AU7609500A - Solder-bearing wafer for use in soldering operations - Google Patents

Solder-bearing wafer for use in soldering operations

Info

Publication number
AU7609500A
AU7609500A AU76095/00A AU7609500A AU7609500A AU 7609500 A AU7609500 A AU 7609500A AU 76095/00 A AU76095/00 A AU 76095/00A AU 7609500 A AU7609500 A AU 7609500A AU 7609500 A AU7609500 A AU 7609500A
Authority
AU
Australia
Prior art keywords
solder
soldering operations
bearing wafer
wafer
bearing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU76095/00A
Inventor
Joseph S. Cachina
James R. Zanolli
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NAS Interplex Industries Inc
Original Assignee
NAS Interplex Industries Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NAS Interplex Industries Inc filed Critical NAS Interplex Industries Inc
Publication of AU7609500A publication Critical patent/AU7609500A/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
    • H01R43/0263—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections for positioning or holding parts during soldering or welding process
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08—Auxiliary devices therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
    • H01R43/0235—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections for applying solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09036—Recesses or grooves in insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10189—Non-printed connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10378—Interposers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10424—Frame holders
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0338—Transferring metal or conductive material other than a circuit pattern, e.g. bump, solder, printed component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/0415—Small preforms other than balls, e.g. discs, cylinders or pillars
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3405—Edge mounted components, e.g. terminals

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
AU76095/00A 1999-09-20 2000-09-20 Solder-bearing wafer for use in soldering operations Abandoned AU7609500A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US15477199P 1999-09-20 1999-09-20
US60154771 1999-09-20
PCT/US2000/026160 WO2001022785A1 (en) 1999-09-20 2000-09-20 Solder-bearing wafer for use in soldering operations

Publications (1)

Publication Number Publication Date
AU7609500A true AU7609500A (en) 2001-04-24

Family

ID=22552709

Family Applications (1)

Application Number Title Priority Date Filing Date
AU76095/00A Abandoned AU7609500A (en) 1999-09-20 2000-09-20 Solder-bearing wafer for use in soldering operations

Country Status (5)

Country Link
CN (2) CN1203733C (en)
AU (1) AU7609500A (en)
DE (2) DE10084996B8 (en)
GB (1) GB2372154B (en)
WO (1) WO2001022785A1 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10084996B8 (en) * 1999-09-20 2009-01-29 Nas Interplex Industries Inc. Solder-carrying body for use in soldering operations
DE10229953A1 (en) * 2002-07-03 2004-01-29 Hartmann Codier Gmbh & Co.Kg Component for PCB assembly
CN101752705B (en) * 2008-11-28 2012-11-28 富士康(昆山)电脑接插件有限公司 Electric coupler
CN107538094B (en) * 2017-09-19 2018-08-14 南昌航空大学 A kind of precision resistance method for welding of stranded conductor and microfilament
CN111842015A (en) * 2019-04-28 2020-10-30 江苏长电科技股份有限公司 Printing apparatus and printing method
CN116851986B (en) * 2023-09-05 2023-11-21 微网优联科技(成都)有限公司 Efficient welding device and method for camera module and PCB

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4216350A (en) * 1978-11-01 1980-08-05 Burroughs Corporation Multiple solder pre-form with non-fusible web
US4884335A (en) * 1985-06-21 1989-12-05 Minnesota Mining And Manufacturing Company Surface mount compatible connector system with solder strip and mounting connector to PCB
US4641426A (en) * 1985-06-21 1987-02-10 Associated Enterprises, Inc. Surface mount compatible connector system with mechanical integrity
US4684055A (en) * 1985-09-09 1987-08-04 Harris Corporation Method of selectively soldering the underside of a substrate having leads
US5029748A (en) * 1987-07-10 1991-07-09 Amp Incorporated Solder preforms in a cast array
US4956913A (en) * 1988-05-11 1990-09-18 E. I. Du Pont De Nemours And Company Pin alignment method
US4807799A (en) * 1988-06-01 1989-02-28 Raychem Corporation Device for applying solder
US5046957A (en) * 1990-06-25 1991-09-10 Amp Incorporated Solder plate assembly and method
JP3387282B2 (en) * 1995-08-03 2003-03-17 日産自動車株式会社 Semiconductor device structure and method of manufacturing the same
US5875546A (en) * 1995-11-03 1999-03-02 North American Specialties Corporation Method of forming solder-holding clips for applying solder to connectors
US5875102A (en) * 1995-12-20 1999-02-23 Intel Corporation Eclipse via in pad structure
JP3385872B2 (en) * 1995-12-25 2003-03-10 三菱電機株式会社 Solder supply method and solder supply apparatus
US5796590A (en) * 1996-11-05 1998-08-18 Micron Electronics, Inc. Assembly aid for mounting packaged integrated circuit devices to printed circuit boards
US6119920A (en) * 1996-12-20 2000-09-19 Rf Monolithics, Inc. Method of forming an electronic package with a solder seal
JP3792358B2 (en) * 1997-07-30 2006-07-05 京セラ株式会社 Optical connection component and manufacturing method thereof
US6063647A (en) * 1997-12-08 2000-05-16 3M Innovative Properties Company Method for making circuit elements for a z-axis interconnect
DE10084996B8 (en) * 1999-09-20 2009-01-29 Nas Interplex Industries Inc. Solder-carrying body for use in soldering operations

Also Published As

Publication number Publication date
GB0205160D0 (en) 2002-04-17
DE10084996T1 (en) 2002-11-07
GB2372154B (en) 2003-09-24
WO2001022785A1 (en) 2001-03-29
CN1668168A (en) 2005-09-14
CN1390437A (en) 2003-01-08
WO2001022785A9 (en) 2002-11-28
CN1668168B (en) 2010-12-01
DE10084996B8 (en) 2009-01-29
GB2372154A (en) 2002-08-14
CN1203733C (en) 2005-05-25
DE10084996B4 (en) 2008-09-18

Similar Documents

Publication Publication Date Title
AU2459200A (en) Semiconductor device
AU3837200A (en) Semiconductor device
AU3957299A (en) Device for establishing reference plane
AU1648801A (en) Semiconductor device
AU3003900A (en) Indexing apparatus
GB0013206D0 (en) Parallel-gripping chuck
GB2386691B (en) Ratio tool
AU3285700A (en) Workbench
AU6483300A (en) Device for carrying objects
AU6070500A (en) Wafer container
AU2001241086A1 (en) Holder
AU3235100A (en) Prothease inhibitors
AU7609500A (en) Solder-bearing wafer for use in soldering operations
GB0010981D0 (en) Chuck
AU772996C (en) Antikink device for pipes
EP1049168A3 (en) Semiconductor device
AU6854400A (en) Semiconductor laser
AU1382601A (en) High-pressure tool
GB0011191D0 (en) Chuck
AU3821800A (en) Auxiliary device for serving
AU3961300A (en) Clamping chuck
AU6784800A (en) Wafer holder assembly
AU6422800A (en) Device in particular for lumbar extension
AU5548900A (en) Soldering flux
AU2113700A (en) Method for increasing the efficiency in trade

Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase