AU2001241086A1 - Holder - Google Patents

Holder

Info

Publication number
AU2001241086A1
AU2001241086A1 AU2001241086A AU4108601A AU2001241086A1 AU 2001241086 A1 AU2001241086 A1 AU 2001241086A1 AU 2001241086 A AU2001241086 A AU 2001241086A AU 4108601 A AU4108601 A AU 4108601A AU 2001241086 A1 AU2001241086 A1 AU 2001241086A1
Authority
AU
Australia
Prior art keywords
holder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001241086A
Inventor
Takeshi Ikegami
Shinichi Shimizu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Pneumatics/Fluidics System Co Ltd
Original Assignee
NIPPON PNEUMATICS FLUIDICS SYS
Nippon Pneumatics/Fluidics System Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NIPPON PNEUMATICS FLUIDICS SYS, Nippon Pneumatics/Fluidics System Co Ltd filed Critical NIPPON PNEUMATICS FLUIDICS SYS
Publication of AU2001241086A1 publication Critical patent/AU2001241086A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manipulator (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
AU2001241086A 2000-12-05 2001-03-12 Holder Abandoned AU2001241086A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2000-369433 2000-12-05
JP2000369433 2000-12-05
PCT/JP2001/001883 WO2002047155A1 (en) 2000-12-05 2001-03-12 Holder

Publications (1)

Publication Number Publication Date
AU2001241086A1 true AU2001241086A1 (en) 2002-06-18

Family

ID=18839472

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001241086A Abandoned AU2001241086A1 (en) 2000-12-05 2001-03-12 Holder

Country Status (3)

Country Link
JP (1) JP4766824B2 (en)
AU (1) AU2001241086A1 (en)
WO (1) WO2002047155A1 (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4495552B2 (en) * 2004-09-09 2010-07-07 萩原エンジニアリング株式会社 Transport device
JP2007214529A (en) * 2006-01-13 2007-08-23 Fluoro Mechanic Kk Bernoulli chuck
JP4723009B2 (en) * 2009-04-20 2011-07-13 中外炉工業株式会社 Suction pad device for workpiece
JP5553592B2 (en) * 2009-12-15 2014-07-16 日本空圧システム株式会社 Retainer
JP5697014B2 (en) * 2010-05-26 2015-04-08 日本空圧システム株式会社 Holding device
KR101293289B1 (en) * 2010-06-04 2013-08-09 김영태 Noncontact feed apparatus using vacuum pad
DE102012100825A1 (en) * 2011-12-01 2013-06-06 solar-semi GmbH Apparatus for processing a substrate and method therefor
EP2624291B1 (en) * 2012-02-01 2021-10-13 Obducat Europe GmbH Device for processing a substrate and method for this
JP5998086B2 (en) * 2012-04-03 2016-09-28 オイレス工業株式会社 Air plate for levitation
JP6075232B2 (en) * 2013-07-03 2017-02-08 トヨタ自動車株式会社 Cleaning device
JP6317106B2 (en) * 2013-12-27 2018-04-25 芝浦メカトロニクス株式会社 Substrate holding device and substrate holding method
TWI747225B (en) * 2019-04-15 2021-11-21 日商新川股份有限公司 Conveying device

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2609754A1 (en) * 1976-03-09 1977-09-22 Wacker Chemitronic BRACKET FOR BOTH-SIDED CONTACTLESS RECEIVING OF DISCS
JPS6351446U (en) * 1986-09-22 1988-04-07
JPH10167470A (en) * 1996-12-02 1998-06-23 Kiyoyuki Horii Non-contact holding method and its device

Also Published As

Publication number Publication date
JPWO2002047155A1 (en) 2004-04-08
WO2002047155A1 (en) 2002-06-13
JP4766824B2 (en) 2011-09-07

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