AU2001259504A1 - Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece - Google Patents

Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece

Info

Publication number
AU2001259504A1
AU2001259504A1 AU2001259504A AU5950401A AU2001259504A1 AU 2001259504 A1 AU2001259504 A1 AU 2001259504A1 AU 2001259504 A AU2001259504 A AU 2001259504A AU 5950401 A AU5950401 A AU 5950401A AU 2001259504 A1 AU2001259504 A1 AU 2001259504A1
Authority
AU
Australia
Prior art keywords
reactor
electrodes used
microelectronic workpiece
tuning electrodes
electrochemically processing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001259504A
Other languages
English (en)
Inventor
Paul R. Mchugh
Thomas L. Ritzdorf
Robert A. Weaver
Gregory J. Wilson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Semitool Inc
Original Assignee
Semitool Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semitool Inc filed Critical Semitool Inc
Publication of AU2001259504A1 publication Critical patent/AU2001259504A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/52—Controlling or regulating the coating process
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/54—Controlling or regulating the coating process
    • C23C14/542—Controlling the film thickness or evaporation rate
    • C23C14/545—Controlling the film thickness or evaporation rate using measurement on deposited material
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C25D7/123—Semiconductors first coated with a seed layer or a conductive layer
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/37—Measurements
    • G05B2219/37576—Post-process, measure worpiece after machining, use results for new or same
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/45—Nc applications
    • G05B2219/45031—Manufacturing semiconductor wafers

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Electrochemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Automation & Control Theory (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Drying Of Semiconductors (AREA)
AU2001259504A 2000-05-24 2001-05-04 Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece Abandoned AU2001259504A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US20666300P 2000-05-24 2000-05-24
US60/206,663 2000-05-24
PCT/US2001/014509 WO2001090434A2 (fr) 2000-05-24 2001-05-04 Reglage d'electrodes utilisees dans un reacteur pour le traitement electrochimique d'une piece micro-electronique

Publications (1)

Publication Number Publication Date
AU2001259504A1 true AU2001259504A1 (en) 2001-12-03

Family

ID=22767392

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001259504A Abandoned AU2001259504A1 (en) 2000-05-24 2001-05-04 Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece

Country Status (3)

Country Link
US (1) US20050084987A1 (fr)
AU (1) AU2001259504A1 (fr)
WO (1) WO2001090434A2 (fr)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6749391B2 (en) 1996-07-15 2004-06-15 Semitool, Inc. Microelectronic workpiece transfer devices and methods of using such devices in the processing of microelectronic workpieces
US6749390B2 (en) 1997-12-15 2004-06-15 Semitool, Inc. Integrated tools with transfer devices for handling microelectronic workpieces
US6752584B2 (en) 1996-07-15 2004-06-22 Semitool, Inc. Transfer devices for handling microelectronic workpieces within an environment of a processing machine and methods of manufacturing and using such devices in the processing of microelectronic workpieces
US6623609B2 (en) 1999-07-12 2003-09-23 Semitool, Inc. Lift and rotate assembly for use in a workpiece processing station and a method of attaching the same
US6842659B2 (en) * 2001-08-24 2005-01-11 Applied Materials Inc. Method and apparatus for providing intra-tool monitoring and control
US6893505B2 (en) 2002-05-08 2005-05-17 Semitool, Inc. Apparatus and method for regulating fluid flows, such as flows of electrochemical processing fluids
US7131076B2 (en) * 2002-08-21 2006-10-31 Synopsys Inc. Method of interactive visualization and parameter selection for engineering design
JP2005051210A (ja) * 2003-07-15 2005-02-24 Matsushita Electric Ind Co Ltd 面内分布データの圧縮法、面内分布の測定方法、面内分布の最適化方法、プロセス装置の管理方法及びプロセス管理方法
US7935240B2 (en) * 2005-05-25 2011-05-03 Applied Materials, Inc. Electroplating apparatus and method based on an array of anodes
US7655126B2 (en) * 2006-03-27 2010-02-02 Federal Mogul World Wide, Inc. Fabrication of topical stopper on MLS gasket by active matrix electrochemical deposition
US8666703B2 (en) * 2010-07-22 2014-03-04 Tokyo Electron Limited Method for automated determination of an optimally parameterized scatterometry model
US9588441B2 (en) * 2012-05-18 2017-03-07 Kla-Tencor Corporation Method and device for using substrate geometry to determine optimum substrate analysis sampling
JP2016051736A (ja) * 2014-08-28 2016-04-11 株式会社東芝 半導体製造装置、半導体製造システムおよび半導体製造方法
US9933337B2 (en) 2014-09-12 2018-04-03 Hendrikson USA, L.L.C. Wheel end sensor for heavy-duty vehicles
FR3074906B1 (fr) 2017-12-07 2024-01-19 Saint Gobain Procede et dispositif de determination automatique de valeurs d'ajustement de parametres de fonctionnement d'une ligne de depot
CN112752865A (zh) 2018-09-28 2021-05-04 唯亚威通讯技术有限公司 使用正向参数校正和增强的逆向工程的涂布控制
CN114752986B (zh) * 2022-03-15 2024-01-05 深南电路股份有限公司 一种电镀工具的参数调整方法及电镀方法
DE102022130987A1 (de) 2022-11-23 2024-05-23 Aixtron Se Verfahren zum Einrichten eines CVD-Reaktors
CN116770395B (zh) * 2023-08-22 2023-10-20 深圳市互成自动化设备有限公司 一种电泳喷粉涂装质量监测方法及系统

Family Cites Families (100)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1526644A (en) * 1922-10-25 1925-02-17 Williams Brothers Mfg Company Process of electroplating and apparatus therefor
US3309263A (en) * 1964-12-03 1967-03-14 Kimberly Clark Co Web pickup and transfer for a papermaking machine
US3716462A (en) * 1970-10-05 1973-02-13 D Jensen Copper plating on zinc and its alloys
US3798033A (en) * 1971-05-11 1974-03-19 Spectral Data Corp Isoluminous additive color multispectral display
US3930963A (en) * 1971-07-29 1976-01-06 Photocircuits Division Of Kollmorgen Corporation Method for the production of radiant energy imaged printed circuit boards
DE2244434C3 (de) * 1972-09-06 1982-02-25 Schering Ag, 1000 Berlin Und 4619 Bergkamen Wäßriges Bad zur galvanischen Abscheidung von Gold und Goldlegierungen
US3880725A (en) * 1974-04-10 1975-04-29 Rca Corp Predetermined thickness profiles through electroplating
US4001094A (en) * 1974-09-19 1977-01-04 Jumer John F Method for incremental electro-processing of large areas
US4072557A (en) * 1974-12-23 1978-02-07 J. M. Voith Gmbh Method and apparatus for shrinking a travelling web of fibrous material
US4137867A (en) * 1977-09-12 1979-02-06 Seiichiro Aigo Apparatus for bump-plating semiconductor wafers
US4134802A (en) * 1977-10-03 1979-01-16 Oxy Metal Industries Corporation Electrolyte and method for electrodepositing bright metal deposits
US4246088A (en) * 1979-01-24 1981-01-20 Metal Box Limited Method and apparatus for electrolytic treatment of containers
SU921124A1 (ru) * 1979-06-19 1982-04-15 Институт Физико-Химических Основ Переработки Минерального Сырья Со Ан Ссср Способ металлизации отверстий печатных плат
US4259166A (en) * 1980-03-31 1981-03-31 Rca Corporation Shield for plating substrate
US4437943A (en) * 1980-07-09 1984-03-20 Olin Corporation Method and apparatus for bonding metal wire to a base metal substrate
DE3171220D1 (en) * 1980-09-02 1985-08-08 Heraeus Schott Quarzschmelze Method of and apparatus for transferring semiconductor wafers between carrier members
US4323433A (en) * 1980-09-22 1982-04-06 The Boeing Company Anodizing process employing adjustable shield for suspended cathode
US4443117A (en) * 1980-09-26 1984-04-17 Terumo Corporation Measuring apparatus, method of manufacture thereof, and method of writing data into same
JPS57198315U (fr) * 1981-06-12 1982-12-16
JPS584382A (ja) * 1981-06-26 1983-01-11 ファナック株式会社 工業用ロボツトの制御方式
US4378283A (en) * 1981-07-30 1983-03-29 National Semiconductor Corporation Consumable-anode selective plating apparatus
JPS58149189A (ja) * 1982-03-01 1983-09-05 セイコーインスツルメンツ株式会社 工業用ロボツトの旋回昇降機構
US4440597A (en) * 1982-03-15 1984-04-03 The Procter & Gamble Company Wet-microcontracted paper and concomitant process
US4585539A (en) * 1982-08-17 1986-04-29 Technic, Inc. Electrolytic reactor
US4500394A (en) * 1984-05-16 1985-02-19 At&T Technologies, Inc. Contacting a surface for plating thereon
US4634503A (en) * 1984-06-27 1987-01-06 Daniel Nogavich Immersion electroplating system
US4639028A (en) * 1984-11-13 1987-01-27 Economic Development Corporation High temperature and acid resistant wafer pick up device
US4576685A (en) * 1985-04-23 1986-03-18 Schering Ag Process and apparatus for plating onto articles
US4648944A (en) * 1985-07-18 1987-03-10 Martin Marietta Corporation Apparatus and method for controlling plating induced stress in electroforming and electroplating processes
JPH088723B2 (ja) * 1985-11-02 1996-01-29 日立機電工業株式会社 リニアモ−タを用いた搬送装置
BR8607061A (pt) * 1985-12-24 1988-02-23 Gould Inc Processo e aparelho para eletrogalvanizacao de folha de cobre
US4814197A (en) * 1986-10-31 1989-03-21 Kollmorgen Corporation Control of electroless plating baths
JPH0768639B2 (ja) * 1986-12-10 1995-07-26 トヨタ自動車株式会社 電着塗装方法
JPH0815582B2 (ja) * 1987-02-28 1996-02-21 本田技研工業株式会社 車体の表面処理方法
JP2624703B2 (ja) * 1987-09-24 1997-06-25 株式会社東芝 バンプの形成方法及びその装置
DE3735449A1 (de) * 1987-10-20 1989-05-03 Convac Gmbh Fertigungssystem fuer halbleitersubstrate
US4902398A (en) * 1988-04-27 1990-02-20 American Thim Film Laboratories, Inc. Computer program for vacuum coating systems
US5235995A (en) * 1989-03-27 1993-08-17 Semitool, Inc. Semiconductor processor apparatus with dynamic wafer vapor treatment and particulate volatilization
US4988533A (en) * 1988-05-27 1991-01-29 Texas Instruments Incorporated Method for deposition of silicon oxide on a wafer
DE3818757A1 (de) * 1988-05-31 1989-12-07 Mannesmann Ag Portal eines industrieroboters
US4913035A (en) * 1989-08-16 1990-04-03 Duh Gabri C B Apparatus for mist prevention in car windshields
JPH03125453A (ja) * 1989-10-09 1991-05-28 Toshiba Corp 半導体ウエハ移送装置
US5000827A (en) * 1990-01-02 1991-03-19 Motorola, Inc. Method and apparatus for adjusting plating solution flow characteristics at substrate cathode periphery to minimize edge effect
US5186594A (en) * 1990-04-19 1993-02-16 Applied Materials, Inc. Dual cassette load lock
US5370741A (en) * 1990-05-15 1994-12-06 Semitool, Inc. Dynamic semiconductor wafer processing using homogeneous chemical vapors
KR0153250B1 (ko) * 1990-06-28 1998-12-01 카자마 겐쥬 종형 열처리 장치
US5368711A (en) * 1990-08-01 1994-11-29 Poris; Jaime Selective metal electrodeposition process and apparatus
US5078852A (en) * 1990-10-12 1992-01-07 Microelectronics And Computer Technology Corporation Plating rack
US5096550A (en) * 1990-10-15 1992-03-17 The United States Of America As Represented By The United States Department Of Energy Method and apparatus for spatially uniform electropolishing and electrolytic etching
DE69220519T2 (de) * 1991-03-04 1998-02-19 Toda Kogyo Corp Verfahren zur Plattierung eines Verbundmagneten sowie Verbundmagnet mit einem Metallüberzug
EP1120817B8 (fr) * 1991-03-26 2007-10-10 Ngk Insulators, Ltd. Utilisation d'une porte substrat résistant à la corrosion
US5178512A (en) * 1991-04-01 1993-01-12 Equipe Technologies Precision robot apparatus
US5399564A (en) * 1991-09-03 1995-03-21 Dowelanco N-(4-pyridyl or 4-quinolinyl) arylacetamide and 4-(aralkoxy or aralkylamino) pyridine pesticides
US5301700A (en) * 1992-03-05 1994-04-12 Tokyo Electron Limited Washing system
US5501768A (en) * 1992-04-17 1996-03-26 Kimberly-Clark Corporation Method of treating papermaking fibers for making tissue
EP0582019B1 (fr) * 1992-08-04 1995-10-18 International Business Machines Corporation Architectures de ligne de fabrication basées sur des convoyeurs totalement automatisés et informatisés et adaptées à des récipients portatifs étanches sous pression
US5368715A (en) * 1993-02-23 1994-11-29 Enthone-Omi, Inc. Method and system for controlling plating bath parameters
US5489341A (en) * 1993-08-23 1996-02-06 Semitool, Inc. Semiconductor processing with non-jetting fluid stream discharge array
US5391517A (en) * 1993-09-13 1995-02-21 Motorola Inc. Process for forming copper interconnect structure
ATE163453T1 (de) * 1993-11-16 1998-03-15 Scapa Group Plc Papiermaschinenbespannung
US5391285A (en) * 1994-02-25 1995-02-21 Motorola, Inc. Adjustable plating cell for uniform bump plating of semiconductor wafers
DE9404771U1 (de) * 1994-03-21 1994-06-30 Helmut Lehmer GmbH Stahl- und Maschinenbau, 92436 Bruck Verriegelungsvorrichtung
JPH07283077A (ja) * 1994-04-11 1995-10-27 Ngk Spark Plug Co Ltd 薄膜コンデンサ
US5405518A (en) * 1994-04-26 1995-04-11 Industrial Technology Research Institute Workpiece holder apparatus
JP3621151B2 (ja) * 1994-06-02 2005-02-16 株式会社半導体エネルギー研究所 半導体装置の作製方法
US5512319A (en) * 1994-08-22 1996-04-30 Basf Corporation Polyurethane foam composite
JP3143770B2 (ja) * 1994-10-07 2001-03-07 東京エレクトロン株式会社 基板搬送装置
US5593545A (en) * 1995-02-06 1997-01-14 Kimberly-Clark Corporation Method for making uncreped throughdried tissue products without an open draw
US5807469A (en) * 1995-09-27 1998-09-15 Intel Corporation Flexible continuous cathode contact circuit for electrolytic plating of C4, tab microbumps, and ultra large scale interconnects
KR0182006B1 (ko) * 1995-11-10 1999-04-15 김광호 반도체 패키지 장치 및 몰딩물질에 의해 발생하는 기생용량의 산출방법
US5597460A (en) * 1995-11-13 1997-01-28 Reynolds Tech Fabricators, Inc. Plating cell having laminar flow sparger
US5620581A (en) * 1995-11-29 1997-04-15 Aiwa Research And Development, Inc. Apparatus for electroplating metal films including a cathode ring, insulator ring and thief ring
JPH09157846A (ja) * 1995-12-01 1997-06-17 Teisan Kk 温度調節装置
US6709562B1 (en) * 1995-12-29 2004-03-23 International Business Machines Corporation Method of making electroplated interconnection structures on integrated circuit chips
US5871805A (en) * 1996-04-08 1999-02-16 Lemelson; Jerome Computer controlled vapor deposition processes
US5731678A (en) * 1996-07-15 1998-03-24 Semitool, Inc. Processing head for semiconductor processing machines
US6168695B1 (en) * 1999-07-12 2001-01-02 Daniel J. Woodruff Lift and rotate assembly for use in a workpiece processing station and a method of attaching the same
AUPO473297A0 (en) * 1997-01-22 1997-02-20 Industrial Automation Services Pty Ltd Coating thickness control
US6174425B1 (en) * 1997-05-14 2001-01-16 Motorola, Inc. Process for depositing a layer of material over a substrate
US6221230B1 (en) * 1997-05-15 2001-04-24 Hiromitsu Takeuchi Plating method and apparatus
US6053687A (en) * 1997-09-05 2000-04-25 Applied Materials, Inc. Cost effective modular-linear wafer processing
US6161054A (en) * 1997-09-22 2000-12-12 On-Line Technologies, Inc. Cell control method and apparatus
US6921468B2 (en) * 1997-09-30 2005-07-26 Semitool, Inc. Electroplating system having auxiliary electrode exterior to main reactor chamber for contact cleaning operations
US5882498A (en) * 1997-10-16 1999-03-16 Advanced Micro Devices, Inc. Method for reducing oxidation of electroplating chamber contacts and improving uniform electroplating of a substrate
US6159354A (en) * 1997-11-13 2000-12-12 Novellus Systems, Inc. Electric potential shaping method for electroplating
US6179983B1 (en) * 1997-11-13 2001-01-30 Novellus Systems, Inc. Method and apparatus for treating surface including virtual anode
US6027631A (en) * 1997-11-13 2000-02-22 Novellus Systems, Inc. Electroplating system with shields for varying thickness profile of deposited layer
US6168693B1 (en) * 1998-01-22 2001-01-02 International Business Machines Corporation Apparatus for controlling the uniformity of an electroplated workpiece
JP3501937B2 (ja) * 1998-01-30 2004-03-02 富士通株式会社 半導体装置の製造方法
CA2320278C (fr) * 1998-02-12 2006-01-03 Acm Research, Inc. Appareil et procede d'electrodeposition
US6151532A (en) * 1998-03-03 2000-11-21 Lam Research Corporation Method and apparatus for predicting plasma-process surface profiles
US6565729B2 (en) * 1998-03-20 2003-05-20 Semitool, Inc. Method for electrochemically depositing metal on a semiconductor workpiece
US6303010B1 (en) * 1999-07-12 2001-10-16 Semitool, Inc. Methods and apparatus for processing the surface of a microelectronic workpiece
US6017820A (en) * 1998-07-17 2000-01-25 Cutek Research, Inc. Integrated vacuum and plating cluster system
DE19840109A1 (de) * 1998-09-03 2000-03-09 Agfa Gevaert Ag Farbfotografisches Silberhalogenidmaterial
US6110345A (en) * 1998-11-24 2000-08-29 Advanced Micro Devices, Inc. Method and system for plating workpieces
CN1217034C (zh) * 1999-04-13 2005-08-31 塞米用具公司 具有改进的处理流体流的处理腔的工件处理装置
US20030038035A1 (en) * 2001-05-30 2003-02-27 Wilson Gregory J. Methods and systems for controlling current in electrochemical processing of microelectronic workpieces
US7020537B2 (en) * 1999-04-13 2006-03-28 Semitool, Inc. Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
US6521112B1 (en) * 1999-07-13 2003-02-18 Dj Parker Company, Inc. Paced chemical replenishment system

Also Published As

Publication number Publication date
WO2001090434A3 (fr) 2005-06-16
WO2001090434A2 (fr) 2001-11-29
US20050084987A1 (en) 2005-04-21

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