfahren zur reinigung von in der produktion von halbleiterelementen benutzten objekten

Publications (1)

Publication Number Publication Date
AU2001273766A1 true AU2001273766A1 (en) 2002-01-08

Family

ID=4565148

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001273766A Abandoned AU2001273766A1 (en) 2000-06-27 2001-06-26 Device and method for cleaning articles used in the production of semiconductor components

Country Status (6)

Country Link
US (1) US7047984B2 (ko)
EP (1) EP1297384B1 (ko)
KR (1) KR100814179B1 (ko)
AU (1) AU2001273766A1 (ko)
DE (1) DE50111378D1 (ko)
WO (1) WO2002001292A1 (ko)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7037382B2 (en) * 1996-12-20 2006-05-02 Z Corporation Three-dimensional printer
US6007318A (en) 1996-12-20 1999-12-28 Z Corporation Method and apparatus for prototyping a three-dimensional object
ES2274046T5 (es) * 2002-05-31 2010-03-11 Trt Oil-Off Gmbh Instalacion de limpieza en seco para piezas de trabajo.
CH695872A5 (de) * 2002-07-29 2006-09-29 Brooks Pri Automation Switzerl Reticle-Handhabungsvorrichtung.
CH696188A5 (de) * 2002-07-29 2007-02-15 Brooks Pri Automation Switzerl Detektions- und Reinigungsvorrichtung in einer Handhabungsvorrichtung für Photomasken.
JP4062437B2 (ja) * 2003-01-21 2008-03-19 シャープ株式会社 基板洗浄装置および基板処理施設
JP2005034782A (ja) * 2003-07-17 2005-02-10 Sony Corp 洗浄装置及び洗浄方法
TWI258642B (en) * 2004-01-30 2006-07-21 Powerchip Semiconductor Corp Tool and process for removing particles from reticle
US7396418B2 (en) * 2004-04-29 2008-07-08 Powerchip Semiconductor Corp. Process for removing particles from reticle
JP2006007012A (ja) * 2004-06-22 2006-01-12 Koganei Corp 除電除塵装置
US20080155852A1 (en) * 2006-12-29 2008-07-03 Olgado Donald J K Multiple substrate vapor drying systems and methods
EP2281921A1 (en) * 2009-07-30 2011-02-09 Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO Apparatus and method for atomic layer deposition.
TW201136674A (en) * 2010-04-21 2011-11-01 Hon Hai Prec Ind Co Ltd Dust elimination device
DE102011052325A1 (de) * 2011-08-01 2013-02-07 Roth & Rau Ag Reinigungsmodul und Reinigungsverfahren für Substrate und/oder Substratträger
US9700672B2 (en) 2011-09-21 2017-07-11 Bayer Healthcare Llc Continuous multi-fluid pump device, drive and actuating system and method
JP5919786B2 (ja) * 2011-12-12 2016-05-18 株式会社リコー 乾式クリーニング筐体及び乾式クリーニング装置
TW201334880A (zh) * 2012-02-29 2013-09-01 Hon Hai Prec Ind Co Ltd Led燈條除塵系統以及具有該除塵系統的機台
TW201436891A (zh) * 2013-03-25 2014-10-01 Hon Hai Prec Ind Co Ltd 空氣離子清洗裝置
KR102528289B1 (ko) 2015-01-09 2023-05-03 바이엘 헬쓰케어 엘엘씨 다회 사용 1회용 세트를 갖는 다중 유체 전달 시스템 및 그 특징부
TWM539571U (zh) * 2015-07-27 2017-04-11 應用材料股份有限公司 基板材升降杆致動器
FR3039437B1 (fr) * 2015-07-30 2021-12-24 Michelin & Cie Procede de nettoyage a sec de plateaux de fabrication additive
KR102120704B1 (ko) * 2018-09-28 2020-06-10 무진전자 주식회사 에어 커튼을 이용한 케미컬 퓸 제거장치
JP7261000B2 (ja) * 2018-12-03 2023-04-19 キヤノン株式会社 容器、処理装置、異物除去方法、および物品の製造方法
US11520246B1 (en) * 2021-08-30 2022-12-06 Taiwan Semiconductor Manufacturing Company, Ltd. Highly efficient automatic particle cleaner method for EUV systems

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Publication number Priority date Publication date Assignee Title
DE875921C (de) * 1950-06-23 1953-05-07 Karl Echterbecker Nasenfilter
JPH0750271B2 (ja) * 1986-01-27 1995-05-31 富士通株式会社 液晶表示板のラビング方法
JPH01241821A (ja) * 1988-03-24 1989-09-26 Toshiba Corp 露光装置
DE3820931C2 (de) * 1988-06-21 1994-05-26 Peter Kist Verfahren zur elektrostatischen Oberflächenentladung und Entstaubung von Werkstücken und Vorrichtung zur Durchführung des Verfahrens
DE4237767A1 (de) * 1992-11-09 1994-05-11 Siemens Ag Verfahren und Vorrichtung zum Reinigen von Bauteiloberflächen, insbesondere von mit Partikeln kontaminierten hochreinen Oberflächen von für die Elektronikfertigung bestimmten Bauteilen, wie Masken, Wafern od. dgl.
WO1995007152A1 (en) * 1993-09-08 1995-03-16 Uvtech Systems, Inc. Surface processing
US5584938A (en) * 1993-12-10 1996-12-17 Texas Instruments Incorporated Electrostatic particle removal and characterization
JP3234091B2 (ja) * 1994-03-10 2001-12-04 株式会社日立製作所 表面処理装置
US5979475A (en) * 1994-04-28 1999-11-09 Hitachi, Ltd. Specimen holding method and fluid treatment method of specimen surface and systems therefor
US5967156A (en) * 1994-11-07 1999-10-19 Krytek Corporation Processing a surface
US6395102B1 (en) * 1997-08-25 2002-05-28 Texas Instruments Incorporated Method and apparatus for in-situ reticle cleaning at photolithography tool
KR100300030B1 (ko) 1997-12-30 2001-10-19 김영환 노광장비의레티클세정장치
US5916374A (en) 1998-02-09 1999-06-29 International Business Machines Corporation Optimized in-line mask cleaning system
US6305097B1 (en) * 2000-06-29 2001-10-23 Texas Instruments Incorporated Apparatus for in-situ reticle cleaning at photolithography tool
US6543078B1 (en) * 2000-07-24 2003-04-08 Eastman Kodak Company Apparatus and method for cleaning object having generally irregular surface features
US6656017B2 (en) * 2001-04-24 2003-12-02 David P. Jackson Method and apparatus for creating an open cell micro-environment for treating a substrate with an impingement spray

Also Published As

Publication number Publication date
EP1297384B1 (de) 2006-11-02
EP1297384A1 (de) 2003-04-02
KR100814179B1 (ko) 2008-03-14
US7047984B2 (en) 2006-05-23
WO2002001292A1 (de) 2002-01-03
KR20030019462A (ko) 2003-03-06
US20030159712A1 (en) 2003-08-28
DE50111378D1 (de) 2006-12-14

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